{"id":"https://openalex.org/W2601739661","doi":"https://doi.org/10.1109/rws.2017.7885951","title":"3-D printed substrates for MMIC packaging","display_name":"3-D printed substrates for MMIC packaging","publication_year":2017,"publication_date":"2017-01-01","ids":{"openalex":"https://openalex.org/W2601739661","doi":"https://doi.org/10.1109/rws.2017.7885951","mag":"2601739661"},"language":"en","primary_location":{"id":"doi:10.1109/rws.2017.7885951","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws.2017.7885951","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006984767","display_name":"Spyridon Pavlidis","orcid":"https://orcid.org/0000-0002-1690-2581"},"institutions":[{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Spyridon Pavlidis","raw_affiliation_strings":["School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA","institution_ids":["https://openalex.org/I130701444"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5005940856","display_name":"Brian Wright","orcid":"https://orcid.org/0000-0003-3384-8334"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Brian Wright","raw_affiliation_strings":["Dept. of Electrical and Computer Engineering, Michigan State University, East Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Electrical and Computer Engineering, Michigan State University, East Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031725175","display_name":"John Papapolymerou","orcid":"https://orcid.org/0000-0002-1429-0921"},"institutions":[{"id":"https://openalex.org/I87216513","display_name":"Michigan State University","ror":"https://ror.org/05hs6h993","country_code":"US","type":"education","lineage":["https://openalex.org/I87216513"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"John Papapolymerou","raw_affiliation_strings":["Dept. of Electrical and Computer Engineering, Michigan State University, East Lansing, MI"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Dept. of Electrical and Computer Engineering, Michigan State University, East Lansing, MI","institution_ids":["https://openalex.org/I87216513"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.8531,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.84409063,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"79","last_page":"82"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11383","display_name":"Advanced Antenna and Metasurface Technologies","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/monolithic-microwave-integrated-circuit","display_name":"Monolithic microwave integrated circuit","score":0.827084481716156},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7129446864128113},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6913750767707825},{"id":"https://openalex.org/keywords/system-in-package","display_name":"System in package","score":0.6208817958831787},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5752319693565369},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.5594599843025208},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.521354079246521},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.49847841262817383},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.4848800599575043},{"id":"https://openalex.org/keywords/microwave","display_name":"Microwave","score":0.46324148774147034},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.4506318271160126},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.42014554142951965},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3538539409637451},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.33209145069122314},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3115598261356354},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.1988244652748108},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.15275755524635315},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14359557628631592},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1392422318458557},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1369444727897644},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.10609400272369385},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.10048976540565491}],"concepts":[{"id":"https://openalex.org/C128450285","wikidata":"https://www.wikidata.org/wiki/Q1945036","display_name":"Monolithic microwave integrated circuit","level":4,"score":0.827084481716156},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7129446864128113},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6913750767707825},{"id":"https://openalex.org/C146667757","wikidata":"https://www.wikidata.org/wiki/Q1457198","display_name":"System in package","level":3,"score":0.6208817958831787},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5752319693565369},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.5594599843025208},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.521354079246521},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.49847841262817383},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.4848800599575043},{"id":"https://openalex.org/C44838205","wikidata":"https://www.wikidata.org/wiki/Q127995","display_name":"Microwave","level":2,"score":0.46324148774147034},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4506318271160126},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.42014554142951965},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3538539409637451},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.33209145069122314},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3115598261356354},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.1988244652748108},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.15275755524635315},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14359557628631592},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1392422318458557},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1369444727897644},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.10609400272369385},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.10048976540565491},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C194257627","wikidata":"https://www.wikidata.org/wiki/Q211554","display_name":"Amplifier","level":3,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/rws.2017.7885951","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rws.2017.7885951","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE Radio and Wireless Symposium (RWS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.4000000059604645,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"},{"id":"https://openalex.org/F4320337392","display_name":"Division of Electrical, Communications and Cyber Systems","ror":"https://ror.org/01krpsy48"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1513461913","https://openalex.org/W1577622819","https://openalex.org/W1771912175","https://openalex.org/W1965480782","https://openalex.org/W2006201699","https://openalex.org/W2055194299","https://openalex.org/W2067168634","https://openalex.org/W2113641061","https://openalex.org/W2185129367","https://openalex.org/W2188293184","https://openalex.org/W6630472783"],"related_works":["https://openalex.org/W2389461683","https://openalex.org/W598463356","https://openalex.org/W1562902234","https://openalex.org/W1629995341","https://openalex.org/W1637926182","https://openalex.org/W1990065508","https://openalex.org/W2613355469","https://openalex.org/W1524782678","https://openalex.org/W2113803343","https://openalex.org/W584365561"],"abstract_inverted_index":{"Though":[0],"3D":[1,34,112],"printing":[2,63],"has":[3],"been":[4],"leveraged":[5],"to":[6,66,89],"realize":[7],"passive":[8],"components,":[9],"it":[10],"remains":[11],"largely":[12],"unexplored":[13],"for":[14,37,110],"the":[15,38,57,62,69,82,85,102],"packaging":[16],"of":[17,59,76,84],"active":[18],"devices":[19],"and":[20,49,92,115],"circuits.":[21],"In":[22],"this":[23],"paper,":[24],"a":[25,33,52,73,98],"bare":[26],"GaAs":[27],"LNA":[28,71],"MMIC":[29],"is":[30],"wire-bonded":[31],"in":[32,101],"printed":[35],"substrate":[36],"first":[39],"time.":[40],"The":[41],"package's":[42],"metal":[43],"layer":[44],"was":[45],"deposited":[46],"via":[47],"sputtering":[48],"patterned":[50],"using":[51],"mask-less":[53],"process":[54],"enabled":[55],"by":[56],"use":[58],"grooves":[60],"during":[61],"process.":[64],"Up":[65],"10":[67],"GHz,":[68],"packaged":[70],"shows":[72],"maximum":[74],"gain":[75],"25.5":[77],"dB.":[78],"At":[79],"higher":[80],"frequencies,":[81],"loss":[83,104],"package":[86],"increases":[87],"due":[88],"surface":[90],"roughness":[91],"interconnect":[93],"effects,":[94],"as":[95,97],"well":[96],"suspected":[99],"increase":[100],"substrate's":[103],"tangent.":[105],"These":[106],"remain":[107],"critical":[108],"issues":[109],"future":[111],"printing-based":[113],"microwave":[114],"millimeter-wave":[116],"packaging.":[117]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}