{"id":"https://openalex.org/W2567560236","doi":"https://doi.org/10.1109/nems.2016.7758243","title":"A multiple sensor platform with dedicated CMOS-LSIs for robot applications","display_name":"A multiple sensor platform with dedicated CMOS-LSIs for robot applications","publication_year":2016,"publication_date":"2016-04-01","ids":{"openalex":"https://openalex.org/W2567560236","doi":"https://doi.org/10.1109/nems.2016.7758243","mag":"2567560236"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2016.7758243","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2016.7758243","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086506586","display_name":"Chenzhong Shao","orcid":"https://orcid.org/0000-0001-8913-9807"},"institutions":[{"id":"https://openalex.org/I4210093896","display_name":"Tohoku University Hospital","ror":"https://ror.org/00kcd6x60","country_code":"JP","type":"healthcare","lineage":["https://openalex.org/I4210093896"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Chenzhong Shao","raw_affiliation_strings":["Tohoku University, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I4210093896"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5035083249","display_name":"Takahiro Nakayama","orcid":"https://orcid.org/0000-0001-8114-7618"},"institutions":[{"id":"https://openalex.org/I4210137853","display_name":"Toyota Motor Corporation (Japan)","ror":"https://ror.org/02zqm6r10","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210137853"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Takahiro Nakayama","raw_affiliation_strings":["Toyota Jidosha Kabushiki Kaisha, Toyota, Aichi, JP"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toyota Jidosha Kabushiki Kaisha, Toyota, Aichi, JP","institution_ids":["https://openalex.org/I4210137853"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049362175","display_name":"Yoshiyuki Hata","orcid":"https://orcid.org/0000-0001-8150-3678"},"institutions":[{"id":"https://openalex.org/I4210165351","display_name":"Toyota Central Research and Development Laboratories (Japan)","ror":"https://ror.org/05mjgqe69","country_code":"JP","type":"company","lineage":["https://openalex.org/I4210125472","https://openalex.org/I4210165351"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yoshiyuki Hata","raw_affiliation_strings":["Toyota Central R&D Labs., Inc., Nagakute Aichi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Toyota Central R&D Labs., Inc., Nagakute Aichi, Japan","institution_ids":["https://openalex.org/I4210165351"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104107801","display_name":"Travis Bartley","orcid":null},"institutions":[{"id":"https://openalex.org/I4210093896","display_name":"Tohoku University Hospital","ror":"https://ror.org/00kcd6x60","country_code":"JP","type":"healthcare","lineage":["https://openalex.org/I4210093896"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Travis Bartley","raw_affiliation_strings":["Tohoku University, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I4210093896"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008972576","display_name":"Yutaka Nonomura","orcid":"https://orcid.org/0000-0003-4281-1066"},"institutions":[{"id":"https://openalex.org/I96636082","display_name":"Meijo University","ror":"https://ror.org/04h42fc75","country_code":"JP","type":"education","lineage":["https://openalex.org/I96636082"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Yutaka Nonomura","raw_affiliation_strings":["Meijo University, Nagoya, Aichi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Meijo University, Nagoya, Aichi, Japan","institution_ids":["https://openalex.org/I96636082"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024253162","display_name":"Shuji Tanaka","orcid":"https://orcid.org/0000-0002-2663-3266"},"institutions":[{"id":"https://openalex.org/I4210093896","display_name":"Tohoku University Hospital","ror":"https://ror.org/00kcd6x60","country_code":"JP","type":"healthcare","lineage":["https://openalex.org/I4210093896"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Shuji Tanaka","raw_affiliation_strings":["Tohoku University, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I4210093896"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037940534","display_name":"Masanori Muroyama","orcid":"https://orcid.org/0000-0002-6808-5106"},"institutions":[{"id":"https://openalex.org/I4210093896","display_name":"Tohoku University Hospital","ror":"https://ror.org/00kcd6x60","country_code":"JP","type":"healthcare","lineage":["https://openalex.org/I4210093896"]}],"countries":["JP"],"is_corresponding":false,"raw_author_name":"Masanori Muroyama","raw_affiliation_strings":["Tohoku University, Sendai, Miyagi, Japan"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tohoku University, Sendai, Miyagi, Japan","institution_ids":["https://openalex.org/I4210093896"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.6466,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.83354128,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":"76","issue":null,"first_page":"245","last_page":"250"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9850999712944031,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.763157844543457},{"id":"https://openalex.org/keywords/tactile-sensor","display_name":"Tactile sensor","score":0.7373698949813843},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6617258787155151},{"id":"https://openalex.org/keywords/resistive-touchscreen","display_name":"Resistive touchscreen","score":0.6261154413223267},{"id":"https://openalex.org/keywords/robot","display_name":"Robot","score":0.5540053844451904},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5080986022949219},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5078585743904114},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5063174962997437},{"id":"https://openalex.org/keywords/intelligent-sensor","display_name":"Intelligent sensor","score":0.4940800964832306},{"id":"https://openalex.org/keywords/electro-optical-sensor","display_name":"Electro-optical sensor","score":0.4912213683128357},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4859122335910797},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.45006856322288513},{"id":"https://openalex.org/keywords/wireless-sensor-network","display_name":"Wireless sensor network","score":0.4332149028778076},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.40277862548828125},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.35243332386016846},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3387943506240845},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.17065006494522095}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.763157844543457},{"id":"https://openalex.org/C46722567","wikidata":"https://www.wikidata.org/wiki/Q7674139","display_name":"Tactile sensor","level":3,"score":0.7373698949813843},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6617258787155151},{"id":"https://openalex.org/C6899612","wikidata":"https://www.wikidata.org/wiki/Q852911","display_name":"Resistive touchscreen","level":2,"score":0.6261154413223267},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.5540053844451904},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5080986022949219},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5078585743904114},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5063174962997437},{"id":"https://openalex.org/C176563091","wikidata":"https://www.wikidata.org/wiki/Q669238","display_name":"Intelligent sensor","level":3,"score":0.4940800964832306},{"id":"https://openalex.org/C3400440","wikidata":"https://www.wikidata.org/wiki/Q2027487","display_name":"Electro-optical sensor","level":2,"score":0.4912213683128357},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4859122335910797},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.45006856322288513},{"id":"https://openalex.org/C24590314","wikidata":"https://www.wikidata.org/wiki/Q336038","display_name":"Wireless sensor network","level":2,"score":0.4332149028778076},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.40277862548828125},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35243332386016846},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3387943506240845},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.17065006494522095},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2016.7758243","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2016.7758243","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1559499184","https://openalex.org/W1592387353","https://openalex.org/W1597620877","https://openalex.org/W1974815510","https://openalex.org/W2023614418","https://openalex.org/W2036718048","https://openalex.org/W2054622944","https://openalex.org/W2171130677","https://openalex.org/W2249709701","https://openalex.org/W2606703560","https://openalex.org/W3089108906","https://openalex.org/W3133617844","https://openalex.org/W6635836536","https://openalex.org/W6736160608","https://openalex.org/W6783130578"],"related_works":["https://openalex.org/W3142313280","https://openalex.org/W4283740974","https://openalex.org/W3128324021","https://openalex.org/W3136079594","https://openalex.org/W3208690336","https://openalex.org/W4233135978","https://openalex.org/W51629545","https://openalex.org/W4285102271","https://openalex.org/W2904095398","https://openalex.org/W2119638626"],"abstract_inverted_index":{"In":[0],"recent":[1],"years,":[2],"there":[3],"has":[4,146],"been":[5],"an":[6],"increasing":[7],"interest":[8],"in":[9,60,68],"robots'":[10],"tactile":[11,34,112],"sense,":[12],"which":[13,99,145],"enables":[14],"safer,":[15],"more":[16],"reliable":[17],"and":[18,74,87,110,151],"accurate":[19,71],"human-robot":[20],"communication":[21],"for":[22,38,54,119],"the":[23,55,126,131,136,141,147],"future":[24],"society.":[25],"So":[26],"far,":[27],"we":[28,90],"have":[29],"developed":[30],"a":[31,40,92],"capacitive":[32,109,150],"type":[33,153],"sensor":[35,64,78,93,143],"network":[36],"system":[37],"implementing":[39],"large":[41,83],"number":[42],"of":[43,70,77,104,130],"sensors":[44,59,134],"with":[45,95,121,135],"MEMS-CMOS":[46],"integration":[47,120],"technologies":[48],"[1\u20133,":[49],"9].":[50],"Considering":[51],"practical":[52],"use":[53],"robot,":[56],"multiple":[57,132],"kind":[58,133],"addition":[61],"to":[62],"numerous":[63],"distributions":[65],"are":[66],"necessary":[67],"terms":[69],"object":[72],"recognition":[73],"wide":[75],"coverage":[76],"requirements":[79],"such":[80],"as":[81],"high-sensitivity,":[82],"dynamic":[84],"range,":[85],"high-reliability":[86],"low-cost.":[88],"Thus,":[89],"proposed":[91],"platform":[94],"dedicated":[96],"CMOS-LSIs":[97],"[6],":[98],"can":[100],"utilize":[101],"three":[102],"types":[103],"sensors:":[105],"on-chip":[106],"temperature,":[107],"off-chip":[108],"resistive":[111,152],"sensors.":[113,155],"The":[114],"CMOS-LSI":[115],"is":[116],"well":[117],"designed":[118],"MEMS.":[122],"This":[123],"paper":[124],"describes":[125],"first":[127],"implementation":[128],"results":[129],"CMOS-LSIs.":[137],"We":[138],"successfully":[139],"constructed":[140],"multi":[142],"system,":[144],"temperature":[148],"sensor,":[149],"force":[154]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}