{"id":"https://openalex.org/W4321488925","doi":"https://doi.org/10.1109/rws55624.2023.10046317","title":"Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications","display_name":"Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications","publication_year":2023,"publication_date":"2023-01-22","ids":{"openalex":"https://openalex.org/W4321488925","doi":"https://doi.org/10.1109/rws55624.2023.10046317"},"language":"en","primary_location":{"id":"doi:10.1109/rws55624.2023.10046317","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws55624.2023.10046317","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100749621","display_name":"Xingchen Li","orcid":"https://orcid.org/0000-0002-2786-5392"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xingchen Li","raw_affiliation_strings":["School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018494057","display_name":"Xiaofan Jia","orcid":"https://orcid.org/0000-0003-2720-5850"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaofan Jia","raw_affiliation_strings":["School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5004254382","display_name":"Serhat Erdogan","orcid":"https://orcid.org/0000-0001-7241-4761"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Serhat Erdogan","raw_affiliation_strings":["School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085554167","display_name":"Madhavan Swaminathan","orcid":"https://orcid.org/0000-0003-1729-2807"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Madhavan Swaminathan","raw_affiliation_strings":["School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology,Atlanta,USA","institution_ids":["https://openalex.org/I130701444"]},{"raw_affiliation_string":"School of Electrical and Computer Engineering 3D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"98","last_page":"100"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9890000224113464,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.986299991607666,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/band-pass-filter","display_name":"Band-pass filter","score":0.8547434210777283},{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.7010643482208252},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.6230113506317139},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5297209620475769},{"id":"https://openalex.org/keywords/filter","display_name":"Filter (signal processing)","score":0.5295083522796631},{"id":"https://openalex.org/keywords/prototype-filter","display_name":"Prototype filter","score":0.5161963105201721},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5103966593742371},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4900611639022827},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.48705175518989563},{"id":"https://openalex.org/keywords/distributed-element-filter","display_name":"Distributed element filter","score":0.4827572703361511},{"id":"https://openalex.org/keywords/m-derived-filter","display_name":"m-derived filter","score":0.46457844972610474},{"id":"https://openalex.org/keywords/active-filter","display_name":"Active filter","score":0.4478434920310974},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.4449915289878845},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.4187777042388916},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3372698426246643},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2796888053417206},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.27753302454948425},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.22749951481819153},{"id":"https://openalex.org/keywords/low-pass-filter","display_name":"Low-pass filter","score":0.2095300257205963},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20330777764320374},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.06314945220947266},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.061769187450408936},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.05597224831581116}],"concepts":[{"id":"https://openalex.org/C147788027","wikidata":"https://www.wikidata.org/wiki/Q2718101","display_name":"Band-pass filter","level":2,"score":0.8547434210777283},{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.7010643482208252},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.6230113506317139},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5297209620475769},{"id":"https://openalex.org/C106131492","wikidata":"https://www.wikidata.org/wiki/Q3072260","display_name":"Filter (signal processing)","level":2,"score":0.5295083522796631},{"id":"https://openalex.org/C175742284","wikidata":"https://www.wikidata.org/wiki/Q1415537","display_name":"Prototype filter","level":4,"score":0.5161963105201721},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5103966593742371},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4900611639022827},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.48705175518989563},{"id":"https://openalex.org/C109767898","wikidata":"https://www.wikidata.org/wiki/Q5283150","display_name":"Distributed element filter","level":5,"score":0.4827572703361511},{"id":"https://openalex.org/C156930551","wikidata":"https://www.wikidata.org/wiki/Q17102852","display_name":"m-derived filter","level":4,"score":0.46457844972610474},{"id":"https://openalex.org/C85899133","wikidata":"https://www.wikidata.org/wiki/Q557211","display_name":"Active filter","level":3,"score":0.4478434920310974},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.4449915289878845},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.4187777042388916},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3372698426246643},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2796888053417206},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.27753302454948425},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.22749951481819153},{"id":"https://openalex.org/C44682112","wikidata":"https://www.wikidata.org/wiki/Q918242","display_name":"Low-pass filter","level":3,"score":0.2095300257205963},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20330777764320374},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.06314945220947266},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.061769187450408936},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.05597224831581116},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/rws55624.2023.10046317","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws55624.2023.10046317","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.7799999713897705}],"awards":[],"funders":[{"id":"https://openalex.org/F4320332180","display_name":"Defense Advanced Research Projects Agency","ror":"https://ror.org/02caytj08"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W2103309119","https://openalex.org/W2129622284","https://openalex.org/W2154614578","https://openalex.org/W2161800638","https://openalex.org/W2163243488","https://openalex.org/W2242562551","https://openalex.org/W2265647238","https://openalex.org/W2762461209","https://openalex.org/W2801171232","https://openalex.org/W2887126542","https://openalex.org/W2887768370","https://openalex.org/W3048118817","https://openalex.org/W3190905793","https://openalex.org/W4210416122","https://openalex.org/W4285103108","https://openalex.org/W4299689903"],"related_works":["https://openalex.org/W2609024620","https://openalex.org/W2090124551","https://openalex.org/W2988227767","https://openalex.org/W2150714587","https://openalex.org/W4321636465","https://openalex.org/W2065462772","https://openalex.org/W2512185976","https://openalex.org/W2543249726","https://openalex.org/W4255376167","https://openalex.org/W2107874118"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"design,":[3],"fabrication":[4],"and":[5,18,23,40,54],"measurement":[6],"of":[7,82],"bandpass":[8],"filter":[9,14,59,70],"on":[10],"glass":[11],"interposer.":[12],"The":[13,58],"applies":[15],"separated":[16],"electric":[17,53],"magnetic":[19,55],"coupling":[20,25,56],"paths":[21],"(SEMCP)":[22],"source-load":[24],"techniques":[26],"to":[27],"achieve":[28],"four":[29],"transmission":[30],"zeros":[31],"(TZs),":[32],"with":[33,79],"two":[34,41],"located":[35,42],"at":[36,43,76],"the":[37,44,69],"lower":[38],"band":[39],"upper":[45],"band.":[46],"Generated":[47],"TZs":[48],"are":[49],"tuneable":[50],"by":[51],"changing":[52],"strengths.":[57],"is":[60],"fabricated":[61],"utilizing":[62],"Semi-additive":[63],"Patterning":[64],"(SAP)":[65],"process.":[66],"Measurement":[67],"shows":[68],"has":[71],"6.5%":[72],"fractional":[73],"bandwidth":[74],"centered":[75],"140":[77],"GHz":[78],"insertion":[80],"loss":[81],"1.19":[83],"dB.":[84]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}