{"id":"https://openalex.org/W2579914020","doi":"https://doi.org/10.1109/patmos.2016.7833704","title":"Optimized few layer graphene for heat spreading","display_name":"Optimized few layer graphene for heat spreading","publication_year":2016,"publication_date":"2016-09-01","ids":{"openalex":"https://openalex.org/W2579914020","doi":"https://doi.org/10.1109/patmos.2016.7833704","mag":"2579914020"},"language":"en","primary_location":{"id":"doi:10.1109/patmos.2016.7833704","is_oa":false,"landing_page_url":"https://doi.org/10.1109/patmos.2016.7833704","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 26th International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5071029234","display_name":"S\u00e9bastian Volz","orcid":"https://orcid.org/0000-0003-2069-9480"},"institutions":[{"id":"https://openalex.org/I277688954","display_name":"Universit\u00e9 Paris-Saclay","ror":"https://ror.org/03xjwb503","country_code":"FR","type":"education","lineage":["https://openalex.org/I277688954"]},{"id":"https://openalex.org/I1294671590","display_name":"Centre National de la Recherche Scientifique","ror":"https://ror.org/02feahw73","country_code":"FR","type":"funder","lineage":["https://openalex.org/I1294671590"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"Sebastian Volz","raw_affiliation_strings":["CNRS Centralexupelec, Universit\u00e9 Paris-Saclay Grande Voie des Vignes, Chatenay-Malabry, France"],"affiliations":[{"raw_affiliation_string":"CNRS Centralexupelec, Universit\u00e9 Paris-Saclay Grande Voie des Vignes, Chatenay-Malabry, France","institution_ids":["https://openalex.org/I277688954","https://openalex.org/I1294671590"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5041539253","display_name":"Haoxue Han","orcid":"https://orcid.org/0000-0002-2637-118X"},"institutions":[{"id":"https://openalex.org/I31512782","display_name":"Technical University of Darmstadt","ror":"https://ror.org/05n911h24","country_code":"DE","type":"education","lineage":["https://openalex.org/I31512782"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Haoxue Han","raw_affiliation_strings":["Theoretische Physikalische Chemie, Technische Universit\u00e4t Darmstadt Alarich-Weiss-Stra\u00dfe 4, Darmstadt, Germany"],"affiliations":[{"raw_affiliation_string":"Theoretische Physikalische Chemie, Technische Universit\u00e4t Darmstadt Alarich-Weiss-Stra\u00dfe 4, Darmstadt, Germany","institution_ids":["https://openalex.org/I31512782"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5071029234"],"corresponding_institution_ids":["https://openalex.org/I1294671590","https://openalex.org/I277688954"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.10951247,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"301","last_page":"303"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectronics","display_name":"Microelectronics","score":0.8811744451522827},{"id":"https://openalex.org/keywords/graphene","display_name":"Graphene","score":0.835709810256958},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.7326359152793884},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7196168899536133},{"id":"https://openalex.org/keywords/graphite","display_name":"Graphite","score":0.7167168855667114},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5994502902030945},{"id":"https://openalex.org/keywords/surface-modification","display_name":"Surface modification","score":0.5237374305725098},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.4744105041027069},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.46980270743370056},{"id":"https://openalex.org/keywords/heat-spreader","display_name":"Heat spreader","score":0.46312791109085083},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.45070382952690125},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.35972627997398376},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3287198543548584},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3005755543708801},{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.2446286976337433},{"id":"https://openalex.org/keywords/chemical-engineering","display_name":"Chemical engineering","score":0.18101873993873596},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.15934309363365173},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.08670523762702942},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.059804946184158325}],"concepts":[{"id":"https://openalex.org/C187937830","wikidata":"https://www.wikidata.org/wiki/Q175403","display_name":"Microelectronics","level":2,"score":0.8811744451522827},{"id":"https://openalex.org/C30080830","wikidata":"https://www.wikidata.org/wiki/Q169917","display_name":"Graphene","level":2,"score":0.835709810256958},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.7326359152793884},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7196168899536133},{"id":"https://openalex.org/C2779698641","wikidata":"https://www.wikidata.org/wiki/Q5309","display_name":"Graphite","level":2,"score":0.7167168855667114},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5994502902030945},{"id":"https://openalex.org/C115537861","wikidata":"https://www.wikidata.org/wiki/Q7645993","display_name":"Surface modification","level":2,"score":0.5237374305725098},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4744105041027069},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.46980270743370056},{"id":"https://openalex.org/C48632124","wikidata":"https://www.wikidata.org/wiki/Q617088","display_name":"Heat spreader","level":3,"score":0.46312791109085083},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.45070382952690125},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.35972627997398376},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3287198543548584},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3005755543708801},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.2446286976337433},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.18101873993873596},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.15934309363365173},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08670523762702942},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.059804946184158325},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/patmos.2016.7833704","is_oa":false,"landing_page_url":"https://doi.org/10.1109/patmos.2016.7833704","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 26th International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5099999904632568}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2014935324","https://openalex.org/W2025588260","https://openalex.org/W2057626905","https://openalex.org/W2070488532","https://openalex.org/W2146082910","https://openalex.org/W2156111849","https://openalex.org/W2298606405"],"related_works":["https://openalex.org/W132864351","https://openalex.org/W2790445635","https://openalex.org/W2066200948","https://openalex.org/W2130095517","https://openalex.org/W2140614965","https://openalex.org/W2006022585","https://openalex.org/W1615119256","https://openalex.org/W2592909704","https://openalex.org/W3011034948","https://openalex.org/W2597208827"],"abstract_inverted_index":{"Thermal":[0],"management":[1],"of":[2,16],"nano/microelectronic":[3],"chips":[4],"now":[5],"includes":[6],"heat":[7,42],"spreader":[8],"elements":[9],"that":[10],"allow":[11],"for":[12],"decaying":[13],"the":[14],"temperature":[15],"local":[17],"hot":[18],"spots.":[19],"Graphite":[20],"films":[21,36],"are":[22],"already":[23],"in":[24,26],"use":[25],"commercial":[27],"products.":[28],"We":[29],"will":[30],"show":[31],"how":[32],"few":[33],"layer":[34],"graphene":[35],"can":[37],"be":[38],"used":[39],"to":[40],"enhance":[41],"dissipation":[43],"especially":[44],"using":[45],"chemical":[46],"functionalization":[47],"based":[48],"both":[49],"on":[50,53],"demonstrators":[51],"and":[52],"theoretical":[54],"investigations.":[55]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}