{"id":"https://openalex.org/W2751928641","doi":"https://doi.org/10.1109/nems.2017.8017050","title":"Generation of temperature gradient on microfluidic plant chip for high-throughput plant phenotyping","display_name":"Generation of temperature gradient on microfluidic plant chip for high-throughput plant phenotyping","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2751928641","doi":"https://doi.org/10.1109/nems.2017.8017050","mag":"2751928641"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2017.8017050","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2017.8017050","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100458484","display_name":"Xinran Wang","orcid":"https://orcid.org/0000-0003-0443-5223"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xinran Wang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112306928","display_name":"Huawei Jiang","orcid":"https://orcid.org/0000-0002-8940-5965"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Huawei Jiang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100365570","display_name":"Yifei Wang","orcid":"https://orcid.org/0000-0001-9822-5002"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yifei Wang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5054626276","display_name":"Liang Dong","orcid":"https://orcid.org/0000-0002-0967-4955"},"institutions":[{"id":"https://openalex.org/I173911158","display_name":"Iowa State University","ror":"https://ror.org/04rswrd78","country_code":"US","type":"education","lineage":["https://openalex.org/I173911158"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Liang Dong","raw_affiliation_strings":["Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, Iowa State University, Ames, Iowa, USA","institution_ids":["https://openalex.org/I173911158"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I173911158"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"398","last_page":"401"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12093","display_name":"Greenhouse Technology and Climate Control","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/1110","display_name":"Plant Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T12093","display_name":"Greenhouse Technology and Climate Control","score":0.9961000084877014,"subfield":{"id":"https://openalex.org/subfields/1110","display_name":"Plant Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11268","display_name":"Light effects on plants","score":0.9896000027656555,"subfield":{"id":"https://openalex.org/subfields/1110","display_name":"Plant Science"},"field":{"id":"https://openalex.org/fields/11","display_name":"Agricultural and Biological Sciences"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.984499990940094,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/polydimethylsiloxane","display_name":"Polydimethylsiloxane","score":0.7658215761184692},{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.7578883171081543},{"id":"https://openalex.org/keywords/tec","display_name":"TEC","score":0.7271448373794556},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.6768860816955566},{"id":"https://openalex.org/keywords/temperature-gradient","display_name":"Temperature gradient","score":0.5762574076652527},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5377232432365417},{"id":"https://openalex.org/keywords/microfluidic-chip","display_name":"Microfluidic chip","score":0.48781755566596985},{"id":"https://openalex.org/keywords/lab-on-a-chip","display_name":"Lab-on-a-chip","score":0.46198731660842896},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4172114431858063},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3530125021934509},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.14567062258720398},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.08874404430389404},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08178907632827759}],"concepts":[{"id":"https://openalex.org/C2779849746","wikidata":"https://www.wikidata.org/wiki/Q411955","display_name":"Polydimethylsiloxane","level":2,"score":0.7658215761184692},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.7578883171081543},{"id":"https://openalex.org/C176379880","wikidata":"https://www.wikidata.org/wiki/Q18031939","display_name":"TEC","level":3,"score":0.7271448373794556},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.6768860816955566},{"id":"https://openalex.org/C137109543","wikidata":"https://www.wikidata.org/wiki/Q554388","display_name":"Temperature gradient","level":2,"score":0.5762574076652527},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5377232432365417},{"id":"https://openalex.org/C2988198817","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Microfluidic chip","level":3,"score":0.48781755566596985},{"id":"https://openalex.org/C138942068","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Lab-on-a-chip","level":3,"score":0.46198731660842896},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4172114431858063},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3530125021934509},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.14567062258720398},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.08874404430389404},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08178907632827759},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C1276947","wikidata":"https://www.wikidata.org/wiki/Q333","display_name":"Astronomy","level":1,"score":0.0},{"id":"https://openalex.org/C116403925","wikidata":"https://www.wikidata.org/wiki/Q162219","display_name":"Ionosphere","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2017.8017050","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2017.8017050","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2030207436","https://openalex.org/W2044033013","https://openalex.org/W2047190797","https://openalex.org/W2063283019","https://openalex.org/W2103161349","https://openalex.org/W2144498825","https://openalex.org/W2287978228","https://openalex.org/W2317026968","https://openalex.org/W2412216452","https://openalex.org/W2488331061","https://openalex.org/W2490610605"],"related_works":["https://openalex.org/W2282776549","https://openalex.org/W4387116029","https://openalex.org/W2463351222","https://openalex.org/W2936845415","https://openalex.org/W4312354843","https://openalex.org/W4299365654","https://openalex.org/W2615396203","https://openalex.org/W2351115691","https://openalex.org/W3098813295","https://openalex.org/W4251700743"],"abstract_inverted_index":{"This":[0,76],"paper":[1],"reports":[2],"a":[3,10,15,61],"simple":[4],"and":[5,38,85,87,100,112],"effective":[6],"method":[7,81],"for":[8],"generating":[9],"stable":[11,62],"temperature":[12,63,78,95,130],"gradient":[13,79],"on":[14,67,97],"microfluidic":[16,30],"plant":[17,31,40,59,69,122],"chip.":[18,32],"A":[19],"thermo-electric":[20],"cooling":[21],"(TEC)":[22],"plate":[23],"is":[24,42,65,82],"horizontally":[25],"placed":[26],"below":[27],"an":[28,105,119],"inclined":[29],"The":[33],"space":[34],"between":[35],"the":[36,39,55,58,68,110,124],"TEC":[37,56],"chip":[41,70],"filled":[43],"with":[44],"polydimethylsiloxane":[45],"(PDMS).":[46],"Due":[47],"to":[48,57,90],"different":[49],"lengths":[50],"of":[51,93,115,126],"thermal":[52],"pathways":[53],"from":[54],"chip,":[60],"distribution":[64],"realized":[66],"without":[71],"using":[72],"any":[73],"feedback":[74],"circuits.":[75],"present":[77,109],"generation":[80],"highly":[83],"economical":[84],"accessible":[86],"can":[88],"facilitate":[89],"study":[91],"influences":[92],"environmental":[94],"changes":[96],"many":[98],"microorganisms":[99],"small":[101],"model":[102,121],"plants.":[103],"As":[104],"application":[106],"demonstration,":[107],"we":[108],"germination":[111],"early-stage":[113],"growth":[114],"Arabidopsis":[116],"thaliana":[117],"plant,":[118],"important":[120],"in":[123],"area":[125],"biology,":[127],"under":[128],"various":[129],"conditions.":[131]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}