{"id":"https://openalex.org/W2291741845","doi":"https://doi.org/10.1109/nems.2015.7147491","title":"Realization of the microchannel with microisland arrays by one-step silicon wet etching process","display_name":"Realization of the microchannel with microisland arrays by one-step silicon wet etching process","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W2291741845","doi":"https://doi.org/10.1109/nems.2015.7147491","mag":"2291741845"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2015.7147491","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2015.7147491","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100398560","display_name":"Yifan Wang","orcid":"https://orcid.org/0000-0002-4237-3142"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yifan Wang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101809661","display_name":"Zewen Liu","orcid":"https://orcid.org/0000-0003-2582-8042"},"institutions":[{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zewen Liu","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I99065089","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5100398560"],"corresponding_institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13569731,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"758 763","issue":null,"first_page":"557","last_page":"560"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/realization","display_name":"Realization (probability)","score":0.849126935005188},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.8451796770095825},{"id":"https://openalex.org/keywords/microchannel","display_name":"Microchannel","score":0.7925931215286255},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6537669897079468},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6217959523200989},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5934817790985107},{"id":"https://openalex.org/keywords/dry-etching","display_name":"Dry etching","score":0.43283021450042725},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.39319318532943726},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3699081540107727},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3407973051071167},{"id":"https://openalex.org/keywords/programming-language","display_name":"Programming language","score":0.07471287250518799}],"concepts":[{"id":"https://openalex.org/C2781089630","wikidata":"https://www.wikidata.org/wiki/Q21856745","display_name":"Realization (probability)","level":2,"score":0.849126935005188},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.8451796770095825},{"id":"https://openalex.org/C63662833","wikidata":"https://www.wikidata.org/wiki/Q6839341","display_name":"Microchannel","level":2,"score":0.7925931215286255},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6537669897079468},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6217959523200989},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5934817790985107},{"id":"https://openalex.org/C1291036","wikidata":"https://www.wikidata.org/wiki/Q1191918","display_name":"Dry etching","level":4,"score":0.43283021450042725},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.39319318532943726},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3699081540107727},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3407973051071167},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.07471287250518799},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2015.7147491","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2015.7147491","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1670172520","https://openalex.org/W1963949078","https://openalex.org/W1966139431","https://openalex.org/W1979374740","https://openalex.org/W1979817264","https://openalex.org/W1991721204","https://openalex.org/W2019606441","https://openalex.org/W2030680508","https://openalex.org/W2043431019","https://openalex.org/W2056030209","https://openalex.org/W2077394850","https://openalex.org/W2095217690","https://openalex.org/W2110410634","https://openalex.org/W2119612997","https://openalex.org/W6677955809"],"related_works":["https://openalex.org/W1991288435","https://openalex.org/W1994240407","https://openalex.org/W2349095401","https://openalex.org/W1964097601","https://openalex.org/W2032836434","https://openalex.org/W2376678868","https://openalex.org/W1990831804","https://openalex.org/W4387743859","https://openalex.org/W2542354647","https://openalex.org/W2044427337"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"the":[3,46,57,79,87,91,101,126],"study":[4],"on":[5],"fabricating":[6],"silicon":[7,58],"microchannel":[8],"with":[9,111],"high-density":[10],"small-scale":[11],"microisland":[12,67,109],"arrays":[13,68,110],"by":[14,43,50,125],"one-step":[15],"anisotropic":[16],"wet":[17],"etching":[18],"process":[19],"has":[20],"been":[21],"presented.":[22],"Two":[23],"different":[24],"kinds":[25],"of":[26,35,53],"compensating":[27,40,73,89,128],"masks":[28],"were":[29,69,123],"elaborately":[30],"designed,":[31],"one":[32],"is":[33,48],"consist":[34],"a":[36,51,82],"series":[37,52],"traditional":[38],"T-shape":[39],"patterns":[41],"arranged":[42],"cross-compensating":[44],"method;":[45],"other":[47],"formed":[49],"square-slits":[54],"aligned":[55],"along":[56],"<;100>":[59],"directions.":[60],"200":[61],"\u03bcm-width":[62],"20":[63],"\u03bcm-depth":[64],"microchannels":[65],"containing":[66],"realized":[70,124],"utilizing":[71],"those":[72],"masks.":[74],"It":[75],"was":[76,95,118],"found":[77],"that":[78],"microislands":[80],"owned":[81],"\u201cwindmill":[83],"flower\u201d":[84],"shape":[85],"under":[86],"former":[88],"mask,":[90],"average":[92],"feature":[93,116],"size":[94,117],"down":[96,119],"to":[97,120],"4":[98],"\u03bcm":[99],"and":[100],"minimum":[102,115],"center":[103],"spacing":[104],"reached":[105],"50":[106],"\u03bcm.":[107],"Meanwhile,":[108],"octagonal":[112],"structure,":[113],"whose":[114],"6.2":[121],"\u03bcm,":[122],"latter":[127],"mask.":[129]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}