{"id":"https://openalex.org/W2563477651","doi":"https://doi.org/10.1109/nems.2016.7758277","title":"Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies","display_name":"Fabrication of a multilayer spiral coil by selective bonding, debonding and MEMS technologies","publication_year":2016,"publication_date":"2016-04-01","ids":{"openalex":"https://openalex.org/W2563477651","doi":"https://doi.org/10.1109/nems.2016.7758277","mag":"2563477651"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2016.7758277","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2016.7758277","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5114255206","display_name":"Tim Schr\u00f6eder","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Tim Schroeder","raw_affiliation_strings":["Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032387862","display_name":"Joerg Froemel","orcid":"https://orcid.org/0000-0002-5003-0238"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Joerg Froemel","raw_affiliation_strings":["Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024253162","display_name":"Shuji Tanaka","orcid":"https://orcid.org/0000-0002-2663-3266"},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shuji Tanaka","raw_affiliation_strings":["Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan","institution_ids":["https://openalex.org/I201537933"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110057029","display_name":"Thomas Ge\u00dfner","orcid":null},"institutions":[{"id":"https://openalex.org/I201537933","display_name":"Tohoku University","ror":"https://ror.org/01dq60k83","country_code":"JP","type":"education","lineage":["https://openalex.org/I201537933"]},{"id":"https://openalex.org/I4210120526","display_name":"Fraunhofer Institute for Electronic Nano Systems","ror":"https://ror.org/02h12bg79","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210120526","https://openalex.org/I4923324"]}],"countries":["DE","JP"],"is_corresponding":false,"raw_author_name":"Thomas Gessner","raw_affiliation_strings":["Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan","Fraunhofer Institute for Electronic Nano Systems, Germany"],"affiliations":[{"raw_affiliation_string":"Fraunhofer Project Center, WPI-AIMR, Tohoku University, Sendai, 980-8577 Japan","institution_ids":["https://openalex.org/I201537933"]},{"raw_affiliation_string":"Fraunhofer Institute for Electronic Nano Systems, Germany","institution_ids":["https://openalex.org/I4210120526"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5114255206"],"corresponding_institution_ids":["https://openalex.org/I201537933"],"apc_list":null,"apc_paid":null,"fwci":0.3675,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.67509223,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":96},"biblio":{"volume":"10","issue":null,"first_page":"401","last_page":"404"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9969000220298767,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.8550237417221069},{"id":"https://openalex.org/keywords/electromagnetic-coil","display_name":"Electromagnetic coil","score":0.8251357078552246},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8034560084342957},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7136641144752502},{"id":"https://openalex.org/keywords/spiral","display_name":"Spiral (railway)","score":0.6468805074691772},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.644315779209137},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.5580965280532837},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.5531477332115173},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.5337992906570435},{"id":"https://openalex.org/keywords/actuator","display_name":"Actuator","score":0.5240143537521362},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4515674114227295},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4514351487159729},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4327894449234009},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3972216546535492},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.34174469113349915},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.33158737421035767},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.21545454859733582},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19470670819282532},{"id":"https://openalex.org/keywords/nuclear-magnetic-resonance","display_name":"Nuclear magnetic resonance","score":0.08168599009513855},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07688632607460022},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.07179814577102661}],"concepts":[{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.8550237417221069},{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.8251357078552246},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8034560084342957},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7136641144752502},{"id":"https://openalex.org/C174128100","wikidata":"https://www.wikidata.org/wiki/Q846907","display_name":"Spiral (railway)","level":2,"score":0.6468805074691772},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.644315779209137},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.5580965280532837},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.5531477332115173},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.5337992906570435},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.5240143537521362},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4515674114227295},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4514351487159729},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4327894449234009},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3972216546535492},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.34174469113349915},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33158737421035767},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.21545454859733582},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19470670819282532},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.08168599009513855},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07688632607460022},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.07179814577102661},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/nems.2016.7758277","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2016.7758277","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},{"id":"pmh:oai:publica.fraunhofer.de:publica/395343","is_oa":false,"landing_page_url":"https://publica.fraunhofer.de/handle/publica/395343","pdf_url":null,"source":{"id":"https://openalex.org/S4306400318","display_name":"Fraunhofer-Publica (Fraunhofer-Gesellschaft)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I4923324","host_organization_name":"Fraunhofer-Gesellschaft","host_organization_lineage":["https://openalex.org/I4923324"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.7200000286102295,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1970536036","https://openalex.org/W1974099432","https://openalex.org/W1979803102","https://openalex.org/W1989127368","https://openalex.org/W1990346515","https://openalex.org/W2050556268","https://openalex.org/W2056693201","https://openalex.org/W2063807324","https://openalex.org/W2092572391","https://openalex.org/W2107486436","https://openalex.org/W2172314217","https://openalex.org/W2288886997","https://openalex.org/W2540840166","https://openalex.org/W3146205337","https://openalex.org/W6684935810","https://openalex.org/W6728900055","https://openalex.org/W6960025567"],"related_works":["https://openalex.org/W2348807422","https://openalex.org/W2361025757","https://openalex.org/W2050837474","https://openalex.org/W4241592276","https://openalex.org/W2926730772","https://openalex.org/W2272290532","https://openalex.org/W1532462972","https://openalex.org/W2049043962","https://openalex.org/W1985414612","https://openalex.org/W2089788581"],"abstract_inverted_index":{"For":[0],"the":[1,7,13,22,25],"further":[2],"miniaturization":[3],"of":[4,9,24,55],"integrated":[5],"circuits,":[6],"integration":[8,23],"passive":[10],"components":[11],"on":[12],"chip":[14],"is":[15,30,50,64],"one":[16,31],"approach.":[17],"In":[18],"DC-DC":[19],"converter":[20],"applications,":[21],"inductor":[26],"with":[27,75],"high":[28],"inductivity":[29],"problem.":[32],"This":[33],"paper":[34],"addresses":[35],"this":[36],"problem":[37],"by":[38,66],"proposing":[39],"a":[40,45,76],"new":[41],"technique":[42],"for":[43],"fabricating":[44],"multilayer":[46,62],"spiral":[47],"coil":[48,63,70],"that":[49],"also":[51],"useful":[52],"as":[53],"part":[54],"electromagnetic":[56],"MEMS":[57],"(Micro-Electro-Mechanical":[58],"Systems)":[59],"actuators.":[60],"The":[61],"made":[65],"stacking":[67],"separately":[68],"fabricated":[69],"layers":[71],"and":[72,79],"joining":[73],"them":[74],"selective":[77],"bonding":[78],"debonding":[80],"technique.":[81]},"counts_by_year":[{"year":2018,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}