{"id":"https://openalex.org/W3217082324","doi":"https://doi.org/10.1109/norcas53631.2021.9599855","title":"Powerline Communication System-on-Chip in 180 nm Harsh Environment SOI Technology","display_name":"Powerline Communication System-on-Chip in 180 nm Harsh Environment SOI Technology","publication_year":2021,"publication_date":"2021-10-26","ids":{"openalex":"https://openalex.org/W3217082324","doi":"https://doi.org/10.1109/norcas53631.2021.9599855","mag":"3217082324"},"language":"en","primary_location":{"id":"doi:10.1109/norcas53631.2021.9599855","is_oa":false,"landing_page_url":"https://doi.org/10.1109/norcas53631.2021.9599855","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Nordic Circuits and Systems Conference (NorCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref","datacite"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://doi.org/10.15488/13273","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5063647560","display_name":"Tobias Stuckenberg","orcid":"https://orcid.org/0000-0002-9245-3167"},"institutions":[{"id":"https://openalex.org/I114112103","display_name":"Leibniz University Hannover","ror":"https://ror.org/0304hq317","country_code":"DE","type":"education","lineage":["https://openalex.org/I114112103"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"Tobias Stuckenberg","raw_affiliation_strings":["Institute of Microelectronic Systems, Leibniz Universität Hannover,Hanover,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronic Systems, Leibniz Universität Hannover,Hanover,Germany","institution_ids":["https://openalex.org/I114112103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040965717","display_name":"Malte R\u00fccker","orcid":null},"institutions":[{"id":"https://openalex.org/I4210146965","display_name":"Baker Hughes (Germany)","ror":"https://ror.org/04z8wqp73","country_code":"DE","type":"company","lineage":["https://openalex.org/I257179599","https://openalex.org/I4210146965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Malte Rucker","raw_affiliation_strings":["Drilling Services, Baker Hughes,Ceile,Germany","Drilling Services, Baker Hughes, Ceile, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Drilling Services, Baker Hughes,Ceile,Germany","institution_ids":["https://openalex.org/I4210146965"]},{"raw_affiliation_string":"Drilling Services, Baker Hughes, Ceile, Germany","institution_ids":["https://openalex.org/I4210146965"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051467039","display_name":"Niklas Rother","orcid":"https://orcid.org/0000-0001-6374-3379"},"institutions":[{"id":"https://openalex.org/I114112103","display_name":"Leibniz University Hannover","ror":"https://ror.org/0304hq317","country_code":"DE","type":"education","lineage":["https://openalex.org/I114112103"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Niklas Rother","raw_affiliation_strings":["Institute of Microelectronic Systems, Leibniz Universität Hannover,Hanover,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronic Systems, Leibniz Universität Hannover,Hanover,Germany","institution_ids":["https://openalex.org/I114112103"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026424241","display_name":"Rochus Nowosielski","orcid":null},"institutions":[{"id":"https://openalex.org/I4210146965","display_name":"Baker Hughes (Germany)","ror":"https://ror.org/04z8wqp73","country_code":"DE","type":"company","lineage":["https://openalex.org/I257179599","https://openalex.org/I4210146965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Rochus Nowosielski","raw_affiliation_strings":["Drilling Services, Baker Hughes,Ceile,Germany","Drilling Services, Baker Hughes, Ceile, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Drilling Services, Baker Hughes,Ceile,Germany","institution_ids":["https://openalex.org/I4210146965"]},{"raw_affiliation_string":"Drilling Services, Baker Hughes, Ceile, Germany","institution_ids":["https://openalex.org/I4210146965"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026879894","display_name":"Frank Wiese","orcid":null},"institutions":[{"id":"https://openalex.org/I4210146965","display_name":"Baker Hughes (Germany)","ror":"https://ror.org/04z8wqp73","country_code":"DE","type":"company","lineage":["https://openalex.org/I257179599","https://openalex.org/I4210146965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Frank Wiese","raw_affiliation_strings":["Drilling Services, Baker Hughes,Ceile,Germany","Drilling Services, Baker Hughes, Ceile, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Drilling Services, Baker Hughes,Ceile,Germany","institution_ids":["https://openalex.org/I4210146965"]},{"raw_affiliation_string":"Drilling Services, Baker Hughes, Ceile, Germany","institution_ids":["https://openalex.org/I4210146965"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016532646","display_name":"Holger Blume","orcid":"https://orcid.org/0000-0002-0640-6875"},"institutions":[{"id":"https://openalex.org/I114112103","display_name":"Leibniz University Hannover","ror":"https://ror.org/0304hq317","country_code":"DE","type":"education","lineage":["https://openalex.org/I114112103"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Holger Blume","raw_affiliation_strings":["Institute of Microelectronic Systems, Leibniz Universität Hannover,Hanover,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronic Systems, Leibniz Universität Hannover,Hanover,Germany","institution_ids":["https://openalex.org/I114112103"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5063647560"],"corresponding_institution_ids":["https://openalex.org/I114112103"],"apc_list":null,"apc_paid":null,"fwci":0.4067,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.62117619,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/megabit","display_name":"Megabit","score":0.5890523195266724},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5803808569908142},{"id":"https://openalex.org/keywords/power-line-communication","display_name":"Power-line communication","score":0.5484548211097717},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5297958254814148},{"id":"https://openalex.org/keywords/orthogonal-frequency-division-multiplexing","display_name":"Orthogonal frequency-division multiplexing","score":0.4862014651298523},{"id":"https://openalex.org/keywords/communications-system","display_name":"Communications system","score":0.4668239951133728},{"id":"https://openalex.org/keywords/application-specific-integrated-circuit","display_name":"Application-specific integrated circuit","score":0.4317968487739563},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.42459559440612793},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4217313528060913},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.4128516912460327},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3604552149772644},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3038260340690613},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.21114030480384827},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.16472458839416504},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.13609391450881958},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.09538069367408752}],"concepts":[{"id":"https://openalex.org/C185177783","wikidata":"https://www.wikidata.org/wiki/Q3332814","display_name":"Megabit","level":2,"score":0.5890523195266724},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5803808569908142},{"id":"https://openalex.org/C132885549","wikidata":"https://www.wikidata.org/wiki/Q271870","display_name":"Power-line communication","level":3,"score":0.5484548211097717},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5297958254814148},{"id":"https://openalex.org/C40409654","wikidata":"https://www.wikidata.org/wiki/Q375889","display_name":"Orthogonal frequency-division multiplexing","level":3,"score":0.4862014651298523},{"id":"https://openalex.org/C101765175","wikidata":"https://www.wikidata.org/wiki/Q577764","display_name":"Communications system","level":2,"score":0.4668239951133728},{"id":"https://openalex.org/C77390884","wikidata":"https://www.wikidata.org/wiki/Q217302","display_name":"Application-specific integrated circuit","level":2,"score":0.4317968487739563},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.42459559440612793},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4217313528060913},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.4128516912460327},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3604552149772644},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3038260340690613},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.21114030480384827},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.16472458839416504},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.13609391450881958},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.09538069367408752},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.0},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/norcas53631.2021.9599855","is_oa":false,"landing_page_url":"https://doi.org/10.1109/norcas53631.2021.9599855","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Nordic Circuits and Systems Conference (NorCAS)","raw_type":"proceedings-article"},{"id":"pmh:oai:www.repo.uni-hannover.de:123456789/13382","is_oa":false,"landing_page_url":"https://www.repo.uni-hannover.de/handle/123456789/13382","pdf_url":null,"source":{"id":"https://openalex.org/S4306401575","display_name":"Institutional Repository of Leibniz Universit\u00e4t Hannover (Leibniz Universit\u00e4t Hannover)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I114112103","host_organization_name":"Leibniz University Hannover","host_organization_lineage":["https://openalex.org/I114112103"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2021 IEEE Nordic Circuits and Systems Conference (NorCAS)","raw_type":"status-type:acceptedVersion"},{"id":"doi:10.15488/13273","is_oa":true,"landing_page_url":"https://doi.org/10.15488/13273","pdf_url":null,"source":{"id":"https://openalex.org/S7407052956","display_name":"Leibniz Universit\u00e4t Hannover","issn_l":null,"issn":[],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":null,"raw_type":"article-journal"}],"best_oa_location":{"id":"doi:10.15488/13273","is_oa":true,"landing_page_url":"https://doi.org/10.15488/13273","pdf_url":null,"source":{"id":"https://openalex.org/S7407052956","display_name":"Leibniz Universit\u00e4t Hannover","issn_l":null,"issn":[],"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"article-journal"},"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2004400944","https://openalex.org/W2004523524","https://openalex.org/W2037749827","https://openalex.org/W2079270567","https://openalex.org/W2126682372","https://openalex.org/W2131862714","https://openalex.org/W2781539221","https://openalex.org/W3019966218","https://openalex.org/W4250790217","https://openalex.org/W6943758076"],"related_works":["https://openalex.org/W2393297133","https://openalex.org/W2125964821","https://openalex.org/W3005377058","https://openalex.org/W2385415149","https://openalex.org/W2545563450","https://openalex.org/W2907465462","https://openalex.org/W2161515892","https://openalex.org/W2366811818","https://openalex.org/W2546705843","https://openalex.org/W2372552615"],"abstract_inverted_index":{"Broadband":[0],"powerline":[1,46,56,107,226],"communication":[2,57,108,119,133,167,227],"systems":[3,58],"using":[4,186],"Orthogonal":[5],"Frequency":[6],"Division":[7],"Multiplexing":[8],"(OFDM)":[9],"can":[10,110],"utilize":[11],"existing":[12],"power":[13,20],"lines":[14],"to":[15,74,150],"transmit":[16],"data":[17,178],"packets":[18],"alongside":[19],"distribution.":[21],"Recent":[22],"standards":[23,38],"focus":[24],"towards":[25,33],"high":[26,182],"speed":[27,41],"multi-media":[28],"in-house":[29,45],"streaming.":[30],"With":[31],"improvements":[32],"robustness":[34,120],"and":[35,42,70,95,102,117,130,161,175,191],"throughput":[36],"new":[37],"increase":[39,118],"the":[40,53,112,187,193,200,215,218,223],"reliability":[43],"of":[44,55,66,114,148,196,207,217],"systems.":[47],"A":[48],"very":[49],"different":[50],"approach":[51],"is":[52,136,155,180,206,222,230],"use":[54],"in":[59,82,138,199],"a":[60,100,106,125,163],"deep":[61],"drilling":[62],"environment":[63,84,127,171,212],"where":[64],"temperatures":[65,147],"more":[67,89,97],"than":[68,90],"150\u00b0C":[69],"pressure":[71],"levels":[72],"up":[73,149],"30":[75],"000":[76],"psi":[77],"are":[78,96],"present.":[79],"Typical":[80],"applications":[81],"this":[83,221],"usually":[85],"do":[86],"not":[87],"require":[88],"several":[91],"kbit/ys":[92],"per":[93],"node":[94],"reliant":[98],"on":[99],"stable":[101],"continuous":[103],"connection.":[104],"Here,":[105],"system":[109],"reduce":[111],"amount":[113],"wiring":[115],"needed":[116],"significantly.":[121],"This":[122],"work":[123],"provides":[124],"harsh":[126,211,234],"suitable,":[128],"reliable":[129],"standard":[131],"compliant":[132],"ASIC":[134,228],"that":[135],"manufactured":[137],"XFAB":[139],"180":[140],"nm":[141],"Silicon-On-Insulator":[142],"(SOI)":[143],"technology":[144],"allowing":[145],"operating":[146],"175\u00b0C.":[151],"The":[152,177],"die":[153],"size":[154],"5.25":[156,159],"mm":[157,160],"x":[158],"contains":[162],"complete":[164],"Homeplug":[165],"1.0":[166],"stack":[168],"with":[169],"an":[170],"for":[172,210,233],"boot,":[173],"interfacing":[174],"debugging.":[176],"rate":[179],"as":[181,183],"6.1":[184],"Mbit/s":[185,198],"fastest":[188],"transmission":[189],"mode":[190,204],"reaches":[192],"theoretical":[194],"maximum":[195],"0.55":[197],"robust":[201],"OFDM":[202],"(ROBO)":[203],"which":[205,229],"particular":[208],"interest":[209],"applications.":[213],"To":[214],"best":[216],"authors":[219],"knowledge,":[220],"first":[224],"OFDM-based":[225],"particularly":[231],"designed":[232],"environment.":[235]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":1}],"updated_date":"2026-05-17T08:19:37.847499","created_date":"2025-10-10T00:00:00"}