{"id":"https://openalex.org/W4388040421","doi":"https://doi.org/10.1109/pimrc56721.2023.10293952","title":"Comprehensive Prototype Demonstration of Ultra-Broadband Terahertz Platform for 6G ISAC","display_name":"Comprehensive Prototype Demonstration of Ultra-Broadband Terahertz Platform for 6G ISAC","publication_year":2023,"publication_date":"2023-09-05","ids":{"openalex":"https://openalex.org/W4388040421","doi":"https://doi.org/10.1109/pimrc56721.2023.10293952"},"language":"en","primary_location":{"id":"doi:10.1109/pimrc56721.2023.10293952","is_oa":false,"landing_page_url":"https://doi.org/10.1109/pimrc56721.2023.10293952","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 34th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100620891","display_name":"Yao Liu","orcid":"https://orcid.org/0000-0002-2207-4575"},"institutions":[{"id":"https://openalex.org/I2250955327","display_name":"Huawei Technologies (China)","ror":"https://ror.org/00cmhce21","country_code":"CN","type":"company","lineage":["https://openalex.org/I2250955327"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yao Liu","raw_affiliation_strings":["Huawei Technologies Co., Ltd,Wireless Technology Laboratory","Wireless Technology Laboratory, Huawei Technologies Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co., Ltd,Wireless Technology Laboratory","institution_ids":["https://openalex.org/I2250955327"]},{"raw_affiliation_string":"Wireless Technology Laboratory, Huawei Technologies Co., Ltd","institution_ids":["https://openalex.org/I2250955327"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028067115","display_name":"Oupeng Li","orcid":null},"institutions":[{"id":"https://openalex.org/I2250955327","display_name":"Huawei Technologies (China)","ror":"https://ror.org/00cmhce21","country_code":"CN","type":"company","lineage":["https://openalex.org/I2250955327"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Oupeng Li","raw_affiliation_strings":["Huawei Technologies Co., Ltd,Wireless Technology Laboratory","Wireless Technology Laboratory, Huawei Technologies Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co., Ltd,Wireless Technology Laboratory","institution_ids":["https://openalex.org/I2250955327"]},{"raw_affiliation_string":"Wireless Technology Laboratory, Huawei Technologies Co., Ltd","institution_ids":["https://openalex.org/I2250955327"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007241011","display_name":"Xianfeng Du","orcid":null},"institutions":[{"id":"https://openalex.org/I2250955327","display_name":"Huawei Technologies (China)","ror":"https://ror.org/00cmhce21","country_code":"CN","type":"company","lineage":["https://openalex.org/I2250955327"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xianfeng Du","raw_affiliation_strings":["Huawei Technologies Co., Ltd,Wireless Technology Laboratory","Wireless Technology Laboratory, Huawei Technologies Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co., Ltd,Wireless Technology Laboratory","institution_ids":["https://openalex.org/I2250955327"]},{"raw_affiliation_string":"Wireless Technology Laboratory, Huawei Technologies Co., Ltd","institution_ids":["https://openalex.org/I2250955327"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007569671","display_name":"Junwei Zang","orcid":"https://orcid.org/0000-0003-0461-407X"},"institutions":[{"id":"https://openalex.org/I2250955327","display_name":"Huawei Technologies (China)","ror":"https://ror.org/00cmhce21","country_code":"CN","type":"company","lineage":["https://openalex.org/I2250955327"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junwei Zang","raw_affiliation_strings":["Huawei Technologies Co., Ltd,Wireless Technology Laboratory","Wireless Technology Laboratory, Huawei Technologies Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co., Ltd,Wireless Technology Laboratory","institution_ids":["https://openalex.org/I2250955327"]},{"raw_affiliation_string":"Wireless Technology Laboratory, Huawei Technologies Co., Ltd","institution_ids":["https://openalex.org/I2250955327"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100393700","display_name":"Qiao Liu","orcid":"https://orcid.org/0000-0002-6327-4995"},"institutions":[{"id":"https://openalex.org/I2250955327","display_name":"Huawei Technologies (China)","ror":"https://ror.org/00cmhce21","country_code":"CN","type":"company","lineage":["https://openalex.org/I2250955327"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qiao Liu","raw_affiliation_strings":["Huawei Technologies Co., Ltd,Wireless Technology Laboratory","Wireless Technology Laboratory, Huawei Technologies Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co., Ltd,Wireless Technology Laboratory","institution_ids":["https://openalex.org/I2250955327"]},{"raw_affiliation_string":"Wireless Technology Laboratory, Huawei Technologies Co., Ltd","institution_ids":["https://openalex.org/I2250955327"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102006793","display_name":"Guangjian Wang","orcid":"https://orcid.org/0000-0003-1048-1226"},"institutions":[{"id":"https://openalex.org/I2250955327","display_name":"Huawei Technologies (China)","ror":"https://ror.org/00cmhce21","country_code":"CN","type":"company","lineage":["https://openalex.org/I2250955327"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guangjian Wang","raw_affiliation_strings":["Huawei Technologies Co., Ltd,Wireless Technology Laboratory","Wireless Technology Laboratory, Huawei Technologies Co., Ltd"],"affiliations":[{"raw_affiliation_string":"Huawei Technologies Co., Ltd,Wireless Technology Laboratory","institution_ids":["https://openalex.org/I2250955327"]},{"raw_affiliation_string":"Wireless Technology Laboratory, Huawei Technologies Co., Ltd","institution_ids":["https://openalex.org/I2250955327"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5100620891"],"corresponding_institution_ids":["https://openalex.org/I2250955327"],"apc_list":null,"apc_paid":null,"fwci":0.9372,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.75072561,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"7"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10936","display_name":"Millimeter-Wave Propagation and Modeling","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10936","display_name":"Millimeter-Wave Propagation and Modeling","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9987000226974487,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/baseband","display_name":"Baseband","score":0.7169600129127502},{"id":"https://openalex.org/keywords/broadband","display_name":"Broadband","score":0.7159459590911865},{"id":"https://openalex.org/keywords/terahertz-radiation","display_name":"Terahertz radiation","score":0.6845216751098633},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6713104248046875},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.53431236743927},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.46561360359191895},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.37368765473365784},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36493974924087524},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.35666877031326294},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.3304134011268616},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.24755552411079407},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20868873596191406},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.11084714531898499},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.0826106071472168}],"concepts":[{"id":"https://openalex.org/C65165936","wikidata":"https://www.wikidata.org/wiki/Q575784","display_name":"Baseband","level":3,"score":0.7169600129127502},{"id":"https://openalex.org/C509933004","wikidata":"https://www.wikidata.org/wiki/Q194163","display_name":"Broadband","level":2,"score":0.7159459590911865},{"id":"https://openalex.org/C107816215","wikidata":"https://www.wikidata.org/wiki/Q647887","display_name":"Terahertz radiation","level":2,"score":0.6845216751098633},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6713104248046875},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.53431236743927},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.46561360359191895},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.37368765473365784},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36493974924087524},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.35666877031326294},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.3304134011268616},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.24755552411079407},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20868873596191406},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.11084714531898499},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.0826106071472168}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/pimrc56721.2023.10293952","is_oa":false,"landing_page_url":"https://doi.org/10.1109/pimrc56721.2023.10293952","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE 34th Annual International Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.5199999809265137}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1970844448","https://openalex.org/W3016114681","https://openalex.org/W3152301406","https://openalex.org/W4250897953","https://openalex.org/W4285047753","https://openalex.org/W4307135019","https://openalex.org/W4385800964","https://openalex.org/W4391454495","https://openalex.org/W6793776776","https://openalex.org/W6852362913"],"related_works":["https://openalex.org/W2762687161","https://openalex.org/W2353254830","https://openalex.org/W2033952283","https://openalex.org/W2351210568","https://openalex.org/W2028421553","https://openalex.org/W2890072373","https://openalex.org/W2204547643","https://openalex.org/W1497578837","https://openalex.org/W3210392477","https://openalex.org/W1990949930"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"the":[3,20,29,35,47,59,65,68],"latest":[4],"design,":[5],"development,":[6],"and":[7,24,34,46,81,91,107,111,132],"field":[8,49],"trial":[9],"results":[10],"of":[11,58,67],"a":[12,56,79],"comprehensive":[13],"ultra-broadband":[14],"terahertz":[15],"(THz)":[16],"prototype":[17,98],"platform,":[18],"for":[19],"next-generation":[21],"integrated":[22],"sensing":[23,95],"communication":[25,90],"(ISAC)":[26],"applications.":[27],"Particularly,":[28],"hardware":[30],"architecture,":[31],"link":[32],"budget,":[33],"baseband":[36],"are":[37,43,51],"firstly":[38],"introduced.":[39],"Then,":[40],"representative":[41],"scenarios":[42],"carefully":[44],"selected,":[45],"corresponding":[48],"trials":[50],"conducted":[52],"extensively":[53],"to":[54,64,117,121,126],"verify":[55],"number":[57],"most":[60],"concerning":[61],"parameters.":[62],"According":[63],"analysis":[66],"results,":[69],"it":[70],"can":[71],"be":[72],"observed":[73],"that":[74],"this":[75],"work":[76],"has":[77,99],"realised":[78],"co-hardware":[80],"co-waveform":[82],"ISAC":[83,138],"prototype,":[84],"which":[85],"supports":[86],"high":[87,93,129,135],"data":[88,130],"rate":[89],"millimetre-level":[92],"resolution":[94],"functionalities.":[96],"The":[97],"also":[100],"adopted":[101],"THz":[102],"compound":[103],"semiconductor":[104],"device,":[105],"digital-to-analogue":[106],"analogue-to-digital":[108],"converter":[109],"boards,":[110],"low":[112],"complexity":[113],"signal":[114],"processing":[115],"techniques":[116],"simultaneously":[118],"provide":[119],"up":[120,125],"3.5":[122],"km":[123],"long-distance,":[124],"240":[127],"Gbps":[128],"rate,":[131],"17+":[133],"bit/s/Hz":[134],"spectrum":[136],"efficiency":[137],"service.":[139]},"counts_by_year":[{"year":2025,"cited_by_count":3},{"year":2024,"cited_by_count":4}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}