{"id":"https://openalex.org/W2752921469","doi":"https://doi.org/10.1109/nems.2017.8017025","title":"Development of fully MEMS-compatible process on the flexible substrate","display_name":"Development of fully MEMS-compatible process on the flexible substrate","publication_year":2017,"publication_date":"2017-04-01","ids":{"openalex":"https://openalex.org/W2752921469","doi":"https://doi.org/10.1109/nems.2017.8017025","mag":"2752921469"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2017.8017025","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2017.8017025","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101637848","display_name":"Po\u2010Wei Huang","orcid":"https://orcid.org/0000-0001-5681-2305"},"institutions":[{"id":"https://openalex.org/I12213908","display_name":"Ming Chi University of Technology","ror":"https://ror.org/04xgh4d03","country_code":"TW","type":"education","lineage":["https://openalex.org/I12213908"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Po-Wei Huang","raw_affiliation_strings":["Department of Mechanical Engineering, Ming Chi University of Technology, New Taipei, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Ming Chi University of Technology, New Taipei, Taiwan","institution_ids":["https://openalex.org/I12213908"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5025759175","display_name":"Kuo-Yung Hung","orcid":null},"institutions":[{"id":"https://openalex.org/I12213908","display_name":"Ming Chi University of Technology","ror":"https://ror.org/04xgh4d03","country_code":"TW","type":"education","lineage":["https://openalex.org/I12213908"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Kuo-Yung Hung","raw_affiliation_strings":["Department of Mechanical Engineering, Ming Chi University of Technology, New Taipei, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Ming Chi University of Technology, New Taipei, Taiwan","institution_ids":["https://openalex.org/I12213908"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5074294652","display_name":"Yun-Ju Chuang","orcid":"https://orcid.org/0000-0002-4922-6946"},"institutions":[{"id":"https://openalex.org/I192703390","display_name":"Ming Chuan University","ror":"https://ror.org/02pgvzy25","country_code":"TW","type":"education","lineage":["https://openalex.org/I192703390"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yun-Ju Chuang","raw_affiliation_strings":["Department of Biomedical Engineering, Ming Chuan University, New Taipei, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Biomedical Engineering, Ming Chuan University, New Taipei, Taiwan","institution_ids":["https://openalex.org/I192703390"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5101637848"],"corresponding_institution_ids":["https://openalex.org/I12213908"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.11234423,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"58","issue":null,"first_page":"283","last_page":"286"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10090","display_name":"ZnO doping and properties","score":0.9829000234603882,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.6630992889404297},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.5743551254272461},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5294867157936096},{"id":"https://openalex.org/keywords/sputtering","display_name":"Sputtering","score":0.45274150371551514},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.4522157907485962},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.43331485986709595},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.36713314056396484},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.32373493909835815},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.2173995077610016},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.11202746629714966}],"concepts":[{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.6630992889404297},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.5743551254272461},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5294867157936096},{"id":"https://openalex.org/C22423302","wikidata":"https://www.wikidata.org/wiki/Q898444","display_name":"Sputtering","level":3,"score":0.45274150371551514},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.4522157907485962},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.43331485986709595},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.36713314056396484},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.32373493909835815},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.2173995077610016},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.11202746629714966},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2017.8017025","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2017.8017025","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE 12th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1857071755","https://openalex.org/W1999589524","https://openalex.org/W2001562953","https://openalex.org/W2002578366","https://openalex.org/W2118910360","https://openalex.org/W2123947774","https://openalex.org/W2146510091","https://openalex.org/W2164875840"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2035249489","https://openalex.org/W1967383351","https://openalex.org/W850150341","https://openalex.org/W2295922851","https://openalex.org/W142388841","https://openalex.org/W2066362799","https://openalex.org/W1969082957","https://openalex.org/W1992258975","https://openalex.org/W1990831804"],"abstract_inverted_index":{"The":[0,94],"purpose":[1],"of":[2,63,112],"this":[3],"study":[4],"was":[5,31],"to":[6,84,108],"develop":[7],"a":[8,18],"microelectromechanical":[9],"systems":[10],"compatible":[11],"process":[12],"(e.g.,":[13],"etching,":[14],"lithography,":[15],"sputtering)":[16],"for":[17],"polyimide":[19],"(PI)":[20],"substrate.":[21],"A":[22],"thin-film":[23],"transistor":[24],"(TFT)":[25],"array":[26],"on":[27,77,100],"the":[28,57,60,64,78,101,104,110],"flexible":[29,113],"substrate":[30,80],"demonstrated":[32],"by":[33],"fully":[34],"etching":[35],"aluminum":[36,44],"(Al),":[37],"indium":[38],"gallium":[39],"zinc":[40],"oxide":[41,45],"(IGZO),":[42],"and":[43,75,90],"(Al":[46],"<sub":[47,51,67,71],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[48,52,68,72],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sub>":[49,69],"O":[50,70],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">3</sub>":[53,73],").":[54],"Moreover,":[55],"during":[56],"sputtering":[58],"process,":[59],"surface":[61],"roughnesses":[62],"IGZO,":[65],"Al":[66,76],",":[74],"PI":[79],"were":[81],"well":[82],"controlled":[83],"as":[85,87],"low":[86],"0.457,":[88],"0.326,":[89],"12.3":[91],"nm,":[92],"respectively.":[93],"devices":[95],"can":[96],"be":[97],"arbitrarily":[98],"curled":[99],"substrate;":[102],"therefore,":[103],"results":[105],"are":[106],"expected":[107],"facilitate":[109],"development":[111],"electronic":[114],"applications":[115],"with":[116],"high":[117],"bending":[118],"characteristics.":[119]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}