{"id":"https://openalex.org/W2905102259","doi":"https://doi.org/10.1109/nems.2018.8557002","title":"Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor","display_name":"Annular-Encapsulation Packaging to Realize High-Performance MEMS Thermal Wind Sensor","publication_year":2018,"publication_date":"2018-04-01","ids":{"openalex":"https://openalex.org/W2905102259","doi":"https://doi.org/10.1109/nems.2018.8557002","mag":"2905102259"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2018.8557002","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2018.8557002","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023974795","display_name":"Yizhou Ye","orcid":"https://orcid.org/0000-0003-2906-9426"},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yizhou Ye","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032664114","display_name":"Zhenjun Wang","orcid":"https://orcid.org/0000-0003-2624-8445"},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhenjun Wang","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042225149","display_name":"Zhenxiang Yi","orcid":"https://orcid.org/0000-0002-4619-8855"},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhenxiang Yi","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054995764","display_name":"Ming Qin","orcid":"https://orcid.org/0000-0002-8424-6299"},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Qin","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5038334345","display_name":"Qing\u2010An Huang","orcid":"https://orcid.org/0000-0002-0646-7635"},"institutions":[{"id":"https://openalex.org/I76569877","display_name":"Southeast University","ror":"https://ror.org/04ct4d772","country_code":"CN","type":"education","lineage":["https://openalex.org/I76569877"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Qing-An Huang","raw_affiliation_strings":["Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing, China","institution_ids":["https://openalex.org/I76569877"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5023974795"],"corresponding_institution_ids":["https://openalex.org/I76569877"],"apc_list":null,"apc_paid":null,"fwci":0.109,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.46865401,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":"114","issue":null,"first_page":"456","last_page":"459"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T13928","display_name":"Advanced Sensor Technologies Research","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11529","display_name":"Refrigeration and Air Conditioning Technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9959999918937683,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/encapsulation","display_name":"Encapsulation (networking)","score":0.685057520866394},{"id":"https://openalex.org/keywords/thermistor","display_name":"Thermistor","score":0.6760478615760803},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.6010341048240662},{"id":"https://openalex.org/keywords/wind-tunnel","display_name":"Wind tunnel","score":0.5715858340263367},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5666677951812744},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.535163402557373},{"id":"https://openalex.org/keywords/flow-sensor","display_name":"Flow sensor","score":0.4996814727783203},{"id":"https://openalex.org/keywords/airflow","display_name":"Airflow","score":0.49303433299064636},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.4874725341796875},{"id":"https://openalex.org/keywords/epoxy","display_name":"Epoxy","score":0.47895389795303345},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.43731069564819336},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.42566072940826416},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3546432554721832},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34181398153305054},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.32690882682800293},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3126337230205536},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.24044719338417053},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.17017534375190735},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14618638157844543},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.10359916090965271},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.09382626414299011}],"concepts":[{"id":"https://openalex.org/C81147070","wikidata":"https://www.wikidata.org/wiki/Q1172449","display_name":"Encapsulation (networking)","level":2,"score":0.685057520866394},{"id":"https://openalex.org/C66726788","wikidata":"https://www.wikidata.org/wiki/Q175973","display_name":"Thermistor","level":2,"score":0.6760478615760803},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.6010341048240662},{"id":"https://openalex.org/C100086909","wikidata":"https://www.wikidata.org/wiki/Q193010","display_name":"Wind tunnel","level":2,"score":0.5715858340263367},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5666677951812744},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.535163402557373},{"id":"https://openalex.org/C2777153531","wikidata":"https://www.wikidata.org/wiki/Q15091623","display_name":"Flow sensor","level":2,"score":0.4996814727783203},{"id":"https://openalex.org/C116067010","wikidata":"https://www.wikidata.org/wiki/Q4698686","display_name":"Airflow","level":2,"score":0.49303433299064636},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.4874725341796875},{"id":"https://openalex.org/C166595027","wikidata":"https://www.wikidata.org/wiki/Q143983","display_name":"Epoxy","level":2,"score":0.47895389795303345},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.43731069564819336},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.42566072940826416},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3546432554721832},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34181398153305054},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.32690882682800293},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3126337230205536},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.24044719338417053},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.17017534375190735},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14618638157844543},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.10359916090965271},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.09382626414299011},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2018.8557002","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2018.8557002","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.9100000262260437,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1975631503","https://openalex.org/W1982126649","https://openalex.org/W2016136718","https://openalex.org/W2054355536","https://openalex.org/W2093190868","https://openalex.org/W2130212525","https://openalex.org/W2133657813","https://openalex.org/W2140212259","https://openalex.org/W2536073034","https://openalex.org/W2622337640","https://openalex.org/W6728521156"],"related_works":["https://openalex.org/W1512975660","https://openalex.org/W2113873785","https://openalex.org/W2371106326","https://openalex.org/W2360316265","https://openalex.org/W2972852035","https://openalex.org/W2313474253","https://openalex.org/W2165208192","https://openalex.org/W2349999032","https://openalex.org/W2184704922","https://openalex.org/W1965817792"],"abstract_inverted_index":{"In":[0],"this":[1,24,90,95,140],"paper,":[2],"an":[3],"annular-encapsulation":[4,91],"packaging":[5,142],"method":[6],"is":[7,26,58,83,108,121,148],"proposed":[8],"to":[9,61,104],"develop":[10],"high-performance":[11],"micromachined":[12],"thermal":[13],"wind":[14,38,145],"sensor.":[15,172],"The":[16,129],"sensor":[17,68,82,103,117,138],"used":[18],"for":[19],"demonstrating":[20],"the":[21,37,44,49,53,63,67,71,77,81,87,97,102,105,116,119,124,127,134,137,144,161,169],"feasibility":[22],"of":[23,28,80,126,136,157,168],"design":[25],"composed":[27],"a":[29],"central":[30],"heater":[31],"and":[32,40,70,110,118],"eight":[33],"thermistors.":[34],"It":[35],"measures":[36],"speed":[39,146],"direction":[41],"through":[42],"detecting":[43],"airflow-induced":[45],"temperature":[46],"distribution":[47],"on":[48,94],"chip":[50],"surface.":[51],"Unlike":[52],"conventional":[54,170],"self-packaging,":[55],"epoxy":[56,106],"resin":[57,107],"only":[59],"utilized":[60],"encapsulate":[62],"bonding":[64],"wires":[65],"between":[66,115],"pads":[69],"PCB":[72],"(print":[73],"circuit":[74],"board),":[75],"while":[76],"front":[78],"surface":[79],"in":[84,89],"contact":[85],"with":[86,139,160],"air":[88],"packaging.":[92],"Based":[93],"approach,":[96],"unwanted":[98],"heat":[99,113],"loss":[100],"from":[101],"minimized,":[109],"more":[111],"efficient":[112],"exchange":[114],"airflow":[120],"realized":[122],"via":[123],"backside":[125],"chip.":[128],"experimental":[130],"results":[131],"show":[132],"that":[133],"sensitivity":[135,162],"annular":[141],"at":[143],"3.3m/s":[147],"44.29":[149],"mv/ms":[150],"<sup":[151,165],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[152,166],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">-1</sup>":[153,167],",":[154],"achieving":[155],"improvement":[156],"50.8%,":[158],"compared":[159],"29.37":[163],"mV/ms":[164],"self-packaged":[171]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}