{"id":"https://openalex.org/W3013924938","doi":"https://doi.org/10.1109/rws45077.2020.9050057","title":"Advanced Thermal Modeling of IC \u2013 Package Interaction","display_name":"Advanced Thermal Modeling of IC \u2013 Package Interaction","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W3013924938","doi":"https://doi.org/10.1109/rws45077.2020.9050057","mag":"3013924938"},"language":"en","primary_location":{"id":"doi:10.1109/rws45077.2020.9050057","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws45077.2020.9050057","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019656917","display_name":"Zhibo Cao","orcid":"https://orcid.org/0000-0001-7776-9617"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Leibniz Institute for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Zhibo Cao","raw_affiliation_strings":["IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084938440","display_name":"Matteo Stocchi","orcid":"https://orcid.org/0000-0002-6027-6012"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Leibniz Institute for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Matteo Stocchi","raw_affiliation_strings":["IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011390917","display_name":"Matthias Wietstruck","orcid":"https://orcid.org/0000-0002-7876-4129"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Leibniz Institute for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Matthias Wietstruck","raw_affiliation_strings":["IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032697902","display_name":"Federico Garbuglia","orcid":"https://orcid.org/0000-0002-1917-1921"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Leibniz Institute for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Federico Garbuglia","raw_affiliation_strings":["IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042783530","display_name":"Diego Pincini","orcid":null},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Leibniz Institute for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Diego Pincini","raw_affiliation_strings":["IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016289100","display_name":"Mehmet Kaynak","orcid":"https://orcid.org/0000-0001-9571-9904"},"institutions":[{"id":"https://openalex.org/I92894754","display_name":"Leibniz Institute for High Performance Microelectronics","ror":"https://ror.org/0489gab80","country_code":"DE","type":"facility","lineage":["https://openalex.org/I315704651","https://openalex.org/I92894754"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Mehmet Kaynak","raw_affiliation_strings":["IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"IHP - Leibniz-Institut f\u00fcr innovative Mikroelektronik, Frankfurt (Oder), Germany","institution_ids":["https://openalex.org/I92894754"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I92894754"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.02428149,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"9686","issue":null,"first_page":"326","last_page":"329"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/resistor","display_name":"Resistor","score":0.6940157413482666},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6915180683135986},{"id":"https://openalex.org/keywords/junction-temperature","display_name":"Junction temperature","score":0.6381731033325195},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5518848299980164},{"id":"https://openalex.org/keywords/tracing","display_name":"Tracing","score":0.5292467474937439},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4976227581501007},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4339156448841095},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42538982629776},{"id":"https://openalex.org/keywords/diode","display_name":"Diode","score":0.4175463318824768},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3980281949043274},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3061041533946991},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23302817344665527},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.20854151248931885},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.11361807584762573},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.10156366229057312}],"concepts":[{"id":"https://openalex.org/C137488568","wikidata":"https://www.wikidata.org/wiki/Q5321","display_name":"Resistor","level":3,"score":0.6940157413482666},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6915180683135986},{"id":"https://openalex.org/C167781694","wikidata":"https://www.wikidata.org/wiki/Q6311800","display_name":"Junction temperature","level":3,"score":0.6381731033325195},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5518848299980164},{"id":"https://openalex.org/C138673069","wikidata":"https://www.wikidata.org/wiki/Q322229","display_name":"Tracing","level":2,"score":0.5292467474937439},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4976227581501007},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4339156448841095},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42538982629776},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.4175463318824768},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3980281949043274},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3061041533946991},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23302817344665527},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.20854151248931885},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.11361807584762573},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.10156366229057312},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/rws45077.2020.9050057","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws45077.2020.9050057","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},{"id":"pmh:oai:research.sabanciuniv.edu:46510","is_oa":false,"landing_page_url":"https://research.sabanciuniv.edu/id/eprint/46510/","pdf_url":null,"source":{"id":"https://openalex.org/S4306402254","display_name":"Sabanci University","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I134235054","host_organization_name":"Sabanc\u0131 \u00dcniversitesi","host_organization_lineage":["https://openalex.org/I134235054"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"PeerReviewed"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.75,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1520308067","https://openalex.org/W1990759930","https://openalex.org/W2138529436","https://openalex.org/W2417730390","https://openalex.org/W2533600697","https://openalex.org/W2554473071","https://openalex.org/W2794170320","https://openalex.org/W2922138317","https://openalex.org/W6728390818"],"related_works":["https://openalex.org/W3200817179","https://openalex.org/W1960166976","https://openalex.org/W2380067098","https://openalex.org/W1992708211","https://openalex.org/W1548152478","https://openalex.org/W2137172615","https://openalex.org/W2112564789","https://openalex.org/W2106247205","https://openalex.org/W2039167336","https://openalex.org/W4295037241"],"abstract_inverted_index":{"A":[0,17],"layout":[1,57],"based":[2,58],"finite":[3],"element":[4],"thermal":[5,27,35,40],"convection":[6],"model":[7,41,62,69],"including":[8],"detailed":[9],"board":[10],"tracing":[11],"and":[12,26],"packaging":[13],"information":[14],"is":[15],"developed.":[16],"state-of-art":[18],"0.13-\u00b5m":[19],"SiGe":[20],"BiCMOS":[21],"chip":[22],"with":[23],"embedded":[24],"poly-resistors":[25],"diodes":[28],"are":[29],"used":[30],"as":[31],"experimental":[32,53],"validations":[33],"of":[34,46,61,78],"modelling":[36,77],"results.":[37,54],"The":[38],"designated":[39],"demonstrates":[42],"a":[43],"high":[44],"accuracy":[45],"less":[47],"than":[48],"1.5":[49],"Celsius":[50],"deviation":[51],"from":[52],"And":[55],"the":[56,74],"automatic":[59],"generation":[60],"geometry":[63],"drastically":[64],"reduces":[65],"time":[66],"consumption":[67],"during":[68],"development":[70],"and,":[71],"moreover,":[72],"paves":[73],"way":[75],"for":[76],"packages":[79],"which":[80],"possess":[81],"even":[82],"higher":[83],"complexities.":[84]},"counts_by_year":[],"updated_date":"2026-07-02T09:51:11.867554","created_date":"2025-10-10T00:00:00"}