{"id":"https://openalex.org/W2597902489","doi":"https://doi.org/10.1109/rws.2017.7885961","title":"Low-loss RF filter through a combination of additive manufacturing and thin-film process","display_name":"Low-loss RF filter through a combination of additive manufacturing and thin-film process","publication_year":2017,"publication_date":"2017-01-01","ids":{"openalex":"https://openalex.org/W2597902489","doi":"https://doi.org/10.1109/rws.2017.7885961","mag":"2597902489"},"language":"en","primary_location":{"id":"doi:10.1109/rws.2017.7885961","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws.2017.7885961","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113802682","display_name":"Leonardo Hernandez","orcid":null},"institutions":[{"id":"https://openalex.org/I103635307","display_name":"University of California, Riverside","ror":"https://ror.org/03nawhv43","country_code":"US","type":"education","lineage":["https://openalex.org/I103635307"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Leonardo Hernandez","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of California Riverside, Riverside, CA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of California Riverside, Riverside, CA","institution_ids":["https://openalex.org/I103635307"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5010206317","display_name":"Yuxiao He","orcid":"https://orcid.org/0000-0002-4469-6965"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuxiao He","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085343392","display_name":"Amanpreet Kaur","orcid":"https://orcid.org/0000-0001-9012-5509"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Amanpreet Kaur","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031725175","display_name":"John Papapolymerou","orcid":"https://orcid.org/0000-0002-1429-0921"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Papapolymerou","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044616046","display_name":"Premjeet Chahal","orcid":"https://orcid.org/0000-0002-8895-4516"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Premjeet Chahal","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Michigan State University, E. Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"114","last_page":"116"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9916999936103821,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9846000075340271,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9807000160217285,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7544087171554565},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6968072056770325},{"id":"https://openalex.org/keywords/filter","display_name":"Filter (signal processing)","score":0.681484580039978},{"id":"https://openalex.org/keywords/ground-plane","display_name":"Ground plane","score":0.6399914026260376},{"id":"https://openalex.org/keywords/cutoff-frequency","display_name":"Cutoff frequency","score":0.6237809062004089},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5793283581733704},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.5771453380584717},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5130738019943237},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.4695497155189514},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.46568742394447327},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.441245973110199},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.4069811999797821},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.37375128269195557},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2566729784011841},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19595807790756226},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.17565041780471802},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12382543087005615},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0759243369102478}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7544087171554565},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6968072056770325},{"id":"https://openalex.org/C106131492","wikidata":"https://www.wikidata.org/wiki/Q3072260","display_name":"Filter (signal processing)","level":2,"score":0.681484580039978},{"id":"https://openalex.org/C88764893","wikidata":"https://www.wikidata.org/wiki/Q1547722","display_name":"Ground plane","level":3,"score":0.6399914026260376},{"id":"https://openalex.org/C6142545","wikidata":"https://www.wikidata.org/wiki/Q1455881","display_name":"Cutoff frequency","level":2,"score":0.6237809062004089},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5793283581733704},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.5771453380584717},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5130738019943237},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.4695497155189514},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.46568742394447327},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.441245973110199},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.4069811999797821},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.37375128269195557},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2566729784011841},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19595807790756226},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.17565041780471802},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12382543087005615},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0759243369102478},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/rws.2017.7885961","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws.2017.7885961","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1547910644","https://openalex.org/W1978560011","https://openalex.org/W2017545194","https://openalex.org/W2050211060","https://openalex.org/W2086671075","https://openalex.org/W2103204389","https://openalex.org/W2117032615","https://openalex.org/W2903136240","https://openalex.org/W6663098419"],"related_works":["https://openalex.org/W2082914599","https://openalex.org/W2756570351","https://openalex.org/W2606427896","https://openalex.org/W2007805353","https://openalex.org/W2132500134","https://openalex.org/W2387433897","https://openalex.org/W2008392873","https://openalex.org/W2100589902","https://openalex.org/W2034830227","https://openalex.org/W1491248531"],"abstract_inverted_index":{"Combination":[0],"of":[1,25,62,95,111,120],"thin-film":[2,115],"process":[3],"and":[4,41,86,99,114],"3D":[5,49,112],"printing":[6,113],"is":[7,30,43],"utilized":[8],"to":[9,59,128],"demonstrate":[10],"a":[11,22,33,46,54,63,66,81,92,109],"low-loss":[12],"maximally":[13],"flat":[14],"five":[15],"element":[16],"stepped":[17],"impedance":[18],"low-pass":[19],"filter":[20,29,64],"with":[21,37],"cutoff":[23],"frequency":[24,93],"3":[26],"GHz.":[27,97],"The":[28],"patterned":[31],"on":[32,45,65],"thin":[34,67],"LCP":[35],"substrate":[36],"no":[38],"ground":[39,74],"plane":[40],"it":[42],"mounted":[44],"metal":[47],"coated":[48],"printed":[50],"plastic":[51],"cavity":[52],"using":[53,80,130],"Lego-like":[55],"process.":[56],"This":[57,105],"leads":[58],"the":[60,73,118],"formation":[61],"membrane":[68],"suspended":[69],"in":[70],"air":[71],"above":[72],"plane.":[75],"Simulations":[76],"were":[77],"carried":[78,89],"out":[79,90],"commercial":[82],"FEM":[83],"simulation":[84],"tool":[85],"measurements":[87],"are":[88],"over":[91],"range":[94],"0.1-8":[96],"Simulation":[98],"measured":[100],"results":[101],"match":[102],"very":[103],"closely.":[104],"paper":[106],"demonstrates":[107],"that":[108,124],"combination":[110],"processes":[116],"allows":[117],"fabrication":[119],"novel":[121],"RF":[122],"structure":[123],"would":[125],"be":[126],"difficult":[127],"realize":[129],"conventional":[131],"approaches.":[132]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}