{"id":"https://openalex.org/W2887273939","doi":"https://doi.org/10.1109/prime.2018.8430356","title":"Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits","display_name":"Fabrication of Full-3D Printed Electronics RF Passive Components and Circuits","publication_year":2018,"publication_date":"2018-07-01","ids":{"openalex":"https://openalex.org/W2887273939","doi":"https://doi.org/10.1109/prime.2018.8430356","mag":"2887273939"},"language":"en","primary_location":{"id":"doi:10.1109/prime.2018.8430356","is_oa":false,"landing_page_url":"https://doi.org/10.1109/prime.2018.8430356","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5066252905","display_name":"A. Salas","orcid":"https://orcid.org/0000-0001-5589-4660"},"institutions":[{"id":"https://openalex.org/I71999127","display_name":"Universitat de Barcelona","ror":"https://ror.org/021018s57","country_code":"ES","type":"education","lineage":["https://openalex.org/I71999127"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"A. Salas-Barenys","raw_affiliation_strings":["Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain","institution_ids":["https://openalex.org/I71999127"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081598202","display_name":"N. Vidal","orcid":"https://orcid.org/0000-0001-9445-7447"},"institutions":[{"id":"https://openalex.org/I71999127","display_name":"Universitat de Barcelona","ror":"https://ror.org/021018s57","country_code":"ES","type":"education","lineage":["https://openalex.org/I71999127"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"N. Vidal","raw_affiliation_strings":["Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain","institution_ids":["https://openalex.org/I71999127"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006096520","display_name":"J. Sieiro","orcid":"https://orcid.org/0000-0001-9545-5347"},"institutions":[{"id":"https://openalex.org/I71999127","display_name":"Universitat de Barcelona","ror":"https://ror.org/021018s57","country_code":"ES","type":"education","lineage":["https://openalex.org/I71999127"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"J. Sieiro","raw_affiliation_strings":["Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain","institution_ids":["https://openalex.org/I71999127"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5006980309","display_name":"J.M. L\u00f3pez-Villegas","orcid":"https://orcid.org/0000-0002-1333-7142"},"institutions":[{"id":"https://openalex.org/I71999127","display_name":"Universitat de Barcelona","ror":"https://ror.org/021018s57","country_code":"ES","type":"education","lineage":["https://openalex.org/I71999127"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"J. M. Lopez-Villegas","raw_affiliation_strings":["Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electronics, Universitat de Barcelona Barcelona, Barcelona, Spain","institution_ids":["https://openalex.org/I71999127"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050997289","display_name":"B. Medina-Rodr\u00edguez","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"B. Medina-Rodriguez","raw_affiliation_strings":["FAE - Francisco Albero Electr\u00f3nica S.A.U. Hospitalet de Llobregat, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"FAE - Francisco Albero Electr\u00f3nica S.A.U. Hospitalet de Llobregat, Spain","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072984480","display_name":"F. Ramos","orcid":"https://orcid.org/0000-0002-5363-8636"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"F. M Ramos","raw_affiliation_strings":["FAE - Francisco Albero Electr\u00f3nica S.A.U. Hospitalet de Llobregat, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"FAE - Francisco Albero Electr\u00f3nica S.A.U. Hospitalet de Llobregat, Spain","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4504,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.68166282,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"265","last_page":"268"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9914000034332275,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.8314038515090942},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6367365717887878},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6136261820793152},{"id":"https://openalex.org/keywords/electronic-component","display_name":"Electronic component","score":0.5729824900627136},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.5417852997779846},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.5382518768310547},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.5024082660675049},{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.5014965534210205},{"id":"https://openalex.org/keywords/printed-electronics","display_name":"Printed electronics","score":0.4908614754676819},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.45218130946159363},{"id":"https://openalex.org/keywords/plating","display_name":"Plating (geology)","score":0.42157554626464844},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.36439913511276245},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.35773712396621704},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34203779697418213},{"id":"https://openalex.org/keywords/inkwell","display_name":"Inkwell","score":0.33842170238494873},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.17628878355026245},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.09270021319389343},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.06477943062782288}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8314038515090942},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6367365717887878},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6136261820793152},{"id":"https://openalex.org/C81060104","wikidata":"https://www.wikidata.org/wiki/Q11653","display_name":"Electronic component","level":2,"score":0.5729824900627136},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.5417852997779846},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.5382518768310547},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.5024082660675049},{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.5014965534210205},{"id":"https://openalex.org/C25435620","wikidata":"https://www.wikidata.org/wiki/Q1497629","display_name":"Printed electronics","level":3,"score":0.4908614754676819},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.45218130946159363},{"id":"https://openalex.org/C2776985018","wikidata":"https://www.wikidata.org/wiki/Q7202314","display_name":"Plating (geology)","level":2,"score":0.42157554626464844},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36439913511276245},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35773712396621704},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34203779697418213},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.33842170238494873},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.17628878355026245},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.09270021319389343},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.06477943062782288},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C8058405","wikidata":"https://www.wikidata.org/wiki/Q46255","display_name":"Geophysics","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/prime.2018.8430356","is_oa":false,"landing_page_url":"https://doi.org/10.1109/prime.2018.8430356","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 14th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1560787285","https://openalex.org/W1957220226","https://openalex.org/W2007829639","https://openalex.org/W2014987263","https://openalex.org/W2038937326","https://openalex.org/W2168633057","https://openalex.org/W2197692950","https://openalex.org/W2376461682","https://openalex.org/W2569120233","https://openalex.org/W2599924551","https://openalex.org/W2724418474","https://openalex.org/W2743621959","https://openalex.org/W2790565598","https://openalex.org/W2811258410","https://openalex.org/W6640972292","https://openalex.org/W6687995316"],"related_works":["https://openalex.org/W2208542895","https://openalex.org/W4316651007","https://openalex.org/W3041145407","https://openalex.org/W2043696621","https://openalex.org/W2932496401","https://openalex.org/W3183808962","https://openalex.org/W3013381598","https://openalex.org/W2590191889","https://openalex.org/W4318618448","https://openalex.org/W2024808593"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,27,32],"process":[4,62],"for":[5],"full-3D":[6],"circuit":[7],"and":[8,31,58,66],"RF":[9],"passive":[10],"component":[11],"fabrication":[12,70],"based":[13],"on":[14,52],"two":[15],"main":[16],"steps:":[17],"additive":[18],"manufacturing":[19],"of":[20,45,60,71],"the":[21,50,61,69],"plastic":[22],"or":[23],"ceramic":[24],"substrate,":[25],"through":[26,68],"stereolitographic":[28],"3D":[29,53],"printer,":[30],"copper":[33],"electroless":[34],"plating":[35],"metallization":[36,39],"process.":[37],"The":[38,56],"results":[40],"are":[41],"discussed":[42,67],"in":[43],"terms":[44],"resistivity,":[46],"comparing":[47],"them":[48],"to":[49],"State-of-the-Art":[51],"printed":[54],"electronics.":[55],"capabilities":[57],"accuracy":[59],"have":[63],"been":[64],"demonstrated":[65],"conical":[72],"inductors.":[73]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}