{"id":"https://openalex.org/W3184016995","doi":"https://doi.org/10.1109/robosoft51838.2021.9479351","title":"Compression behavior of typical silicone rubbers for soft robotics applications at elevated temperatures","display_name":"Compression behavior of typical silicone rubbers for soft robotics applications at elevated temperatures","publication_year":2021,"publication_date":"2021-04-12","ids":{"openalex":"https://openalex.org/W3184016995","doi":"https://doi.org/10.1109/robosoft51838.2021.9479351","mag":"3184016995"},"language":"en","primary_location":{"id":"doi:10.1109/robosoft51838.2021.9479351","is_oa":false,"landing_page_url":"https://doi.org/10.1109/robosoft51838.2021.9479351","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 4th International Conference on Soft Robotics (RoboSoft)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5021390163","display_name":"Doruk Utkan","orcid":null},"institutions":[{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]},{"id":"https://openalex.org/I884043246","display_name":"Hamburg University of Technology","ror":"https://ror.org/04bs1pb34","country_code":"DE","type":"education","lineage":["https://openalex.org/I884043246"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Doruk Utkan","raw_affiliation_strings":["Hamburg University of Technology TUHH,Hamburg,Germany,21073"],"affiliations":[{"raw_affiliation_string":"Hamburg University of Technology TUHH,Hamburg,Germany,21073","institution_ids":["https://openalex.org/I159176309","https://openalex.org/I884043246"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054165271","display_name":"Duraikannan Maruthavanan","orcid":"https://orcid.org/0000-0002-3546-7642"},"institutions":[{"id":"https://openalex.org/I884043246","display_name":"Hamburg University of Technology","ror":"https://ror.org/04bs1pb34","country_code":"DE","type":"education","lineage":["https://openalex.org/I884043246"]},{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Duraikannan Maruthavanan","raw_affiliation_strings":["Hamburg University of Technology TUHH,Hamburg,Germany,21073"],"affiliations":[{"raw_affiliation_string":"Hamburg University of Technology TUHH,Hamburg,Germany,21073","institution_ids":["https://openalex.org/I159176309","https://openalex.org/I884043246"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007986218","display_name":"Alex Schimanowski","orcid":null},"institutions":[{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]},{"id":"https://openalex.org/I884043246","display_name":"Hamburg University of Technology","ror":"https://ror.org/04bs1pb34","country_code":"DE","type":"education","lineage":["https://openalex.org/I884043246"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Alex Schimanowski","raw_affiliation_strings":["Hamburg University of Technology TUHH,Hamburg,Germany,21073"],"affiliations":[{"raw_affiliation_string":"Hamburg University of Technology TUHH,Hamburg,Germany,21073","institution_ids":["https://openalex.org/I159176309","https://openalex.org/I884043246"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5012195171","display_name":"Arthur Seibel","orcid":"https://orcid.org/0000-0003-3989-9626"},"institutions":[{"id":"https://openalex.org/I4210154327","display_name":"Fraunhofer Research Institution for Additive Manufacturing Technologies IAPT","ror":"https://ror.org/059ne2r23","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210154327","https://openalex.org/I4923324"]},{"id":"https://openalex.org/I159176309","display_name":"Universit\u00e4t Hamburg","ror":"https://ror.org/00g30e956","country_code":"DE","type":"education","lineage":["https://openalex.org/I159176309"]},{"id":"https://openalex.org/I884043246","display_name":"Hamburg University of Technology","ror":"https://ror.org/04bs1pb34","country_code":"DE","type":"education","lineage":["https://openalex.org/I884043246"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Arthur Seibel","raw_affiliation_strings":["Hamburg University of Technology TUHH,Hamburg,Germany,21073","Fraunhofer Research Institution for Additive Manufacturing Technologies IAPT, Hamburg, Germany"],"affiliations":[{"raw_affiliation_string":"Hamburg University of Technology TUHH,Hamburg,Germany,21073","institution_ids":["https://openalex.org/I159176309","https://openalex.org/I884043246"]},{"raw_affiliation_string":"Fraunhofer Research Institution for Additive Manufacturing Technologies IAPT, Hamburg, Germany","institution_ids":["https://openalex.org/I4210154327"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5021390163"],"corresponding_institution_ids":["https://openalex.org/I159176309","https://openalex.org/I884043246"],"apc_list":null,"apc_paid":null,"fwci":0.5094,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.60169008,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"539","last_page":"542"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10868","display_name":"Soft Robotics and Applications","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10868","display_name":"Soft Robotics and Applications","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11366","display_name":"Elasticity and Material Modeling","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9868000149726868,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7699945569038391},{"id":"https://openalex.org/keywords/silicone","display_name":"Silicone","score":0.7272225618362427},{"id":"https://openalex.org/keywords/soft-robotics","display_name":"Soft robotics","score":0.6945124864578247},{"id":"https://openalex.org/keywords/hyperelastic-material","display_name":"Hyperelastic material","score":0.6580100655555725},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.6301971673965454},{"id":"https://openalex.org/keywords/elastomer","display_name":"Elastomer","score":0.565466046333313},{"id":"https://openalex.org/keywords/compression","display_name":"Compression (physics)","score":0.5474768280982971},{"id":"https://openalex.org/keywords/silicone-rubber","display_name":"Silicone rubber","score":0.5100765824317932},{"id":"https://openalex.org/keywords/curing","display_name":"Curing (chemistry)","score":0.4742521345615387},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.43342894315719604},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.30268770456314087},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2254357635974884},{"id":"https://openalex.org/keywords/robot","display_name":"Robot","score":0.19571158289909363},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.13562509417533875},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.09875255823135376},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.06420847773551941}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7699945569038391},{"id":"https://openalex.org/C2779769944","wikidata":"https://www.wikidata.org/wiki/Q146439","display_name":"Silicone","level":2,"score":0.7272225618362427},{"id":"https://openalex.org/C2776058767","wikidata":"https://www.wikidata.org/wiki/Q24327151","display_name":"Soft robotics","level":3,"score":0.6945124864578247},{"id":"https://openalex.org/C147370603","wikidata":"https://www.wikidata.org/wiki/Q3801506","display_name":"Hyperelastic material","level":3,"score":0.6580100655555725},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6301971673965454},{"id":"https://openalex.org/C38052585","wikidata":"https://www.wikidata.org/wiki/Q252266","display_name":"Elastomer","level":2,"score":0.565466046333313},{"id":"https://openalex.org/C180016635","wikidata":"https://www.wikidata.org/wiki/Q2712821","display_name":"Compression (physics)","level":2,"score":0.5474768280982971},{"id":"https://openalex.org/C2776290925","wikidata":"https://www.wikidata.org/wiki/Q4115245","display_name":"Silicone rubber","level":2,"score":0.5100765824317932},{"id":"https://openalex.org/C132976073","wikidata":"https://www.wikidata.org/wiki/Q2991861","display_name":"Curing (chemistry)","level":2,"score":0.4742521345615387},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.43342894315719604},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.30268770456314087},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2254357635974884},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.19571158289909363},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.13562509417533875},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.09875255823135376},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.06420847773551941}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/robosoft51838.2021.9479351","is_oa":false,"landing_page_url":"https://doi.org/10.1109/robosoft51838.2021.9479351","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 4th International Conference on Soft Robotics (RoboSoft)","raw_type":"proceedings-article"},{"id":"pmh:oai:fraunhofer.de:N-641263","is_oa":false,"landing_page_url":"http://publica.fraunhofer.de/documents/N-641263.html","pdf_url":null,"source":{"id":"https://openalex.org/S4306400801","display_name":"Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Fraunhofer IAPT","raw_type":"Conference Paper"},{"id":"pmh:oai:null:publica/412869","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/412869","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"conference paper"},{"id":"pmh:oai:tore.tuhh.de:11420/10508","is_oa":false,"landing_page_url":"http://hdl.handle.net/11420/10508","pdf_url":null,"source":{"id":"https://openalex.org/S4306401751","display_name":"tub.dok (Hamburg University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I884043246","host_organization_name":"Hamburg University of Technology","host_organization_lineage":["https://openalex.org/I884043246"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference Paper"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1904430208","https://openalex.org/W1965709657","https://openalex.org/W1982611025","https://openalex.org/W2024209309","https://openalex.org/W2048267518","https://openalex.org/W2058430348","https://openalex.org/W2070735219","https://openalex.org/W2082488954","https://openalex.org/W2126477849","https://openalex.org/W2148273631","https://openalex.org/W2153643407","https://openalex.org/W2178147694","https://openalex.org/W2188087069","https://openalex.org/W4240596154","https://openalex.org/W4248591540","https://openalex.org/W4253500738","https://openalex.org/W4388394599"],"related_works":["https://openalex.org/W1990228585","https://openalex.org/W2487033392","https://openalex.org/W2354618027","https://openalex.org/W2370429222","https://openalex.org/W2329618406","https://openalex.org/W179141150","https://openalex.org/W2040957420","https://openalex.org/W2360098944","https://openalex.org/W3112293155","https://openalex.org/W4213066075"],"abstract_inverted_index":{"In":[0,20],"this":[1],"communication,":[2],"we":[3],"analyze":[4],"the":[5,66,77,82,87],"compression":[6,22],"behavior":[7],"of":[8,39],"typical":[9,59],"silicone":[10],"rubbers":[11],"used":[12],"in":[13],"soft":[14],"robotics":[15],"applications":[16],"at":[17,44],"elevated":[18],"temperatures.":[19],"particular,":[21],"experiments":[23],"according":[24],"to":[25,36,65],"ISO":[26],"7743":[27],"are":[28,63,91],"performed":[29],"with":[30],"three":[31],"mixing":[32],"ratios":[33],"(base":[34],"polymer":[35],"curing":[37],"agent)":[38],"Sylgard,":[40],"Elastosil,":[41],"and":[42,55,86],"Ecoflex":[43],"24":[45],"\u00b0C":[46],"(room":[47],"temperature),":[48],"30":[49],"\u00b0C,":[50,52,54],"40":[51],"50":[53],"60":[56],"\u00b0C.":[57],"Furthermore,":[58],"hyperelastic":[60],"material":[61],"models":[62],"fitted":[64],"measured":[67],"stress-strain":[68],"curves":[69],"for":[70],"room":[71],"temperature.":[72],"It":[73],"is":[74],"shown":[75],"that":[76],"(third-order)":[78],"Yeoh":[79],"model":[80,89],"shows":[81],"best":[83],"overall":[84],"fit,":[85],"corresponding":[88],"parameters":[90],"stated.":[92]},"counts_by_year":[{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-04-07T14:57:38.498316","created_date":"2025-10-10T00:00:00"}