{"id":"https://openalex.org/W4385624843","doi":"https://doi.org/10.1109/newcas57931.2023.10198138","title":"Toward 2.5D Structures for Multi-Channel MEMS Acoustic-Based Digital Isolators using Through Silicon Openings","display_name":"Toward 2.5D Structures for Multi-Channel MEMS Acoustic-Based Digital Isolators using Through Silicon Openings","publication_year":2023,"publication_date":"2023-06-26","ids":{"openalex":"https://openalex.org/W4385624843","doi":"https://doi.org/10.1109/newcas57931.2023.10198138"},"language":"en","primary_location":{"id":"doi:10.1109/newcas57931.2023.10198138","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/newcas57931.2023.10198138","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5092835375","display_name":"Hamid Sadrimanesh","orcid":null},"institutions":[{"id":"https://openalex.org/I9736820","display_name":"\u00c9cole de Technologie Sup\u00e9rieure","ror":"https://ror.org/0020snb74","country_code":"CA","type":"education","lineage":["https://openalex.org/I49663120","https://openalex.org/I9736820"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Hamid Sadrimanesh","raw_affiliation_strings":["École de technologie supérieure,Dept. of Electrical Engineering,Montreal,QC,Canada"],"affiliations":[{"raw_affiliation_string":"École de technologie supérieure,Dept. of Electrical Engineering,Montreal,QC,Canada","institution_ids":["https://openalex.org/I9736820"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071840145","display_name":"Yves Blaqui\u00e8re","orcid":"https://orcid.org/0000-0001-6204-7427"},"institutions":[{"id":"https://openalex.org/I9736820","display_name":"\u00c9cole de Technologie Sup\u00e9rieure","ror":"https://ror.org/0020snb74","country_code":"CA","type":"education","lineage":["https://openalex.org/I49663120","https://openalex.org/I9736820"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Yves Blaqui\u00e8re","raw_affiliation_strings":["École de technologie supérieure,Dept. of Electrical Engineering,Montreal,QC,Canada"],"affiliations":[{"raw_affiliation_string":"École de technologie supérieure,Dept. of Electrical Engineering,Montreal,QC,Canada","institution_ids":["https://openalex.org/I9736820"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5058919102","display_name":"Fr\u00e9d\u00e9ric Nabki","orcid":"https://orcid.org/0000-0002-2281-7172"},"institutions":[{"id":"https://openalex.org/I9736820","display_name":"\u00c9cole de Technologie Sup\u00e9rieure","ror":"https://ror.org/0020snb74","country_code":"CA","type":"education","lineage":["https://openalex.org/I49663120","https://openalex.org/I9736820"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Frederic Nabki","raw_affiliation_strings":["École de technologie supérieure,Dept. of Electrical Engineering,Montreal,QC,Canada"],"affiliations":[{"raw_affiliation_string":"École de technologie supérieure,Dept. of Electrical Engineering,Montreal,QC,Canada","institution_ids":["https://openalex.org/I9736820"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5092835375"],"corresponding_institution_ids":["https://openalex.org/I9736820"],"apc_list":null,"apc_paid":null,"fwci":0.1337,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.43054945,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13885","display_name":"Geophysics and Sensor Technology","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2212","display_name":"Ocean Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/isolator","display_name":"Isolator","score":0.773756742477417},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.6730135083198547},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.5503333806991577},{"id":"https://openalex.org/keywords/transmitter","display_name":"Transmitter","score":0.5473818182945251},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.5384684801101685},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.4990043640136719},{"id":"https://openalex.org/keywords/conical-surface","display_name":"Conical surface","score":0.4881301820278168},{"id":"https://openalex.org/keywords/channel","display_name":"Channel (broadcasting)","score":0.46220871806144714},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.45715755224227905},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.45328783988952637},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.44976574182510376},{"id":"https://openalex.org/keywords/transmission","display_name":"Transmission (telecommunications)","score":0.41608214378356934},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.35412439703941345},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.29713165760040283},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.28429746627807617},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.27813196182250977},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2343498170375824},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10289809107780457}],"concepts":[{"id":"https://openalex.org/C54888747","wikidata":"https://www.wikidata.org/wiki/Q962002","display_name":"Isolator","level":2,"score":0.773756742477417},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6730135083198547},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.5503333806991577},{"id":"https://openalex.org/C47798520","wikidata":"https://www.wikidata.org/wiki/Q190157","display_name":"Transmitter","level":3,"score":0.5473818182945251},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5384684801101685},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.4990043640136719},{"id":"https://openalex.org/C124961601","wikidata":"https://www.wikidata.org/wiki/Q2518149","display_name":"Conical surface","level":2,"score":0.4881301820278168},{"id":"https://openalex.org/C127162648","wikidata":"https://www.wikidata.org/wiki/Q16858953","display_name":"Channel (broadcasting)","level":2,"score":0.46220871806144714},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.45715755224227905},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.45328783988952637},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.44976574182510376},{"id":"https://openalex.org/C761482","wikidata":"https://www.wikidata.org/wiki/Q118093","display_name":"Transmission (telecommunications)","level":2,"score":0.41608214378356934},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.35412439703941345},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.29713165760040283},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.28429746627807617},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.27813196182250977},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2343498170375824},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10289809107780457},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/newcas57931.2023.10198138","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/newcas57931.2023.10198138","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)","raw_type":"proceedings-article"},{"id":"pmh:oai:espace2.etsmtl.ca:27668","is_oa":false,"landing_page_url":"https://espace2.etsmtl.ca/id/eprint/27668/","pdf_url":null,"source":{"id":"https://openalex.org/S4306402392","display_name":"Espace \u00c9TS (ETS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1341030882","host_organization_name":"Educational Testing Service","host_organization_lineage":["https://openalex.org/I1341030882"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Compte rendu de conf\u00e9rence"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6700000166893005,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1514686989","https://openalex.org/W2127317932","https://openalex.org/W2795173406","https://openalex.org/W2899361845","https://openalex.org/W2913232413","https://openalex.org/W3212229486","https://openalex.org/W4200084990","https://openalex.org/W4200262001","https://openalex.org/W4211130757","https://openalex.org/W4313647032","https://openalex.org/W4316464920"],"related_works":["https://openalex.org/W2035329725","https://openalex.org/W2384049289","https://openalex.org/W4376641153","https://openalex.org/W2272290532","https://openalex.org/W2050788868","https://openalex.org/W2032687465","https://openalex.org/W4250391473","https://openalex.org/W4302292679","https://openalex.org/W2184170131","https://openalex.org/W2330571978"],"abstract_inverted_index":{"In":[0],"this":[1,58,107],"paper,":[2],"a":[3,100,123,126,152],"piezoelectric":[4],"MEMS-based":[5],"digital":[6,119],"isolator":[7,120],"by":[8,121],"the":[9,18,38,53,65,79,84,93,114,117,136,139,143,145,149,156,167],"medium":[10],"of":[11,47,55,116,138,148,161],"air":[12],"for":[13,33,102],"transferring":[14],"ultrasound":[15],"waves":[16],"between":[17,67],"transmitter":[19],"(Tx)":[20],"and":[21,69,74],"receiver":[22],"(Rx)":[23],"is":[24,30,42,49,72,89,98,110],"presented.":[25],"A":[26],"front-to-back":[27,45,94],"2.5-dimensional":[28],"structure":[29,61],"also":[31],"presented":[32],"assembling":[34],"MEMS":[35],"dice":[36,48],"in":[37,57,92,164],"piezoMUMPs":[39],"process.":[40,59],"It":[41],"demonstrated":[43],"that":[44,91,133],"stacking":[46],"possible":[50,111],"according":[51,134],"to":[52,63,83,112,135],"thickness":[54],"layers":[56],"This":[60],"allows":[62],"minimize":[64,113],"distance":[66],"Tx":[68],"Rx,":[70],"which":[71],"reduced":[73],"shows":[75],"43%":[76],"improvement":[77],"with":[78,166],"piezoMUMPS":[80],"process":[81],"compared":[82],"conventional":[85],"method.":[86],"Also,":[87],"it":[88,109],"explained":[90],"bonding":[95],"technique,":[96],"there":[97],"only":[99],"need":[101],"top-side":[103],"wire":[104],"bonding.":[105],"Through":[106],"process,":[108],"size":[115],"final":[118],"defining":[122],"waveguide":[124],"utilizing":[125],"through":[127],"silicon":[128],"opening":[129],"(TSO).":[130],"Simulations":[131],"show":[132],"behavior":[137],"sound":[140],"wave":[141],"inside":[142],"openings,":[144],"conical":[146],"shape":[147],"TSO":[150],"has":[151],"direct":[153],"effect":[154],"on":[155],"transmission":[157],"bit":[158],"rate":[159],"(improvement":[160],"3.5":[162],"times)":[163],"contrast":[165],"straight":[168],"one.":[169]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2025-12-19T19:40:27.379048","created_date":"2025-10-10T00:00:00"}