{"id":"https://openalex.org/W3174754790","doi":"https://doi.org/10.1109/nems51815.2021.9451486","title":"A Piezoresistive Pressure Microsensor Based on Simplified Fabrication Processes","display_name":"A Piezoresistive Pressure Microsensor Based on Simplified Fabrication Processes","publication_year":2021,"publication_date":"2021-04-25","ids":{"openalex":"https://openalex.org/W3174754790","doi":"https://doi.org/10.1109/nems51815.2021.9451486","mag":"3174754790"},"language":"en","primary_location":{"id":"doi:10.1109/nems51815.2021.9451486","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems51815.2021.9451486","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5013413127","display_name":"Qinggang Meng","orcid":"https://orcid.org/0000-0002-4269-7331"},"institutions":[{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qinggang Meng","raw_affiliation_strings":["School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5050851728","display_name":"Yulan Lu","orcid":"https://orcid.org/0000-0003-3826-5998"},"institutions":[{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yulan Lu","raw_affiliation_strings":["School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5109218676","display_name":"Junbo Wang","orcid":"https://orcid.org/0000-0002-6032-1274"},"institutions":[{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junbo Wang","raw_affiliation_strings":["School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049215297","display_name":"Deyong Chen","orcid":"https://orcid.org/0000-0001-5856-3592"},"institutions":[{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Deyong Chen","raw_affiliation_strings":["School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100326500","display_name":"Jian Chen","orcid":"https://orcid.org/0000-0003-4612-3279"},"institutions":[{"id":"https://openalex.org/I4210165038","display_name":"University of Chinese Academy of Sciences","ror":"https://ror.org/05qbk4x57","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210165038"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jian Chen","raw_affiliation_strings":["School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I4210165038"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101115987","display_name":"Bo Xie","orcid":null},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I4210107198","display_name":"State Key Laboratory of Transducer Technology","ror":"https://ror.org/01qg56n75","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366","https://openalex.org/I19820366","https://openalex.org/I4210107198","https://openalex.org/I4210110458","https://openalex.org/I4210147322"]},{"id":"https://openalex.org/I4210137199","display_name":"Aerospace Information Research Institute","ror":"https://ror.org/0419fj215","country_code":"CN","type":"education","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210137199"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Xie","raw_affiliation_strings":["State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing, China","institution_ids":["https://openalex.org/I19820366","https://openalex.org/I4210107198","https://openalex.org/I4210137199"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1465","last_page":"1469"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.833166241645813},{"id":"https://openalex.org/keywords/piezoresistive-effect","display_name":"Piezoresistive effect","score":0.8214534521102905},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.8097749352455139},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.6753808259963989},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.6192113757133484},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.609890878200531},{"id":"https://openalex.org/keywords/linearity","display_name":"Linearity","score":0.5285314917564392},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5269842147827148},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.5226268768310547},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5124552845954895},{"id":"https://openalex.org/keywords/diaphragm","display_name":"Diaphragm (acoustics)","score":0.49680736660957336},{"id":"https://openalex.org/keywords/multiphysics","display_name":"Multiphysics","score":0.4757627844810486},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3487601578235626},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.3461213707923889},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3279293179512024},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1623254120349884},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.1184215247631073},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.07543635368347168}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.833166241645813},{"id":"https://openalex.org/C198490522","wikidata":"https://www.wikidata.org/wiki/Q1932915","display_name":"Piezoresistive effect","level":2,"score":0.8214534521102905},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8097749352455139},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6753808259963989},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.6192113757133484},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.609890878200531},{"id":"https://openalex.org/C77170095","wikidata":"https://www.wikidata.org/wiki/Q1753188","display_name":"Linearity","level":2,"score":0.5285314917564392},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5269842147827148},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5226268768310547},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5124552845954895},{"id":"https://openalex.org/C164292776","wikidata":"https://www.wikidata.org/wiki/Q5271779","display_name":"Diaphragm (acoustics)","level":3,"score":0.49680736660957336},{"id":"https://openalex.org/C46435376","wikidata":"https://www.wikidata.org/wiki/Q1829750","display_name":"Multiphysics","level":3,"score":0.4757627844810486},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3487601578235626},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.3461213707923889},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3279293179512024},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1623254120349884},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.1184215247631073},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.07543635368347168},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C157138929","wikidata":"https://www.wikidata.org/wiki/Q570","display_name":"Loudspeaker","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems51815.2021.9451486","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems51815.2021.9451486","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5799999833106995,"display_name":"Affordable and clean energy"}],"awards":[{"id":"https://openalex.org/G5566042464","display_name":null,"funder_award_id":"2018YFB2002302","funder_id":"https://openalex.org/F4320335777","funder_display_name":"National Key Research and Development Program of China"},{"id":"https://openalex.org/G7127054671","display_name":null,"funder_award_id":"61825107","funder_id":"https://openalex.org/F4320336125","funder_display_name":"National Science Fund for Distinguished Young Scholars"},{"id":"https://openalex.org/G8993397100","display_name":null,"funder_award_id":"U1930206","funder_id":"https://openalex.org/F4320321001","funder_display_name":"National Natural Science Foundation of China"}],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320335777","display_name":"National Key Research and Development Program of China","ror":null},{"id":"https://openalex.org/F4320336125","display_name":"National Science Fund for Distinguished Young Scholars","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W338803072","https://openalex.org/W2053747776","https://openalex.org/W2069655806","https://openalex.org/W2103052225","https://openalex.org/W2161805833","https://openalex.org/W2869467597","https://openalex.org/W2956079900","https://openalex.org/W3000723942"],"related_works":["https://openalex.org/W1995409867","https://openalex.org/W2089076881","https://openalex.org/W2576957273","https://openalex.org/W2670758999","https://openalex.org/W99992490","https://openalex.org/W2890232104","https://openalex.org/W2378386980","https://openalex.org/W2443919171","https://openalex.org/W4319718036","https://openalex.org/W2904406414"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"a":[3,9,25,58,64],"piezoresistive":[4],"pressure":[5,32],"microsensor":[6,70,96],"composed":[7],"of":[8,42,53,60,66,93,120,126],"Silicon":[10],"on":[11,74],"Insulator":[12],"(SOI)":[13],"layer":[14],"with":[15,109],"sensing":[16],"elements":[17],"(a":[18],"pressure-sensitive":[19,37],"diaphragm":[20],"and":[21,24,63,83,102,123],"four":[22],"piezoresistors)":[23],"glass":[26],"cap":[27],"for":[28],"hermetic":[29],"package.":[30],"The":[31,68],"under":[33],"measurement":[34],"bends":[35],"the":[36,91,94,118,124],"diaphragm,":[38],"producing":[39,57],"resistance":[40],"changes":[41],"underlining":[43],"piezoresistors.":[44],"Numerical":[45],"simulations":[46],"were":[47,55,115],"conducted,":[48],"where":[49],"key":[50],"structure":[51],"parameters":[52],"piezoresistors":[54],"optimized,":[56],"sensitivity":[59,119],"18.61":[61],"mV/(V\u00b7MPa)":[62,122],"linearity":[65,125],"0.74%FS.":[67],"proposed":[69],"was":[71],"fabricated":[72],"based":[73],"simplified":[75],"fabrications,":[76],"which":[77],"included":[78],"only":[79],"two":[80],"etching":[81],"processes":[82],"one":[84],"anodic":[85],"bonding.":[86],"Compared":[87],"to":[88,106],"other":[89],"microfabrications,":[90],"fabrication":[92],"developed":[95],"does":[97],"not":[98],"need":[99],"ion":[100],"implantation":[101],"thin-film":[103],"deposition,":[104],"leading":[105],"high":[107],"uniformity":[108],"low":[110],"residual":[111],"stress.":[112],"Fabricated":[113],"microsensors":[114],"characterized,":[116],"obtaining":[117],"17.278":[121],"0.613":[127],"%FS":[128],"(0-2.5":[129],"MPa).":[130]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}