{"id":"https://openalex.org/W4321488876","doi":"https://doi.org/10.1109/rws55624.2023.10046338","title":"Chip-embedded Glass Interposer for 5G Applications","display_name":"Chip-embedded Glass Interposer for 5G Applications","publication_year":2023,"publication_date":"2023-01-22","ids":{"openalex":"https://openalex.org/W4321488876","doi":"https://doi.org/10.1109/rws55624.2023.10046338"},"language":"en","primary_location":{"id":"doi:10.1109/rws55624.2023.10046338","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws55624.2023.10046338","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100749621","display_name":"Xingchen Li","orcid":"https://orcid.org/0000-0002-2786-5392"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Xingchen Li","raw_affiliation_strings":["Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018494057","display_name":"Xiaofan Jia","orcid":"https://orcid.org/0000-0003-2720-5850"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaofan Jia","raw_affiliation_strings":["Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5009228618","display_name":"Kyoung\u2010sik Moon","orcid":"https://orcid.org/0000-0003-2165-0654"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kyoung-sik Moon","raw_affiliation_strings":["Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102076970","display_name":"Joon Woo Kim","orcid":"https://orcid.org/0000-0001-9849-6793"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Joon Woo Kim","raw_affiliation_strings":["Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021600252","display_name":"Aadit Pandey","orcid":null},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aadit Pandey","raw_affiliation_strings":["Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5056526528","display_name":"Anthony S.F. Chiu","orcid":"https://orcid.org/0000-0003-2411-7302"},"institutions":[{"id":"https://openalex.org/I4210126946","display_name":"Qorvo (United States)","ror":"https://ror.org/03amcs261","country_code":"US","type":"company","lineage":["https://openalex.org/I4210126946"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Anthony Chiu","raw_affiliation_strings":["Qorvo,Richardson,TX,USA","Qorvo, Richardson, TX, USA"],"affiliations":[{"raw_affiliation_string":"Qorvo,Richardson,TX,USA","institution_ids":["https://openalex.org/I4210126946"]},{"raw_affiliation_string":"Qorvo, Richardson, TX, USA","institution_ids":["https://openalex.org/I4210126946"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063900510","display_name":"Andrew Kenerson","orcid":null},"institutions":[{"id":"https://openalex.org/I4210126946","display_name":"Qorvo (United States)","ror":"https://ror.org/03amcs261","country_code":"US","type":"company","lineage":["https://openalex.org/I4210126946"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew Kenerson","raw_affiliation_strings":["Qorvo,Richardson,TX,USA","Qorvo, Richardson, TX, USA"],"affiliations":[{"raw_affiliation_string":"Qorvo,Richardson,TX,USA","institution_ids":["https://openalex.org/I4210126946"]},{"raw_affiliation_string":"Qorvo, Richardson, TX, USA","institution_ids":["https://openalex.org/I4210126946"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085554167","display_name":"Madhavan Swaminathan","orcid":"https://orcid.org/0000-0003-1729-2807"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Madhavan Swaminathan","raw_affiliation_strings":["Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"affiliations":[{"raw_affiliation_string":"Georgia Institute of Technology,3D Systems Packaging Research Center,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":8,"corresponding_author_ids":["https://openalex.org/A5100749621"],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":0.4016,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.57771684,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"129","last_page":"131"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.993399977684021,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.992900013923645,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.9794000387191772},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6319127082824707},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6074649095535278},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5568820834159851},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.539556622505188},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.44819796085357666},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.443794846534729},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4220253825187683},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4141651391983032},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20442640781402588},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.13492590188980103},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10240313410758972},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.06046760082244873}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.9794000387191772},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6319127082824707},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6074649095535278},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5568820834159851},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.539556622505188},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.44819796085357666},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.443794846534729},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4220253825187683},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4141651391983032},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20442640781402588},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13492590188980103},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10240313410758972},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.06046760082244873},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/rws55624.2023.10046338","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws55624.2023.10046338","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1554715168","https://openalex.org/W2887768370","https://openalex.org/W3011336332","https://openalex.org/W3019925929","https://openalex.org/W3048161398"],"related_works":["https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2789752821","https://openalex.org/W2205502757","https://openalex.org/W1480508001","https://openalex.org/W2235483886","https://openalex.org/W2097812662","https://openalex.org/W2528892790","https://openalex.org/W2117988687","https://openalex.org/W2018755015"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"the":[3,20,25,38,40,57],"implementation":[4],"of":[5],"a":[6,61],"chip-embedded":[7,42,58],"glass":[8,59],"interposer":[9,21,43,60],"targeting":[10],"5G":[11,29,66],"applications.":[12],"Two":[13],"approaches":[14],"for":[15,24,65],"low-loss":[16],"interconnect":[17],"design":[18],"on":[19,28],"are":[22],"demonstrated":[23],"first":[26],"time":[27],"bands":[30],"by":[31,37],"modeling,":[32],"fabrication,":[33],"and":[34,47],"measurements.":[35],"Enabled":[36],"interconnects,":[39],"fabricated":[41],"performs":[44],"low":[45],"loss":[46],"wideband":[48],"matching":[49],"over":[50],"40":[51],"GHz.":[52],"The":[53],"excellent":[54],"performance":[55],"proves":[56],"promising":[62],"package":[63],"solution":[64],"front-end":[67],"modules.":[68]},"counts_by_year":[{"year":2026,"cited_by_count":2},{"year":2025,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}