{"id":"https://openalex.org/W4308096496","doi":"https://doi.org/10.1109/rfid-ta54958.2022.9923966","title":"3D Printed Passive Beam-Guiding and Manipulating Devices for the Terahertz Frequency Range","display_name":"3D Printed Passive Beam-Guiding and Manipulating Devices for the Terahertz Frequency Range","publication_year":2022,"publication_date":"2022-09-12","ids":{"openalex":"https://openalex.org/W4308096496","doi":"https://doi.org/10.1109/rfid-ta54958.2022.9923966"},"language":"en","primary_location":{"id":"doi:10.1109/rfid-ta54958.2022.9923966","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rfid-ta54958.2022.9923966","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE 12th International Conference on RFID Technology and Applications (RFID-TA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5012788086","display_name":"Tobias Kubiczek","orcid":"https://orcid.org/0000-0001-5625-3208"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Tobias Kubiczek","raw_affiliation_strings":["University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100362385","display_name":"Xuan Liu","orcid":"https://orcid.org/0009-0005-6150-0767"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Xuan Liu","raw_affiliation_strings":["University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071924250","display_name":"Jan C. Balzer","orcid":"https://orcid.org/0000-0001-9857-0295"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jan C. Balzer","raw_affiliation_strings":["University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052088230","display_name":"Xuan Guo","orcid":"https://orcid.org/0000-0002-7969-4257"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Xuan Guo","raw_affiliation_strings":["University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018919177","display_name":"Masoud Sakaki","orcid":"https://orcid.org/0000-0001-6238-8360"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Masoud Sakaki","raw_affiliation_strings":["Institute of Technology for Nanostructures University of Duisburg-Essen,Duisburg,Germany","Institute of Technology for Nanostructures University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"Institute of Technology for Nanostructures University of Duisburg-Essen,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Institute of Technology for Nanostructures University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063758507","display_name":"Yixiong Zhao","orcid":"https://orcid.org/0000-0001-9784-2041"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Yixiong Zhao","raw_affiliation_strings":["University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"University of Duisburg-Essen,Chair of Communication Systems,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Chair of Communication Systems, University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032175135","display_name":"Niels Benson","orcid":"https://orcid.org/0000-0002-2632-4826"},"institutions":[{"id":"https://openalex.org/I62318514","display_name":"University of Duisburg-Essen","ror":"https://ror.org/04mz5ra38","country_code":"DE","type":"education","lineage":["https://openalex.org/I62318514"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Niels Benson","raw_affiliation_strings":["Institute of Technology for Nanostructures University of Duisburg-Essen,Duisburg,Germany","Institute of Technology for Nanostructures University of Duisburg-Essen, Duisburg, Germany"],"affiliations":[{"raw_affiliation_string":"Institute of Technology for Nanostructures University of Duisburg-Essen,Duisburg,Germany","institution_ids":["https://openalex.org/I62318514"]},{"raw_affiliation_string":"Institute of Technology for Nanostructures University of Duisburg-Essen, Duisburg, Germany","institution_ids":["https://openalex.org/I62318514"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5012788086"],"corresponding_institution_ids":["https://openalex.org/I62318514"],"apc_list":null,"apc_paid":null,"fwci":0.1829,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.48302406,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"43","last_page":"46"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9789999723434448,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9789999723434448,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10752","display_name":"Terahertz technology and applications","score":0.9764000177383423,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9696999788284302,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/terahertz-radiation","display_name":"Terahertz radiation","score":0.9512532949447632},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.668218195438385},{"id":"https://openalex.org/keywords/terahertz-metamaterials","display_name":"Terahertz metamaterials","score":0.5775872468948364},{"id":"https://openalex.org/keywords/beam","display_name":"Beam (structure)","score":0.5237933397293091},{"id":"https://openalex.org/keywords/detector","display_name":"Detector","score":0.4801344573497772},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.47272294759750366},{"id":"https://openalex.org/keywords/range","display_name":"Range (aeronautics)","score":0.4600977301597595},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.44845104217529297},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.4473789632320404},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.43617990612983704},{"id":"https://openalex.org/keywords/terahertz-gap","display_name":"Terahertz gap","score":0.4263834059238434},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.38446182012557983},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.352475106716156},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.34224921464920044},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.34039247035980225},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32892823219299316},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.22851309180259705},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.19163566827774048},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.11420634388923645},{"id":"https://openalex.org/keywords/far-infrared-laser","display_name":"Far-infrared laser","score":0.10393285751342773},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.08301225304603577}],"concepts":[{"id":"https://openalex.org/C107816215","wikidata":"https://www.wikidata.org/wiki/Q647887","display_name":"Terahertz radiation","level":2,"score":0.9512532949447632},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.668218195438385},{"id":"https://openalex.org/C112184408","wikidata":"https://www.wikidata.org/wiki/Q7701523","display_name":"Terahertz metamaterials","level":4,"score":0.5775872468948364},{"id":"https://openalex.org/C168834538","wikidata":"https://www.wikidata.org/wiki/Q3705329","display_name":"Beam (structure)","level":2,"score":0.5237933397293091},{"id":"https://openalex.org/C94915269","wikidata":"https://www.wikidata.org/wiki/Q1834857","display_name":"Detector","level":2,"score":0.4801344573497772},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.47272294759750366},{"id":"https://openalex.org/C204323151","wikidata":"https://www.wikidata.org/wiki/Q905424","display_name":"Range (aeronautics)","level":2,"score":0.4600977301597595},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.44845104217529297},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.4473789632320404},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.43617990612983704},{"id":"https://openalex.org/C170563983","wikidata":"https://www.wikidata.org/wiki/Q17148761","display_name":"Terahertz gap","level":5,"score":0.4263834059238434},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.38446182012557983},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.352475106716156},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.34224921464920044},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.34039247035980225},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32892823219299316},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.22851309180259705},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.19163566827774048},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.11420634388923645},{"id":"https://openalex.org/C133033976","wikidata":"https://www.wikidata.org/wiki/Q2054070","display_name":"Far-infrared laser","level":3,"score":0.10393285751342773},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.08301225304603577},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/rfid-ta54958.2022.9923966","is_oa":false,"landing_page_url":"https://doi.org/10.1109/rfid-ta54958.2022.9923966","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE 12th International Conference on RFID Technology and Applications (RFID-TA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":0,"referenced_works":[],"related_works":["https://openalex.org/W2899084033","https://openalex.org/W2564780453","https://openalex.org/W1512730985","https://openalex.org/W1989659213","https://openalex.org/W1551465958","https://openalex.org/W3203000881","https://openalex.org/W2905559193","https://openalex.org/W1975117187","https://openalex.org/W2246737941","https://openalex.org/W2159387492"],"abstract_inverted_index":{"In":[0],"recent":[1],"decades,":[2],"research":[3],"has":[4],"focused":[5],"on":[6],"sources":[7],"and":[8,36,47,58],"detectors":[9],"in":[10,51],"the":[11,22,30],"terahertz":[12,18],"frequency":[13],"range.":[14],"Now":[15],"that":[16],"high-performance":[17],"systems":[19],"are":[20,54],"available,":[21],"development":[23],"of":[24,34],"passive":[25],"components":[26],"is":[27],"coming":[28],"to":[29],"fore.":[31],"Additive":[32],"manufacturing":[33],"polymer":[35],"ceramic":[37],"structures":[38,53],"represents":[39],"a":[40],"major":[41],"opportunity.":[42],"Various":[43],"concepts":[44],"for":[45],"guiding":[46],"manipulating":[48],"electromagnetic":[49],"waves":[50],"3D-printed":[52],"presented":[55],"by":[56],"simulation":[57],"experiment.":[59]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}