{"id":"https://openalex.org/W3215782979","doi":"https://doi.org/10.1109/norcas53631.2021.9599649","title":"Signal Integrity in High Speed 3D IC Design- A Case Study","display_name":"Signal Integrity in High Speed 3D IC Design- A Case Study","publication_year":2021,"publication_date":"2021-10-26","ids":{"openalex":"https://openalex.org/W3215782979","doi":"https://doi.org/10.1109/norcas53631.2021.9599649","mag":"3215782979"},"language":"en","primary_location":{"id":"doi:10.1109/norcas53631.2021.9599649","is_oa":false,"landing_page_url":"https://doi.org/10.1109/norcas53631.2021.9599649","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Nordic Circuits and Systems Conference (NorCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5034033798","display_name":"Shadi M. Harb","orcid":"https://orcid.org/0000-0001-8146-2837"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Shadi MS Harb","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5061760483","display_name":"W.R. Eisenstadt","orcid":"https://orcid.org/0000-0003-2920-6638"},"institutions":[{"id":"https://openalex.org/I33213144","display_name":"University of Florida","ror":"https://ror.org/02y3ad647","country_code":"US","type":"education","lineage":["https://openalex.org/I33213144"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"William Eisenstadt","raw_affiliation_strings":["University of Florida, Gainesville, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Florida, Gainesville, FL, USA","institution_ids":["https://openalex.org/I33213144"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.1439463,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/signal-integrity","display_name":"Signal integrity","score":0.941912055015564},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5907093286514282},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5520945191383362},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5500657558441162},{"id":"https://openalex.org/keywords/signal","display_name":"SIGNAL (programming language)","score":0.5488631129264832},{"id":"https://openalex.org/keywords/hfss","display_name":"HFSS","score":0.4893200099468231},{"id":"https://openalex.org/keywords/routing","display_name":"Routing (electronic design automation)","score":0.44737163186073303},{"id":"https://openalex.org/keywords/parasitic-extraction","display_name":"Parasitic extraction","score":0.43679916858673096},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.42523714900016785},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.4228998124599457},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.2872222065925598},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.28336912393569946},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.26682865619659424},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.18176743388175964},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11365392804145813}],"concepts":[{"id":"https://openalex.org/C44938667","wikidata":"https://www.wikidata.org/wiki/Q4503810","display_name":"Signal integrity","level":3,"score":0.941912055015564},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5907093286514282},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5520945191383362},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5500657558441162},{"id":"https://openalex.org/C2779843651","wikidata":"https://www.wikidata.org/wiki/Q7390335","display_name":"SIGNAL (programming language)","level":2,"score":0.5488631129264832},{"id":"https://openalex.org/C2776844852","wikidata":"https://www.wikidata.org/wiki/Q106872782","display_name":"HFSS","level":4,"score":0.4893200099468231},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.44737163186073303},{"id":"https://openalex.org/C159818811","wikidata":"https://www.wikidata.org/wiki/Q7135947","display_name":"Parasitic extraction","level":2,"score":0.43679916858673096},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.42523714900016785},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.4228998124599457},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.2872222065925598},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.28336912393569946},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.26682865619659424},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.18176743388175964},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11365392804145813},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C170349913","wikidata":"https://www.wikidata.org/wiki/Q13402882","display_name":"Microstrip antenna","level":3,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C21822782","wikidata":"https://www.wikidata.org/wiki/Q131214","display_name":"Antenna (radio)","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/norcas53631.2021.9599649","is_oa":false,"landing_page_url":"https://doi.org/10.1109/norcas53631.2021.9599649","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE Nordic Circuits and Systems Conference (NorCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.4099999964237213,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W2031964120","https://openalex.org/W2046574526","https://openalex.org/W2103369846","https://openalex.org/W2107304970","https://openalex.org/W2122636510","https://openalex.org/W2151703353","https://openalex.org/W2245093762","https://openalex.org/W2523506906","https://openalex.org/W2579431025","https://openalex.org/W2984539211","https://openalex.org/W2988930073","https://openalex.org/W3048240443","https://openalex.org/W4230104114","https://openalex.org/W4285719527","https://openalex.org/W6676317001","https://openalex.org/W6690985096"],"related_works":["https://openalex.org/W2051506849","https://openalex.org/W2141067179","https://openalex.org/W2019635822","https://openalex.org/W2163646864","https://openalex.org/W1970480028","https://openalex.org/W2287031256","https://openalex.org/W2250058922","https://openalex.org/W1997735522","https://openalex.org/W1998684091","https://openalex.org/W2142764951"],"abstract_inverted_index":{"3D":[0,22,60,86,105,123],"stacking":[1],"technology":[2],"presents":[3],"benefits":[4],"over":[5],"2D":[6],"by":[7],"providing":[8],"an":[9],"increased":[10],"packing":[11],"density,":[12],"however,":[13],"signal":[14,28,54],"routing":[15],"complexity":[16],"increases":[17],"significantly.":[18],"Moreover,":[19],"the":[20,110,122],"high-density":[21],"vertical":[23],"interconnects":[24],"can":[25,41,119],"cause":[26],"additional":[27],"integrity":[29,55],"degradation":[30],"due":[31],"to":[32,84],"parasitics":[33],"from":[34],"different":[35],"directions":[36],"and":[37,56,76,89,95],"coupling":[38],"noise.":[39],"This":[40,46],"severely":[42],"impact":[43],"system":[44],"performance.":[45],"paper":[47],"shows":[48],"a":[49,102],"detailed":[50],"case":[51],"study":[52],"of":[53],"electrical":[57,125],"modeling":[58],"for":[59],"Vias":[61],"based":[62,108],"on":[63,109],"MIT":[64],"0.15":[65],"\u00b5m":[66],"3DFDSOI":[67],"process":[68],"technology.":[69],"The":[70],"three-dimensional":[71],"EM":[72],"field":[73],"solver":[74],"(HFSS)":[75],"Advanced":[77],"System":[78],"Design":[79],"simulator":[80],"(ADS)":[81],"are":[82],"used":[83],"conduct":[85],"circuit":[87,104],"analysis":[88],"simulations":[90],"in":[91],"both":[92],"frequency":[93],"(S-Parameters)":[94],"time":[96],"(Eye":[97],"Diagram)":[98],"domains.":[99],"In":[100],"addition,":[101],"proposed":[103],"test":[106],"architecture":[107],"Gunning":[111],"Transceiver":[112],"Logic":[113],"(GTL)":[114],"I/O":[115],"is":[116],"proposed,":[117],"which":[118],"potentially":[120],"validate":[121],"Via":[124],"modeling.":[126]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}