{"id":"https://openalex.org/W2745314704","doi":"https://doi.org/10.1109/recosoc.2017.8016143","title":"Design method for asymmetric 3D interconnect architectures with high level models","display_name":"Design method for asymmetric 3D interconnect architectures with high level models","publication_year":2017,"publication_date":"2017-07-01","ids":{"openalex":"https://openalex.org/W2745314704","doi":"https://doi.org/10.1109/recosoc.2017.8016143","mag":"2745314704"},"language":"en","primary_location":{"id":"doi:10.1109/recosoc.2017.8016143","is_oa":false,"landing_page_url":"https://doi.org/10.1109/recosoc.2017.8016143","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 12th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5043596492","display_name":"Jan Moritz Joseph","orcid":"https://orcid.org/0000-0001-8669-1225"},"institutions":[{"id":"https://openalex.org/I95793202","display_name":"Otto-von-Guericke University Magdeburg","ror":"https://ror.org/00ggpsq73","country_code":"DE","type":"education","lineage":["https://openalex.org/I95793202"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Jan Moritz Joseph","raw_affiliation_strings":["Otto-von-Guericke-Universit\u00e4t Magdeburg, Institut f\u00fcr Informations- und Kommunikationstechnik, Magdeburg, Germany"],"affiliations":[{"raw_affiliation_string":"Otto-von-Guericke-Universit\u00e4t Magdeburg, Institut f\u00fcr Informations- und Kommunikationstechnik, Magdeburg, Germany","institution_ids":["https://openalex.org/I95793202"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5031777933","display_name":"Lennart Bamberg","orcid":"https://orcid.org/0000-0003-4673-8310"},"institutions":[{"id":"https://openalex.org/I180437899","display_name":"University of Bremen","ror":"https://ror.org/04ers2y35","country_code":"DE","type":"education","lineage":["https://openalex.org/I180437899"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Lennart Bamberg","raw_affiliation_strings":["University of Bremen, Institute of Electrodynamics and Microelectronics, Bremen, Germany"],"affiliations":[{"raw_affiliation_string":"University of Bremen, Institute of Electrodynamics and Microelectronics, Bremen, Germany","institution_ids":["https://openalex.org/I180437899"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5029674117","display_name":"Sven Wrieden","orcid":null},"institutions":[{"id":"https://openalex.org/I9341345","display_name":"University of L\u00fcbeck","ror":"https://ror.org/00t3r8h32","country_code":"DE","type":"education","lineage":["https://openalex.org/I9341345"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Sven Wrieden","raw_affiliation_strings":["Universitat zu Lubeck, Lubeck, Schleswig-Holstein, DE"],"affiliations":[{"raw_affiliation_string":"Universitat zu Lubeck, Lubeck, Schleswig-Holstein, DE","institution_ids":["https://openalex.org/I9341345"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071206717","display_name":"Dominik Ermel","orcid":null},"institutions":[{"id":"https://openalex.org/I95793202","display_name":"Otto-von-Guericke University Magdeburg","ror":"https://ror.org/00ggpsq73","country_code":"DE","type":"education","lineage":["https://openalex.org/I95793202"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Dominik Ermel","raw_affiliation_strings":["Otto-von-Guericke-Universit\u00e4t Magdeburg, Institut f\u00fcr Informations- und Kommunikationstechnik, Magdeburg, Germany"],"affiliations":[{"raw_affiliation_string":"Otto-von-Guericke-Universit\u00e4t Magdeburg, Institut f\u00fcr Informations- und Kommunikationstechnik, Magdeburg, Germany","institution_ids":["https://openalex.org/I95793202"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015961858","display_name":"Alberto Garc\u00eda-Oritz","orcid":null},"institutions":[{"id":"https://openalex.org/I180437899","display_name":"University of Bremen","ror":"https://ror.org/04ers2y35","country_code":"DE","type":"education","lineage":["https://openalex.org/I180437899"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Alberto Garcia-Oritz","raw_affiliation_strings":["University of Bremen, Institute of Electrodynamics and Microelectronics, Bremen, Germany"],"affiliations":[{"raw_affiliation_string":"University of Bremen, Institute of Electrodynamics and Microelectronics, Bremen, Germany","institution_ids":["https://openalex.org/I180437899"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5080637249","display_name":"Thilo Pionteck","orcid":"https://orcid.org/0000-0001-6518-1226"},"institutions":[{"id":"https://openalex.org/I95793202","display_name":"Otto-von-Guericke University Magdeburg","ror":"https://ror.org/00ggpsq73","country_code":"DE","type":"education","lineage":["https://openalex.org/I95793202"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Thilo Pionteck","raw_affiliation_strings":["Otto-von-Guericke-Universit\u00e4t Magdeburg, Institut f\u00fcr Informations- und Kommunikationstechnik, Magdeburg, Germany"],"affiliations":[{"raw_affiliation_string":"Otto-von-Guericke-Universit\u00e4t Magdeburg, Institut f\u00fcr Informations- und Kommunikationstechnik, Magdeburg, Germany","institution_ids":["https://openalex.org/I95793202"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5043596492"],"corresponding_institution_ids":["https://openalex.org/I95793202"],"apc_list":null,"apc_paid":null,"fwci":0.43,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.65191993,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9965999722480774,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9886999726295471,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.7265142798423767},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6996908187866211},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5619732141494751},{"id":"https://openalex.org/keywords/abstraction","display_name":"Abstraction","score":0.5576149821281433},{"id":"https://openalex.org/keywords/solver","display_name":"Solver","score":0.5339329242706299},{"id":"https://openalex.org/keywords/solid-modeling","display_name":"Solid modeling","score":0.48642969131469727},{"id":"https://openalex.org/keywords/electromagnetic-field-solver","display_name":"Electromagnetic field solver","score":0.48357030749320984},{"id":"https://openalex.org/keywords/abstraction-layer","display_name":"Abstraction layer","score":0.4614371955394745},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.4232182502746582},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3503478169441223},{"id":"https://openalex.org/keywords/computer-engineering","display_name":"Computer engineering","score":0.33630871772766113},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3281872570514679},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.302288293838501},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17659226059913635},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.14695051312446594},{"id":"https://openalex.org/keywords/electromagnetic-field","display_name":"Electromagnetic field","score":0.13553056120872498}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.7265142798423767},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6996908187866211},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5619732141494751},{"id":"https://openalex.org/C124304363","wikidata":"https://www.wikidata.org/wiki/Q673661","display_name":"Abstraction","level":2,"score":0.5576149821281433},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.5339329242706299},{"id":"https://openalex.org/C108882727","wikidata":"https://www.wikidata.org/wiki/Q2991685","display_name":"Solid modeling","level":2,"score":0.48642969131469727},{"id":"https://openalex.org/C137009469","wikidata":"https://www.wikidata.org/wiki/Q5358083","display_name":"Electromagnetic field solver","level":5,"score":0.48357030749320984},{"id":"https://openalex.org/C147358964","wikidata":"https://www.wikidata.org/wiki/Q1200992","display_name":"Abstraction layer","level":3,"score":0.4614371955394745},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.4232182502746582},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3503478169441223},{"id":"https://openalex.org/C113775141","wikidata":"https://www.wikidata.org/wiki/Q428691","display_name":"Computer engineering","level":1,"score":0.33630871772766113},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3281872570514679},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.302288293838501},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17659226059913635},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.14695051312446594},{"id":"https://openalex.org/C28843909","wikidata":"https://www.wikidata.org/wiki/Q177625","display_name":"Electromagnetic field","level":2,"score":0.13553056120872498},{"id":"https://openalex.org/C154452299","wikidata":"https://www.wikidata.org/wiki/Q7098853","display_name":"Optical field","level":3,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C76969448","wikidata":"https://www.wikidata.org/wiki/Q6033855","display_name":"Inhomogeneous electromagnetic wave equation","level":4,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/recosoc.2017.8016143","is_oa":false,"landing_page_url":"https://doi.org/10.1109/recosoc.2017.8016143","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 12th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.7400000095367432,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320320879","display_name":"Deutsche Forschungsgemeinschaft","ror":"https://ror.org/018mejw64"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W606713757","https://openalex.org/W610124573","https://openalex.org/W1505822854","https://openalex.org/W1589898147","https://openalex.org/W2024178767","https://openalex.org/W2056303789","https://openalex.org/W2062845040","https://openalex.org/W2063609613","https://openalex.org/W2071147846","https://openalex.org/W2110113956","https://openalex.org/W2119428232","https://openalex.org/W2129813130","https://openalex.org/W2145336644","https://openalex.org/W2155707315","https://openalex.org/W2159218826","https://openalex.org/W2166151045","https://openalex.org/W2216365364","https://openalex.org/W2507281196","https://openalex.org/W2524704048","https://openalex.org/W3148440458","https://openalex.org/W4236302577"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2333804548","https://openalex.org/W1990828594","https://openalex.org/W3093450488","https://openalex.org/W2027159884","https://openalex.org/W2016589506","https://openalex.org/W3163301441","https://openalex.org/W1522190160","https://openalex.org/W2156107436","https://openalex.org/W2534942874"],"abstract_inverted_index":{"New":[0],"3D":[1,15,26,89],"production":[2],"methods":[3],"enable":[4],"heterogeneous":[5,25],"integration":[6],"of":[7,70,84,116,146,161,172],"dies":[8],"manufactured":[9],"in":[10,94,103],"different":[11],"technology":[12],"nodes.":[13],"Asymmetric":[14],"interconnect":[16],"architectures":[17],"(A-3D-IAs)":[18],"are":[19,39],"the":[20,60,67,79,114,117],"communication":[21],"infrastructure":[22],"targeting":[23],"these":[24],"system":[27],"on":[28,125,168],"chips":[29],"(3D":[30],"SoCs),":[31],"for":[32,113,130,134,166],"which":[33,110,156],"design":[34,37,44,64],"methodologies":[35],"and":[36,63,88],"tools":[38],"still":[40,140],"missing.":[41],"Here,":[42],"a":[43,126,142,151,158,169],"method":[45],"is":[46,98,111,154],"proposed":[47],"following":[48],"an":[49,74,95,106],"incremental":[50],"approach":[51],"enabled":[52],"by":[53,100],"high":[54,127,170],"level":[55,129,171],"models.":[56],"Therefore,":[57],"we":[58],"present":[59],"first":[61],"simulator":[62],"framework":[65],"covering":[66],"diverse":[68],"requirements":[69],"A-3D-IAs.":[71],"This":[72],"includes":[73],"abstract":[75],"model":[76,123],"to":[77],"estimate":[78],"application":[80],"specific":[81],"energy":[82],"consumption":[83],"2D":[85],"metal":[86],"wires":[87],"through":[90],"silicon":[91],"vias":[92],"(TSVs)":[93],"A-3D-IA.":[96],"It":[97],"validated":[99],"circuit":[101],"simulations":[102],"combination":[104],"with":[105],"electromagnetic":[107],"field":[108],"solver":[109],"used":[112],"extraction":[115],"TSV":[118],"array":[119],"equivalent":[120],"circuit.":[121],"The":[122],"lays":[124],"abstraction":[128],"fast":[131,159],"simulations.":[132],"Nonetheless,":[133],"real":[135],"data":[136],"stream":[137],"scenarios":[138],"it":[139],"shows":[141],"small":[143],"maximum":[144],"error":[145],"less":[147],"than":[148],"8%.":[149],"Additionally,":[150],"mathematical":[152],"description":[153],"presented":[155],"enables":[157],"evaluation":[160],"low":[162],"power":[163],"coding":[164],"schemes":[165],"A-3D-IA":[167],"abstraction.":[173]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}