{"id":"https://openalex.org/W2965651616","doi":"https://doi.org/10.1109/prime.2019.8787819","title":"Fast transient thermomechanical stress to set a pressure-assisted sintering process","display_name":"Fast transient thermomechanical stress to set a pressure-assisted sintering process","publication_year":2019,"publication_date":"2019-07-01","ids":{"openalex":"https://openalex.org/W2965651616","doi":"https://doi.org/10.1109/prime.2019.8787819","mag":"2965651616"},"language":"en","primary_location":{"id":"doi:10.1109/prime.2019.8787819","is_oa":false,"landing_page_url":"https://doi.org/10.1109/prime.2019.8787819","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5080257788","display_name":"Marco Santop\u00e0","orcid":null},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":true,"raw_author_name":"Marco Santopa","raw_affiliation_strings":["STMicroelectronics, Catania, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089508715","display_name":"S. Russo","orcid":"https://orcid.org/0000-0001-8142-2050"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Sebastiano Russo","raw_affiliation_strings":["STMicroelectronics, Catania, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049223524","display_name":"Marco Torrisi","orcid":"https://orcid.org/0000-0001-9519-7333"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Marco Torrisi","raw_affiliation_strings":["STMicroelectronics, Catania, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5017949440","display_name":"Marco Renna","orcid":"https://orcid.org/0000-0002-8143-5131"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Marco Renna","raw_affiliation_strings":["STMicroelectronics, Catania, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035620235","display_name":"Alessandro Sitta","orcid":"https://orcid.org/0000-0003-2394-0882"},"institutions":[{"id":"https://openalex.org/I39063666","display_name":"University of Catania","ror":"https://ror.org/03a64bh57","country_code":"IT","type":"education","lineage":["https://openalex.org/I39063666"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Alessandro Sitta","raw_affiliation_strings":["Universit\u00e0 degli di Studi di Catania, Catania, Italy"],"affiliations":[{"raw_affiliation_string":"Universit\u00e0 degli di Studi di Catania, Catania, Italy","institution_ids":["https://openalex.org/I39063666"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5036771281","display_name":"Michele Calabretta","orcid":"https://orcid.org/0000-0001-9322-182X"},"institutions":[{"id":"https://openalex.org/I4210154781","display_name":"STMicroelectronics (Italy)","ror":"https://ror.org/053bqv655","country_code":"IT","type":"company","lineage":["https://openalex.org/I131827901","https://openalex.org/I4210154781"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Michele Calabretta","raw_affiliation_strings":["STMicroelectronics, Catania, Italy"],"affiliations":[{"raw_affiliation_string":"STMicroelectronics, Catania, Italy","institution_ids":["https://openalex.org/I4210154781"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5080257788"],"corresponding_institution_ids":["https://openalex.org/I4210154781"],"apc_list":null,"apc_paid":null,"fwci":1.1923,"has_fulltext":false,"cited_by_count":15,"citation_normalized_percentile":{"value":0.79541568,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10132","display_name":"Advanced ceramic materials synthesis","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2503","display_name":"Ceramics and Composites"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.8247008323669434},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.790757954120636},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.7401692271232605},{"id":"https://openalex.org/keywords/sintering","display_name":"Sintering","score":0.6579134464263916},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.5873385667800903},{"id":"https://openalex.org/keywords/durability","display_name":"Durability","score":0.5666825175285339},{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.5519362688064575},{"id":"https://openalex.org/keywords/temperature-cycling","display_name":"Temperature cycling","score":0.5295736789703369},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.48346051573753357},{"id":"https://openalex.org/keywords/power-module","display_name":"Power module","score":0.47193166613578796},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.4707408845424652},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.44786351919174194},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.440249502658844},{"id":"https://openalex.org/keywords/thermal-shock","display_name":"Thermal shock","score":0.4392392039299011},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.4279702603816986},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4036853313446045},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3702738881111145},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.3082634508609772},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.30368101596832275},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.283741295337677},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.25241103768348694},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2461935579776764},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12033599615097046},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.09830698370933533}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.8247008323669434},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.790757954120636},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.7401692271232605},{"id":"https://openalex.org/C2777581544","wikidata":"https://www.wikidata.org/wiki/Q844613","display_name":"Sintering","level":2,"score":0.6579134464263916},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.5873385667800903},{"id":"https://openalex.org/C104304963","wikidata":"https://www.wikidata.org/wiki/Q5316114","display_name":"Durability","level":2,"score":0.5666825175285339},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.5519362688064575},{"id":"https://openalex.org/C177564732","wikidata":"https://www.wikidata.org/wiki/Q7698333","display_name":"Temperature cycling","level":3,"score":0.5295736789703369},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.48346051573753357},{"id":"https://openalex.org/C141812795","wikidata":"https://www.wikidata.org/wiki/Q7236534","display_name":"Power module","level":3,"score":0.47193166613578796},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.4707408845424652},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.44786351919174194},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.440249502658844},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.4392392039299011},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.4279702603816986},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4036853313446045},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3702738881111145},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.3082634508609772},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.30368101596832275},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.283741295337677},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.25241103768348694},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2461935579776764},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12033599615097046},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.09830698370933533},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/prime.2019.8787819","is_oa":false,"landing_page_url":"https://doi.org/10.1109/prime.2019.8787819","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7799999713897705}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1989472626","https://openalex.org/W2019657740","https://openalex.org/W2040557976","https://openalex.org/W2071697832","https://openalex.org/W2134357750","https://openalex.org/W2142210263","https://openalex.org/W2144733534","https://openalex.org/W2145671267","https://openalex.org/W2165842238","https://openalex.org/W2509999191","https://openalex.org/W2737101607","https://openalex.org/W2744657634","https://openalex.org/W2891535831","https://openalex.org/W2909257964","https://openalex.org/W3141432254","https://openalex.org/W3143537468","https://openalex.org/W6655346002","https://openalex.org/W6681874161"],"related_works":["https://openalex.org/W9168878","https://openalex.org/W8592597","https://openalex.org/W32791933","https://openalex.org/W30338840","https://openalex.org/W34492058","https://openalex.org/W16065137","https://openalex.org/W1438452","https://openalex.org/W2085579","https://openalex.org/W14382723","https://openalex.org/W15218197"],"abstract_inverted_index":{"High":[0],"temperature":[1,28],"application":[2],"and":[3,29,68,74],"long":[4],"term":[5],"reliability":[6,40],"are":[7],"the":[8,22,34,39,56,92,124],"future":[9,19,43],"trends":[10],"for":[11,98],"power":[12,44,101],"electronics.":[13],"A":[14],"key":[15],"factor":[16],"to":[17,51,86,90],"enable":[18],"applications":[20],"is":[21,61,78,85],"interconnection":[23,48],"durability":[24],"improvement":[25],"under":[26],"high":[27],"thermo-mechanical":[30],"cycling":[31],"loads.":[32],"Nowadays,":[33],"standard":[35],"solders":[36],"cannot":[37],"fulfill":[38],"requirements":[41],"of":[42,55,82,111],"electronic":[45],"devices,":[46],"therefore":[47],"technologies":[49],"have":[50,106],"be":[52],"developed.":[53],"One":[54],"most":[57],"promising":[58],"joining":[59],"technique":[60],"Ag":[62,93],"sintering.":[63],"Combining":[64],"properly":[65],"temperature,":[66],"time":[67],"pressure,":[69],"a":[70,88,99,129],"strong,":[71],"highly":[72],"electrically":[73],"thermally":[75],"conductive":[76],"bond":[77],"formed.":[79],"The":[80],"aim":[81],"this":[83],"work":[84],"develop":[87],"methodology":[89],"assess":[91],"sintering":[94],"die":[95],"attach":[96],"process":[97,104],"SiC":[100],"MOSFET.":[102],"Different":[103],"parameters":[105],"been":[107],"benchmarked":[108],"by":[109,128],"means":[110],"physical":[112],"analyses,":[113],"performed":[114],"not":[115],"only":[116],"on":[117],"just":[118],"assembled":[119],"devices":[120],"but":[121],"also":[122],"considering":[123],"aging":[125],"effect":[126],"induced":[127],"liquid-to-liquid":[130],"thermal":[131],"shock":[132],"test.":[133]},"counts_by_year":[{"year":2024,"cited_by_count":4},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":3},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}