{"id":"https://openalex.org/W2905539224","doi":"https://doi.org/10.1109/nems.2018.8557015","title":"High Quality Factor PMUTs with Optimized Thermo-Elastic Dissipation through Etching Holes","display_name":"High Quality Factor PMUTs with Optimized Thermo-Elastic Dissipation through Etching Holes","publication_year":2018,"publication_date":"2018-04-01","ids":{"openalex":"https://openalex.org/W2905539224","doi":"https://doi.org/10.1109/nems.2018.8557015","mag":"2905539224"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2018.8557015","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2018.8557015","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5078369750","display_name":"Xuying Chen","orcid":"https://orcid.org/0000-0002-3577-4722"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuying Chen","raw_affiliation_strings":["The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100379545","display_name":"Xinxin Liu","orcid":"https://orcid.org/0000-0002-3577-3383"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xinxin Liu","raw_affiliation_strings":["The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100453424","display_name":"Tao Wang","orcid":"https://orcid.org/0000-0001-8453-535X"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tao Wang","raw_affiliation_strings":["School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, People's Republic of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, People's Republic of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090307679","display_name":"Xianhao Le","orcid":"https://orcid.org/0000-0002-6084-3718"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xianhao Le","raw_affiliation_strings":["School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, People's Republic of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China, Chengdu, People's Republic of China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001480853","display_name":"Zhonggui Xu","orcid":null},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhonggui Xu","raw_affiliation_strings":["The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084452777","display_name":"Chengkuo Lee","orcid":"https://orcid.org/0000-0002-8886-3649"},"institutions":[{"id":"https://openalex.org/I165932596","display_name":"National University of Singapore","ror":"https://ror.org/01tgyzw49","country_code":"SG","type":"education","lineage":["https://openalex.org/I165932596"]}],"countries":["SG"],"is_corresponding":false,"raw_author_name":"Chengkuo Lee","raw_affiliation_strings":["Department of Electrical and Computer Engineering, National University of Singapore, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, National University of Singapore, Singapore","institution_ids":["https://openalex.org/I165932596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5060103378","display_name":"Jin Xie","orcid":"https://orcid.org/0000-0003-3942-3046"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jin Xie","raw_affiliation_strings":["The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"The State Key Laboratory of Fluid Power and Mechatronic Systems, Zhejiang University, Hangzhou, Zhejiang, People's Republic of China","institution_ids":["https://openalex.org/I76130692"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.17868452,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"212","last_page":"215"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10662","display_name":"Ultrasonics and Acoustic Wave Propagation","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11565","display_name":"Thermoelastic and Magnetoelastic Phenomena","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermoelastic-damping","display_name":"Thermoelastic damping","score":0.9410921335220337},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8331899642944336},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.7944486737251282},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.6701573133468628},{"id":"https://openalex.org/keywords/piezoelectricity","display_name":"Piezoelectricity","score":0.560224711894989},{"id":"https://openalex.org/keywords/pmut","display_name":"PMUT","score":0.5382101535797119},{"id":"https://openalex.org/keywords/ultrasonic-sensor","display_name":"Ultrasonic sensor","score":0.5351069569587708},{"id":"https://openalex.org/keywords/zener-diode","display_name":"Zener diode","score":0.5348358154296875},{"id":"https://openalex.org/keywords/dissipative-system","display_name":"Dissipative system","score":0.5304274559020996},{"id":"https://openalex.org/keywords/q-factor","display_name":"Q factor","score":0.4375265836715698},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.42055544257164},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.37266504764556885},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3176538050174713},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.114752858877182},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.10116052627563477},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.09184637665748596},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.08720946311950684},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.08690893650054932},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07406497001647949},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.06904232501983643}],"concepts":[{"id":"https://openalex.org/C92458943","wikidata":"https://www.wikidata.org/wiki/Q7783171","display_name":"Thermoelastic damping","level":3,"score":0.9410921335220337},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8331899642944336},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.7944486737251282},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.6701573133468628},{"id":"https://openalex.org/C100082104","wikidata":"https://www.wikidata.org/wiki/Q183759","display_name":"Piezoelectricity","level":2,"score":0.560224711894989},{"id":"https://openalex.org/C57693265","wikidata":"https://www.wikidata.org/wiki/Q17105295","display_name":"PMUT","level":3,"score":0.5382101535797119},{"id":"https://openalex.org/C81288441","wikidata":"https://www.wikidata.org/wiki/Q20736125","display_name":"Ultrasonic sensor","level":2,"score":0.5351069569587708},{"id":"https://openalex.org/C50566616","wikidata":"https://www.wikidata.org/wiki/Q180586","display_name":"Zener diode","level":4,"score":0.5348358154296875},{"id":"https://openalex.org/C99692599","wikidata":"https://www.wikidata.org/wiki/Q596577","display_name":"Dissipative system","level":2,"score":0.5304274559020996},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.4375265836715698},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.42055544257164},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.37266504764556885},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3176538050174713},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.114752858877182},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.10116052627563477},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.09184637665748596},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.08720946311950684},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.08690893650054932},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07406497001647949},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.06904232501983643},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2018.8557015","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2018.8557015","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.6700000166893005}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1481967161","https://openalex.org/W1980160722","https://openalex.org/W1987427413","https://openalex.org/W2019123650","https://openalex.org/W2028126761","https://openalex.org/W2042548359","https://openalex.org/W2055430408","https://openalex.org/W2056326110","https://openalex.org/W2065455715","https://openalex.org/W2069119903","https://openalex.org/W2077887258","https://openalex.org/W2090384543","https://openalex.org/W2124726994","https://openalex.org/W2171281853","https://openalex.org/W2280987803","https://openalex.org/W2339331509","https://openalex.org/W2593390051","https://openalex.org/W2594606040"],"related_works":["https://openalex.org/W2054919018","https://openalex.org/W2001550513","https://openalex.org/W2090764544","https://openalex.org/W2128585177","https://openalex.org/W3208881875","https://openalex.org/W2016092895","https://openalex.org/W2325690970","https://openalex.org/W2944231641","https://openalex.org/W2059631326","https://openalex.org/W2070450020"],"abstract_inverted_index":{"Thermoelastic":[0],"dissipation":[1,28],"(TED)":[2],"is":[3,53],"one":[4],"of":[5,60,74,92],"the":[6,50,69],"main":[7],"dissipative":[8],"mechanisms":[9],"in":[10,90],"piezoelectric":[11],"micromachined":[12],"ultrasonic":[13],"transducers":[14],"(pMUTs).":[15],"In":[16],"this":[17],"paper,":[18],"we":[19],"propose":[20],"pMUTs":[21],"with":[22,57],"etching":[23,35],"holes":[24,36,61],"to":[25],"decrease":[26],"thermoelastic":[27,44],"and":[29,41,77,95],"enhance":[30],"quality":[31],"factor":[32],"(Q).":[33],"The":[34,55,83],"effectively":[37],"disturb":[38],"heat":[39],"flow,":[40],"thus":[42],"reduce":[43],"loss.":[45],"Working":[46],"mechanism":[47],"based":[48],"on":[49],"Zener's":[51],"model":[52],"interpreted.":[54],"pMUT":[56,85],"three":[58],"rows":[59],"has":[62],"Q":[63],"nearly":[64],"two":[65],"times":[66],"higher":[67],"than":[68],"traditional":[70],"one.":[71],"Temperature":[72],"coefficient":[73],"frequency":[75],"(TCF)":[76],"vibration":[78],"performance":[79],"are":[80],"also":[81],"improved.":[82],"enhanced":[84],"can":[86],"be":[87],"widely":[88],"used":[89],"measurement":[91],"Doppler":[93],"shift":[94],"some":[96],"relative":[97],"high":[98],"power":[99],"applications.":[100]},"counts_by_year":[{"year":2022,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}