{"id":"https://openalex.org/W2769191725","doi":"https://doi.org/10.1109/patmos.2017.8106948","title":"3D-IC signal TSV assignment for thermal and wirelength optimization","display_name":"3D-IC signal TSV assignment for thermal and wirelength optimization","publication_year":2017,"publication_date":"2017-09-01","ids":{"openalex":"https://openalex.org/W2769191725","doi":"https://doi.org/10.1109/patmos.2017.8106948","mag":"2769191725"},"language":"en","primary_location":{"id":"doi:10.1109/patmos.2017.8106948","is_oa":false,"landing_page_url":"https://doi.org/10.1109/patmos.2017.8106948","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5025670429","display_name":"Yuxin Qian","orcid":"https://orcid.org/0000-0002-9152-4832"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]},{"id":"https://openalex.org/I150744194","display_name":"Waseda University","ror":"https://ror.org/00ntfnx83","country_code":"JP","type":"education","lineage":["https://openalex.org/I150744194"]}],"countries":["CN","JP"],"is_corresponding":true,"raw_author_name":"Yuxin Qian","raw_affiliation_strings":["Graduate School of IPS, Waseda University, Wakamatsu, Kitakyushu, Japan","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Graduate School of IPS, Waseda University, Wakamatsu, Kitakyushu, Japan","institution_ids":["https://openalex.org/I150744194"]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053022655","display_name":"Cong Hao","orcid":"https://orcid.org/0000-0002-2541-8767"},"institutions":[{"id":"https://openalex.org/I150744194","display_name":"Waseda University","ror":"https://ror.org/00ntfnx83","country_code":"JP","type":"education","lineage":["https://openalex.org/I150744194"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Cong Hao","raw_affiliation_strings":["Graduate School of IPS, Waseda University, Wakamatsu, Kitakyushu, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of IPS, Waseda University, Wakamatsu, Kitakyushu, Japan","institution_ids":["https://openalex.org/I150744194"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101886411","display_name":"Takeshi Yoshimura","orcid":"https://orcid.org/0000-0002-7147-4225"},"institutions":[{"id":"https://openalex.org/I150744194","display_name":"Waseda University","ror":"https://ror.org/00ntfnx83","country_code":"JP","type":"education","lineage":["https://openalex.org/I150744194"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takeshi Yoshimura","raw_affiliation_strings":["Graduate School of IPS, Waseda University, Wakamatsu, Kitakyushu, Japan"],"affiliations":[{"raw_affiliation_string":"Graduate School of IPS, Waseda University, Wakamatsu, Kitakyushu, Japan","institution_ids":["https://openalex.org/I150744194"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5025670429"],"corresponding_institution_ids":["https://openalex.org/I150744194","https://openalex.org/I183067930"],"apc_list":null,"apc_paid":null,"fwci":0.2867,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.60751388,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.7183138728141785},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.6073750257492065},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5647950172424316},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.4967570900917053},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.47025999426841736},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.45729243755340576},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4314744770526886},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.43130582571029663},{"id":"https://openalex.org/keywords/footprint","display_name":"Footprint","score":0.42340657114982605},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32793834805488586},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3249838948249817},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3215436339378357},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.2904015779495239},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20516788959503174},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.12300240993499756},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.1038120687007904}],"concepts":[{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.7183138728141785},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.6073750257492065},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5647950172424316},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.4967570900917053},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.47025999426841736},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.45729243755340576},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4314744770526886},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.43130582571029663},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.42340657114982605},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32793834805488586},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3249838948249817},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3215436339378357},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.2904015779495239},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20516788959503174},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.12300240993499756},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.1038120687007904},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/patmos.2017.8106948","is_oa":false,"landing_page_url":"https://doi.org/10.1109/patmos.2017.8106948","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.7200000286102295}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1926811926","https://openalex.org/W1971507799","https://openalex.org/W2010084010","https://openalex.org/W2015262702","https://openalex.org/W2108742647","https://openalex.org/W2116179290","https://openalex.org/W2129960401","https://openalex.org/W2151734895","https://openalex.org/W2546953809","https://openalex.org/W2592302726","https://openalex.org/W6729403731"],"related_works":["https://openalex.org/W2016970881","https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2333804548","https://openalex.org/W2534942874","https://openalex.org/W3093450488","https://openalex.org/W2016589506","https://openalex.org/W2376702355","https://openalex.org/W4385062230","https://openalex.org/W2084347051"],"abstract_inverted_index":{"In":[0,43],"3D":[1],"integrated":[2,17],"circuit":[3],"(3D-IC),":[4],"there":[5],"are":[6,16],"two":[7],"or":[8],"more":[9],"layers":[10],"of":[11,36,89],"active":[12],"electronic":[13],"components":[14],"which":[15,31,126],"both":[18],"vertically":[19],"and":[20,83,92,122,148],"horizontally.":[21],"Through-silicon-via":[22],"(TSV)":[23],"is":[24,64,111],"used":[25],"as":[26],"the":[27,48,67,87,120,130],"vertical":[28],"electrical":[29],"connection":[30],"enables":[32],"a":[33,40,73,97],"great":[34],"deal":[35],"functionality":[37],"packed":[38],"into":[39,58],"small":[41],"footprint.":[42],"this":[44],"work":[45],"we":[46,71,95,118],"solve":[47],"signal":[49],"TSV":[50,131],"assignment":[51,77,132],"problem":[52,57],"in":[53,66],"3D-IC":[54],"taking":[55],"thermal":[56,98],"consideration,":[59],"while":[60],"only":[61],"wire":[62,81,90,145],"length":[63,82,91,146],"concerned":[65],"previous":[68],"work.":[69],"Firstly,":[70],"propose":[72],"multilevel":[74],"node-weight-oriented":[75],"flow":[76],"algorithm":[78,115,140],"to":[79,101,113],"reduce":[80],"temperature":[84,93,149],"simultaneously.":[85],"During":[86],"evaluation":[88],"result,":[94],"use":[96],"estimation":[99],"model":[100],"evaluate":[102],"temperature,":[103],"where":[104],"compression":[105],"storage":[106],"method":[107,125],"with":[108,144],"LU":[109],"decomposition":[110],"adopted":[112],"improve":[114],"efficiency.":[116],"Moreover,":[117],"implement":[119],"remove":[121],"reassign":[123],"optimization":[124],"helps":[127],"further":[128],"optimize":[129],"results.":[133],"The":[134],"experimental":[135],"results":[136],"show":[137],"that":[138],"our":[139],"provides":[141],"better":[142],"solution":[143],"reduction":[147],"decrease.":[150]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2018,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}