{"id":"https://openalex.org/W2602040587","doi":"https://doi.org/10.1109/rws.2017.7885959","title":"3D stacked embedded component system-in-package for wearable electronic devices","display_name":"3D stacked embedded component system-in-package for wearable electronic devices","publication_year":2017,"publication_date":"2017-01-01","ids":{"openalex":"https://openalex.org/W2602040587","doi":"https://doi.org/10.1109/rws.2017.7885959","mag":"2602040587"},"language":"en","primary_location":{"id":"doi:10.1109/rws.2017.7885959","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws.2017.7885959","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009457486","display_name":"V. Nair","orcid":"https://orcid.org/0000-0001-8955-9422"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"V Nair","raw_affiliation_strings":["Intel Corporation, Chandler, Arizona, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Chandler, Arizona, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112142654","display_name":"L. Krishnamurthy","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"L. Krishnamurthy","raw_affiliation_strings":["Intel Corporation, Chandler, Arizona, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Chandler, Arizona, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052448447","display_name":"Johanna Swan","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"J. Swan","raw_affiliation_strings":["Intel Corporation, Chandler, Arizona, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Chandler, Arizona, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058761754","display_name":"A. Essaian","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"A. Essaian","raw_affiliation_strings":["Intel Corporation, Chandler, Arizona, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Chandler, Arizona, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054206542","display_name":"Torrey W. Frank","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"T. Frank","raw_affiliation_strings":["Intel Corporation, Chandler, Arizona, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Chandler, Arizona, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5033532296","display_name":"Michael Bynum","orcid":"https://orcid.org/0000-0002-6086-9352"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"M. Bynum","raw_affiliation_strings":["Intel Corporation, Chandler, Arizona, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Chandler, Arizona, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I1343180700"],"apc_list":null,"apc_paid":null,"fwci":0.7584,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.60149189,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"108","last_page":"110"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9860000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9860000014305115,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.7373770475387573},{"id":"https://openalex.org/keywords/small-form-factor","display_name":"Small form factor","score":0.6849587559700012},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.5950369238853455},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.567353367805481},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.5647952556610107},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5418821573257446},{"id":"https://openalex.org/keywords/wearable-technology","display_name":"Wearable technology","score":0.531071126461029},{"id":"https://openalex.org/keywords/chip-scale-package","display_name":"Chip-scale package","score":0.5124907493591309},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.48011159896850586},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4754975736141205},{"id":"https://openalex.org/keywords/wearable-computer","display_name":"Wearable computer","score":0.459727942943573},{"id":"https://openalex.org/keywords/surface-mount-technology","display_name":"Surface-mount technology","score":0.4531644880771637},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.42272594571113586},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.42228779196739197},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.42010048031806946},{"id":"https://openalex.org/keywords/package-on-package","display_name":"Package on package","score":0.416171133518219},{"id":"https://openalex.org/keywords/quad-flat-no-leads-package","display_name":"Quad Flat No-leads package","score":0.4133087992668152},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3968111574649811},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.35958725214004517},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.3567744493484497},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3558647334575653},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.31635361909866333},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2598195970058441},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.14002013206481934},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.10429683327674866},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.08438259363174438},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.07566437125205994}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.7373770475387573},{"id":"https://openalex.org/C2778080309","wikidata":"https://www.wikidata.org/wiki/Q99454494","display_name":"Small form factor","level":2,"score":0.6849587559700012},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.5950369238853455},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.567353367805481},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.5647952556610107},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5418821573257446},{"id":"https://openalex.org/C54290928","wikidata":"https://www.wikidata.org/wiki/Q4845080","display_name":"Wearable technology","level":3,"score":0.531071126461029},{"id":"https://openalex.org/C126233035","wikidata":"https://www.wikidata.org/wiki/Q5101572","display_name":"Chip-scale package","level":3,"score":0.5124907493591309},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.48011159896850586},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4754975736141205},{"id":"https://openalex.org/C150594956","wikidata":"https://www.wikidata.org/wiki/Q1334829","display_name":"Wearable computer","level":2,"score":0.459727942943573},{"id":"https://openalex.org/C2776584680","wikidata":"https://www.wikidata.org/wiki/Q191042","display_name":"Surface-mount technology","level":3,"score":0.4531644880771637},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.42272594571113586},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.42228779196739197},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.42010048031806946},{"id":"https://openalex.org/C184788189","wikidata":"https://www.wikidata.org/wiki/Q130652","display_name":"Package on package","level":4,"score":0.416171133518219},{"id":"https://openalex.org/C162877825","wikidata":"https://www.wikidata.org/wiki/Q2121809","display_name":"Quad Flat No-leads package","level":4,"score":0.4133087992668152},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3968111574649811},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.35958725214004517},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.3567744493484497},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3558647334575653},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.31635361909866333},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2598195970058441},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.14002013206481934},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.10429683327674866},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.08438259363174438},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.07566437125205994},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/rws.2017.7885959","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws.2017.7885959","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.6600000262260437}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1971131925","https://openalex.org/W2045553223","https://openalex.org/W2155343247","https://openalex.org/W4256423915"],"related_works":["https://openalex.org/W2539834997","https://openalex.org/W2002099348","https://openalex.org/W1997600377","https://openalex.org/W3094309989","https://openalex.org/W1891490252","https://openalex.org/W2953545426","https://openalex.org/W2625666888","https://openalex.org/W2754053178","https://openalex.org/W4311415363","https://openalex.org/W2937114781"],"abstract_inverted_index":{"This":[0],"paper":[1],"discusses":[2],"design,":[3],"fabrication":[4],"and":[5,36,54,59,80],"characterization":[6],"of":[7,49,63,72],"a":[8],"3D":[9],"stacked":[10,67],"small":[11,27],"form":[12],"factor":[13],"(SFF)":[14],"system-in-packages":[15],"(SiPs)":[16],"suitable":[17],"for":[18],"wearable":[19],"electronics":[20],"systems.":[21,111],"In":[22],"order":[23],"to":[24],"achieve":[25],"very":[26],"size":[28,73],"SiP,":[29],"two":[30],"SFF":[31],"multi-chip":[32],"packages":[33],"were":[34],"designed":[35],"fabricated":[37,88],"utilizing":[38],"embedded":[39],"wafer-level":[40],"ball":[41],"grid":[42],"array":[43],"(e-WLB)":[44],"technology.":[45,94],"The":[46,95],"package":[47,70],"consisted":[48],"six":[50],"radio":[51],"frequency":[52],"(RF)":[53],"digital":[55],"integrated":[56],"circuits":[57],"(ICs),":[58],"24":[60],"passive":[61],"components":[62],"varying":[64],"sizes.":[65],"3-D":[66],"system":[68,87,100],"in":[69],"was":[71,81,102],"6.0":[74],"\u00d7":[75,77],"5.5":[76],"1.9":[78],"mm":[79],"55%":[82],"smaller":[83],"than":[84,108],"the":[85,109],"same":[86],"using":[89],"conventional":[90],"printed":[91],"circuit":[92],"board":[93],"measured":[96],"results":[97],"showed":[98],"that":[99],"performance":[101],"on":[103],"par":[104],"with":[105],"or":[106],"better":[107],"previous":[110]},"counts_by_year":[{"year":2018,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}