{"id":"https://openalex.org/W3174429277","doi":"https://doi.org/10.1109/nems51815.2021.9451300","title":"Design and Optimization of Glass Frit Package Structure for Micro Pressure Switch","display_name":"Design and Optimization of Glass Frit Package Structure for Micro Pressure Switch","publication_year":2021,"publication_date":"2021-04-25","ids":{"openalex":"https://openalex.org/W3174429277","doi":"https://doi.org/10.1109/nems51815.2021.9451300","mag":"3174429277"},"language":"en","primary_location":{"id":"doi:10.1109/nems51815.2021.9451300","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems51815.2021.9451300","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100608322","display_name":"Lingyun Wang","orcid":"https://orcid.org/0000-0002-3786-3905"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Lingyun Wang","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, CHINA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen, CHINA","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021981541","display_name":"Daner Chen","orcid":"https://orcid.org/0000-0001-6866-467X"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Daner Chen","raw_affiliation_strings":["Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen, CHINA"],"affiliations":[{"raw_affiliation_string":"Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen, CHINA","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5030656782","display_name":"Heng Xiong","orcid":"https://orcid.org/0000-0002-2813-4401"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Heng Xiong","raw_affiliation_strings":["Aviation Key Laboratory of Science and Technology on Inertial Technology, FACRI, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Aviation Key Laboratory of Science and Technology on Inertial Technology, FACRI, Xi'an, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5049048133","display_name":"Yifang Liu","orcid":"https://orcid.org/0000-0003-3800-5512"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yifang Liu","raw_affiliation_strings":["Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen, CHINA"],"affiliations":[{"raw_affiliation_string":"Department of Instrumental and Electrical Engineering, Xiamen University, Xiamen, CHINA","institution_ids":["https://openalex.org/I191208505"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5100608322"],"corresponding_institution_ids":["https://openalex.org/I191208505"],"apc_list":null,"apc_paid":null,"fwci":0.1003,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.41486758,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/frit","display_name":"Frit","score":0.9968760013580322},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7769589424133301},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.570669949054718},{"id":"https://openalex.org/keywords/bonding-strength","display_name":"Bonding strength","score":0.49152669310569763},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4783634543418884},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4515596032142639},{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.4492991864681244},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.06741493940353394}],"concepts":[{"id":"https://openalex.org/C68930688","wikidata":"https://www.wikidata.org/wiki/Q383361","display_name":"Frit","level":2,"score":0.9968760013580322},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7769589424133301},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.570669949054718},{"id":"https://openalex.org/C2984173401","wikidata":"https://www.wikidata.org/wiki/Q2914535","display_name":"Bonding strength","level":2,"score":0.49152669310569763},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4783634543418884},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4515596032142639},{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.4492991864681244},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.06741493940353394},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems51815.2021.9451300","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems51815.2021.9451300","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE 16th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.699999988079071}],"awards":[{"id":"https://openalex.org/G134329303","display_name":null,"funder_award_id":"2018A030313522","funder_id":"https://openalex.org/F4320321921","funder_display_name":"Natural Science Foundation of Guangdong Province"}],"funders":[{"id":"https://openalex.org/F4320321921","display_name":"Natural Science Foundation of Guangdong Province","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W313801929","https://openalex.org/W1492713403","https://openalex.org/W1986534288","https://openalex.org/W1987456671","https://openalex.org/W1991762866","https://openalex.org/W2035800034","https://openalex.org/W2095212465","https://openalex.org/W2110332835","https://openalex.org/W2207388881","https://openalex.org/W2394030059","https://openalex.org/W2507435095","https://openalex.org/W2763158441","https://openalex.org/W2970458105","https://openalex.org/W3008465741","https://openalex.org/W3095045490","https://openalex.org/W3111908507","https://openalex.org/W6610978552","https://openalex.org/W6712319411"],"related_works":["https://openalex.org/W2166820582","https://openalex.org/W4253730107","https://openalex.org/W4244801158","https://openalex.org/W2481906980","https://openalex.org/W2507435095","https://openalex.org/W1966051235","https://openalex.org/W2117306851","https://openalex.org/W2472661426","https://openalex.org/W2039350511","https://openalex.org/W2110612860"],"abstract_inverted_index":{"A":[0],"novel":[1],"packaging":[2,8,25,153],"structure":[3,26],"is":[4,10,39,93,122,129,159,182],"designed":[5],"and":[6,34,80,125,134,174],"the":[7,44,50,75,83,89,99,107,117,126,138,145,152,156,162,166,175,179],"process":[9],"optimized":[11],"for":[12],"micro":[13,96,163],"pressure":[14,180],"sensors":[15],"with":[16,27],"glass":[17,53,100,142,169],"frit":[18,54,87,101,143,170],"bonding":[19,108,157,176],"technology":[20],"in":[21,69,98,132,135,165],"this":[22,70],"paper.":[23],"The":[24,41,56,95,110],"inner-outer":[28],"reference":[29,45],"walls,":[30],"metal":[31,63,90,146],"lead":[32,64,91],"break,":[33],"thermal":[35],"stress":[36],"release":[37],"break":[38],"designed.":[40],"height":[42],"of":[43,52,59,86,112,120,141,168,178],"walls":[46],"can":[47],"precisely":[48],"control":[49],"thickness":[51],"layer.":[55],"technological":[57],"parameters":[58],"screen":[60],"printing":[61],"across":[62],"steps":[65],"are":[66,102,171],"also":[67],"explored":[68],"article":[71],"originally.":[72],"By":[73],"optimizing":[74,106],"presintering":[76,121,127],"atmosphere,":[77],"peak":[78,118],"temperature":[79,119,158],"holding":[81],"time,":[82],"covering":[84],"issue":[85],"on":[88,144],"surface":[92],"solved.":[94],"holes":[97,164],"effectively":[103],"removed":[104,173],"by":[105],"temperature.":[109],"results":[111],"experiments":[113],"show":[114],"that":[115],"when":[116],"400":[123],"\u00b0C":[124],"atmosphere":[128],"30":[130],"minutes":[131],"vacuum":[133],"air":[136],"respectively,":[137],"coverage":[139],"rate":[140],"leads":[147],"reaches":[148],"85%,":[149],"which":[150],"meets":[151],"requirements.":[154],"When":[155],"500":[160],"\u00b0C,":[161],"interlayer":[167],"completely":[172],"strength":[177],"sensor":[181],"12.52":[183],"MPa.":[184]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}