{"id":"https://openalex.org/W1978795557","doi":"https://doi.org/10.1109/newcas.2014.6933989","title":"Interconnect design tradeoffs for silicon and glass interposers","display_name":"Interconnect design tradeoffs for silicon and glass interposers","publication_year":2014,"publication_date":"2014-06-01","ids":{"openalex":"https://openalex.org/W1978795557","doi":"https://doi.org/10.1109/newcas.2014.6933989","mag":"1978795557"},"language":"en","primary_location":{"id":"doi:10.1109/newcas.2014.6933989","is_oa":false,"landing_page_url":"https://doi.org/10.1109/newcas.2014.6933989","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5032726747","display_name":"Harry Kalargaris","orcid":null},"institutions":[{"id":"https://openalex.org/I28407311","display_name":"University of Manchester","ror":"https://ror.org/027m9bs27","country_code":"GB","type":"education","lineage":["https://openalex.org/I28407311"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Harry Kalargaris","raw_affiliation_strings":["Advanced Processor Technologies Group School of Computer Science, University of Manchester","Technologies Group School of Computer Science, University of Manchester"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Processor Technologies Group School of Computer Science, University of Manchester","institution_ids":["https://openalex.org/I28407311"]},{"raw_affiliation_string":"Technologies Group School of Computer Science, University of Manchester","institution_ids":["https://openalex.org/I28407311"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5031542707","display_name":"Vasilis F. Pavlidis","orcid":"https://orcid.org/0000-0002-4063-4652"},"institutions":[{"id":"https://openalex.org/I28407311","display_name":"University of Manchester","ror":"https://ror.org/027m9bs27","country_code":"GB","type":"education","lineage":["https://openalex.org/I28407311"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Vasilis F. Pavlidis","raw_affiliation_strings":["Advanced Processor Technologies Group School of Computer Science, University of Manchester","Technologies Group School of Computer Science, University of Manchester"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Advanced Processor Technologies Group School of Computer Science, University of Manchester","institution_ids":["https://openalex.org/I28407311"]},{"raw_affiliation_string":"Technologies Group School of Computer Science, University of Manchester","institution_ids":["https://openalex.org/I28407311"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I28407311"],"apc_list":null,"apc_paid":null,"fwci":0.4078,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.4766596,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"77","last_page":"80"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.970069169998169},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.636178731918335},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6227022409439087},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.6068522930145264},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5468631386756897},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.49887728691101074},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4604206085205078},{"id":"https://openalex.org/keywords/crosstalk","display_name":"Crosstalk","score":0.43510040640830994},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.40005701780319214},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3483164608478546},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21389466524124146},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.13564011454582214},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.1091424822807312},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.0892704427242279}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.970069169998169},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.636178731918335},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6227022409439087},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.6068522930145264},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5468631386756897},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.49887728691101074},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4604206085205078},{"id":"https://openalex.org/C169822122","wikidata":"https://www.wikidata.org/wiki/Q230187","display_name":"Crosstalk","level":2,"score":0.43510040640830994},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.40005701780319214},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3483164608478546},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21389466524124146},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.13564011454582214},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.1091424822807312},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0892704427242279},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":3,"locations":[{"id":"doi:10.1109/newcas.2014.6933989","is_oa":false,"landing_page_url":"https://doi.org/10.1109/newcas.2014.6933989","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 12th International New Circuits and Systems Conference (NEWCAS)","raw_type":"proceedings-article"},{"id":"pmh:oai:pure.atira.dk:openaire_cris_publications/ba94ad7b-c3f7-4db6-9404-f29a213eadde","is_oa":false,"landing_page_url":"https://research.manchester.ac.uk/en/publications/ba94ad7b-c3f7-4db6-9404-f29a213eadde","pdf_url":null,"source":{"id":"https://openalex.org/S4306400662","display_name":"Research Explorer (The University of Manchester)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I28407311","host_organization_name":"University of Manchester","host_organization_lineage":["https://openalex.org/I28407311"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Kalargaris, H & Pavlidis, V F 2014, Interconnect design tradeoffs for silicon and glass interposers. in 2014 IEEE 12th International New Circuits and Systems Conference, NEWCAS 2014., 6933989, IEEE, pp. 77-80, 2014 12th IEEE International New Circuits and Systems Conference, NEWCAS 2014, Trois-Rivieres, Canada, 22/06/14. https://doi.org/10.1109/NEWCAS.2014.6933989","raw_type":"info:eu-repo/semantics/conferenceObject"},{"id":"pmh:oai:pure.atira.dk:publications/ba94ad7b-c3f7-4db6-9404-f29a213eadde","is_oa":false,"landing_page_url":"http://www.scopus.com/inward/record.url?scp=84914695338&partnerID=8YFLogxK","pdf_url":null,"source":{"id":"https://openalex.org/S4306400662","display_name":"Research Explorer (The University of Manchester)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I28407311","host_organization_name":"University of Manchester","host_organization_lineage":["https://openalex.org/I28407311"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Kalargaris, H & Pavlidis, V F 2014, Interconnect design tradeoffs for silicon and glass interposers. in 2014 IEEE 12th International New Circuits and Systems Conference, NEWCAS 2014., 6933989, IEEE, pp. 77-80, 2014 12th IEEE International New Circuits and Systems Conference, NEWCAS 2014, Trois-Rivieres, Canada, 22/06/14. https://doi.org/10.1109/NEWCAS.2014.6933989","raw_type":"info:eu-repo/semantics/conferenceObject"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W2012366638","https://openalex.org/W2035516509","https://openalex.org/W2102556195","https://openalex.org/W2104470240","https://openalex.org/W2110458178","https://openalex.org/W2117127294","https://openalex.org/W2119081900","https://openalex.org/W2125788370","https://openalex.org/W2154240714"],"related_works":["https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2789752821","https://openalex.org/W2205502757","https://openalex.org/W1972268475","https://openalex.org/W2235483886","https://openalex.org/W2087576454","https://openalex.org/W2528892790","https://openalex.org/W1551902604","https://openalex.org/W2117988687"],"abstract_inverted_index":{"Interposer":[0],"technologies":[1],"offer":[2],"high":[3,5,115],"density,":[4],"performance":[6,19],"interconnects":[7,80],"for":[8,81,137,170],"integrated":[9],"systems":[10],"resulting":[11],"in":[12,99,150,191],"smaller":[13],"form":[14],"factors":[15],"and":[16,41,87,104,155,180,186],"improved":[17],"system":[18],"as":[20,114,117,182,184],"compared":[21,118],"to":[22,45,69,119],"traditional":[23],"packages.":[24],"This":[25],"paper":[26],"sheds":[27],"light":[28],"on":[29,53,85,93,108,125,135],"the":[30,37,46,54,59,63,70,79,171,175,192],"different":[31,47,82,166,169],"design":[32,83,159,193],"tradeoffs":[33,177],"which":[34],"result":[35,149],"from":[36,112],"usage":[38],"of":[39,58,73,77,101],"silicon":[40,65,86,120,136],"glass":[42,88,94,109,126],"interposers":[43,89,95,110,127],"due":[44,68],"material":[48],"characteristics.":[49],"The":[50,157],"emphasis":[51],"is":[52],"redistribution":[55],"layers":[56],"(RDLs)":[57],"interposer":[60],"rather":[61],"than":[62,134],"through":[64],"vias":[66],"(TSVs)":[67],"long":[71],"length":[72],"these":[74,163],"wires.":[75],"Guidelines":[76],"designing":[78],"objectives":[84,164],"are":[90,96,168],"presented.":[91],"Interconnects":[92,124],"more":[97],"efficient":[98],"terms":[100],"power":[102,153,185],"dissipation":[103],"delay.":[105],"Conversely,":[106],"wires":[107],"suffer":[111],"twice":[113],"crosstalk":[116],"at":[121,140],"minimum":[122,145,151],"pitch.":[123],"exhibit":[128],"35%":[129],"better":[130],"power-delay":[131],"product":[132],"(PDP)":[133],"fixed":[138],"pitch":[139,146],"1.95":[141],"\u03bcm.":[142],"More":[143],"importantly,":[144],"does":[147],"not":[148],"delay,":[152],"dissipation,":[154],"crosstalk.":[156],"interconnect":[158],"parameters":[160],"that":[161],"satisfy":[162],"under":[165],"constraints":[167],"two":[172],"materials.":[173],"Consequently,":[174],"various":[176],"between":[178],"area":[179],"noise":[181],"well":[183],"delay":[187],"must":[188],"be":[189],"considered":[190],"process.":[194]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":2},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":1}],"updated_date":"2026-08-12T21:12:35.861297","created_date":"2025-10-10T00:00:00"}