{"id":"https://openalex.org/W4385624979","doi":"https://doi.org/10.1109/newcas57931.2023.10198099","title":"Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect","display_name":"Design and Experimental Evaluation of 60 GHz Self-compensating Bond-wire Interconnect","publication_year":2023,"publication_date":"2023-06-26","ids":{"openalex":"https://openalex.org/W4385624979","doi":"https://doi.org/10.1109/newcas57931.2023.10198099"},"language":"en","primary_location":{"id":"doi:10.1109/newcas57931.2023.10198099","is_oa":false,"landing_page_url":"https://doi.org/10.1109/newcas57931.2023.10198099","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5084143208","display_name":"Rabia Riaz","orcid":"https://orcid.org/0000-0001-5748-3005"},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Rabia Fatima Riaz","raw_affiliation_strings":["Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001982662","display_name":"Florian Protze","orcid":"https://orcid.org/0000-0002-6950-6814"},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Florian Protze","raw_affiliation_strings":["Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072097485","display_name":"Christian Hoyer","orcid":"https://orcid.org/0000-0003-2197-6080"},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Christian Hoyer","raw_affiliation_strings":["Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064083721","display_name":"Jens Wagner","orcid":"https://orcid.org/0000-0001-6778-7846"},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Jens Wagner","raw_affiliation_strings":["Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany","institution_ids":["https://openalex.org/I78650965"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049816054","display_name":"Frank Ellinger","orcid":"https://orcid.org/0000-0001-6714-0479"},"institutions":[{"id":"https://openalex.org/I78650965","display_name":"Technische Universit\u00e4t Dresden","ror":"https://ror.org/042aqky30","country_code":"DE","type":"education","lineage":["https://openalex.org/I78650965"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Frank Ellinger","raw_affiliation_strings":["Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Technische Universität,Chair for Circuit Design and Network Theory,Dresden,Germany","institution_ids":["https://openalex.org/I78650965"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I78650965"],"apc_list":null,"apc_paid":null,"fwci":0.5409,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.52843132,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.836090087890625},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.688579261302948},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6295506358146667},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.623268723487854},{"id":"https://openalex.org/keywords/transmission-line","display_name":"Transmission line","score":0.5308507680892944},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5028771758079529},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.49065080285072327},{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.472127765417099},{"id":"https://openalex.org/keywords/wavelength","display_name":"Wavelength","score":0.469229519367218},{"id":"https://openalex.org/keywords/electric-power-transmission","display_name":"Electric power transmission","score":0.4492555260658264},{"id":"https://openalex.org/keywords/bond","display_name":"Bond","score":0.4349745512008667},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.43103939294815063},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3882240653038025},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.36635681986808777},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2564459443092346},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2213413417339325},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.18582797050476074},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.07468396425247192}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.836090087890625},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.688579261302948},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6295506358146667},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.623268723487854},{"id":"https://openalex.org/C33441834","wikidata":"https://www.wikidata.org/wiki/Q693004","display_name":"Transmission line","level":2,"score":0.5308507680892944},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5028771758079529},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.49065080285072327},{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.472127765417099},{"id":"https://openalex.org/C6260449","wikidata":"https://www.wikidata.org/wiki/Q41364","display_name":"Wavelength","level":2,"score":0.469229519367218},{"id":"https://openalex.org/C140311924","wikidata":"https://www.wikidata.org/wiki/Q200928","display_name":"Electric power transmission","level":2,"score":0.4492555260658264},{"id":"https://openalex.org/C69738904","wikidata":"https://www.wikidata.org/wiki/Q11693","display_name":"Bond","level":2,"score":0.4349745512008667},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.43103939294815063},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3882240653038025},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.36635681986808777},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2564459443092346},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2213413417339325},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.18582797050476074},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.07468396425247192},{"id":"https://openalex.org/C162324750","wikidata":"https://www.wikidata.org/wiki/Q8134","display_name":"Economics","level":0,"score":0.0},{"id":"https://openalex.org/C10138342","wikidata":"https://www.wikidata.org/wiki/Q43015","display_name":"Finance","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/newcas57931.2023.10198099","is_oa":false,"landing_page_url":"https://doi.org/10.1109/newcas57931.2023.10198099","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 21st IEEE Interregional NEWCAS Conference (NEWCAS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.5899999737739563}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321408","display_name":"Ministry of Education","ror":"https://ror.org/01p262204"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2043924150","https://openalex.org/W2156848499","https://openalex.org/W2247219630","https://openalex.org/W2413200804","https://openalex.org/W2571538393","https://openalex.org/W2785540003","https://openalex.org/W2943779707","https://openalex.org/W3005713003","https://openalex.org/W3211534643","https://openalex.org/W4308086333"],"related_works":["https://openalex.org/W2060249924","https://openalex.org/W1516468884","https://openalex.org/W1604868505","https://openalex.org/W2917030261","https://openalex.org/W2404132866","https://openalex.org/W3115307632","https://openalex.org/W4255886484","https://openalex.org/W787855002","https://openalex.org/W2949628984","https://openalex.org/W2096055231"],"abstract_inverted_index":{"In":[0],"this":[1,40],"paper,":[2],"a":[3,13,25,72,99,114,124],"bond-wire":[4,53],"impedance":[5],"compensation":[6],"technique":[7,115],"based":[8],"on":[9],"using":[10],"bond-wires":[11,81],"as":[12],"half-wavelength":[14],"long":[15,125],"transmission":[16],"line":[17],"is":[18,76,90,116],"designed,":[19],"implemented":[20],"and":[21,34,54,59,98,127],"experimentally":[22],"verified":[23],"for":[24],"60":[26,96],"GHz":[27,97,106,109],"interconnection":[28,48,126],"between":[29,135],"an":[30],"integrated":[31],"circuit":[32,36],"(IC)":[33],"printed":[35],"board":[37],"(PCB).":[38],"For":[39],"purpose,":[41],"electromagnetic":[42],"simulations":[43,70],"(EM)":[44],"of":[45,65,122],"the":[46,50,52,55,66,69,80,86,120,132,136],"entire":[47],"i.e.":[49],"IC,":[51],"PCB":[56],"are":[57,82],"performed":[58],"subsequently":[60],"characterized":[61],"experimentally.":[62],"The":[63],"comparison":[64],"measurements":[67],"with":[68],"shows":[71],"good":[73],"agreement.":[74],"It":[75],"found":[77],"that":[78],"although":[79],"about":[83],"2.4mm":[84],"long,":[85],"measured":[87],"insertion":[88],"loss":[89],"better":[91],"than":[92],"0.66":[93],"dB":[94,101],"at":[95],"\u221210":[100],"reflection":[102],"bandwidth":[103],"from":[104],"57.5":[105],"to":[107,118,128],"64":[108],"can":[110],"be":[111],"achieved.":[112],"Furthermore":[113],"proposed":[117],"ease":[119],"implementation":[121],"such":[123],"help":[129],"in":[130],"maintaining":[131],"desired":[133],"parallelism":[134],"bond-wires.":[137]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}