{"id":"https://openalex.org/W2288818906","doi":"https://doi.org/10.1109/nems.2015.7147470","title":"Silicon-silicon anodic bonding process with embedded glass","display_name":"Silicon-silicon anodic bonding process with embedded glass","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W2288818906","doi":"https://doi.org/10.1109/nems.2015.7147470","mag":"2288818906"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2015.7147470","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2015.7147470","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5109790755","display_name":"Wenqin Cui","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"W. P Cui","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021638994","display_name":"G. D. Liu","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"G. D. Liu","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5052474197","display_name":"F. S. Zhang","orcid":"https://orcid.org/0000-0003-0016-0568"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"F. S. Zhang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5020630816","display_name":"Haibo Hu","orcid":"https://orcid.org/0000-0001-7494-1469"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"H. Hu","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018007321","display_name":"Chengwu Gao","orcid":"https://orcid.org/0000-0002-7465-9663"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210107198","display_name":"State Key Laboratory of Transducer Technology","ror":"https://ror.org/01qg56n75","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366","https://openalex.org/I19820366","https://openalex.org/I4210107198","https://openalex.org/I4210110458","https://openalex.org/I4210147322"]},{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"C. C. Gao","raw_affiliation_strings":["Chinese Academy of Sciences, State Key Laboratory of Transducer Technology, Shanghai, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Chinese Academy of Sciences, State Key Laboratory of Transducer Technology, Shanghai, China","institution_ids":["https://openalex.org/I4210107198","https://openalex.org/I19820366"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100750974","display_name":"Yue Hao","orcid":"https://orcid.org/0000-0002-8081-2919"},"institutions":[{"id":"https://openalex.org/I19820366","display_name":"Chinese Academy of Sciences","ror":"https://ror.org/034t30j35","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366"]},{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210107198","display_name":"State Key Laboratory of Transducer Technology","ror":"https://ror.org/01qg56n75","country_code":"CN","type":"government","lineage":["https://openalex.org/I19820366","https://openalex.org/I19820366","https://openalex.org/I4210107198","https://openalex.org/I4210110458","https://openalex.org/I4210147322"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Y. L. Hao","raw_affiliation_strings":["Chinese Academy of Sciences, State Key Laboratory of Transducer Technology, Shanghai, China","Innovation Center for MicroNanoelectronics and Integrated System, Beijing, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Chinese Academy of Sciences, State Key Laboratory of Transducer Technology, Shanghai, China","institution_ids":["https://openalex.org/I4210107198","https://openalex.org/I19820366"]},{"raw_affiliation_string":"Innovation Center for MicroNanoelectronics and Integrated System, Beijing, China","institution_ids":[]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5109790755"],"corresponding_institution_ids":["https://openalex.org/I20231570"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.13579447,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"470","last_page":"475"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/anodic-bonding","display_name":"Anodic bonding","score":0.968464732170105},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.8593044281005859},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.783510684967041},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.6911863684654236},{"id":"https://openalex.org/keywords/anode","display_name":"Anode","score":0.5913213491439819},{"id":"https://openalex.org/keywords/wafer-bonding","display_name":"Wafer bonding","score":0.5270426869392395},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5121719837188721},{"id":"https://openalex.org/keywords/groove","display_name":"Groove (engineering)","score":0.48491936922073364},{"id":"https://openalex.org/keywords/direct-bonding","display_name":"Direct bonding","score":0.4585130214691162},{"id":"https://openalex.org/keywords/hybrid-silicon-laser","display_name":"Hybrid silicon laser","score":0.452671080827713},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.42029982805252075},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.4188048541545868},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3325125277042389},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.2665785551071167},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.11656969785690308}],"concepts":[{"id":"https://openalex.org/C201414436","wikidata":"https://www.wikidata.org/wiki/Q567503","display_name":"Anodic bonding","level":3,"score":0.968464732170105},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.8593044281005859},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.783510684967041},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.6911863684654236},{"id":"https://openalex.org/C89395315","wikidata":"https://www.wikidata.org/wiki/Q181232","display_name":"Anode","level":3,"score":0.5913213491439819},{"id":"https://openalex.org/C2779133538","wikidata":"https://www.wikidata.org/wiki/Q677010","display_name":"Wafer bonding","level":3,"score":0.5270426869392395},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5121719837188721},{"id":"https://openalex.org/C2779472054","wikidata":"https://www.wikidata.org/wiki/Q2377973","display_name":"Groove (engineering)","level":2,"score":0.48491936922073364},{"id":"https://openalex.org/C2778071519","wikidata":"https://www.wikidata.org/wiki/Q5280309","display_name":"Direct bonding","level":3,"score":0.4585130214691162},{"id":"https://openalex.org/C139159486","wikidata":"https://www.wikidata.org/wiki/Q5953298","display_name":"Hybrid silicon laser","level":3,"score":0.452671080827713},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.42029982805252075},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.4188048541545868},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3325125277042389},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2665785551071167},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.11656969785690308},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2015.7147470","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2015.7147470","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1783323529","https://openalex.org/W1971249977","https://openalex.org/W1986620377","https://openalex.org/W1991762866","https://openalex.org/W1995058309","https://openalex.org/W2007762999","https://openalex.org/W2011733486","https://openalex.org/W2011911729","https://openalex.org/W2031504198","https://openalex.org/W2084732554","https://openalex.org/W2090324681","https://openalex.org/W2166747328","https://openalex.org/W2166895986"],"related_works":["https://openalex.org/W4241278528","https://openalex.org/W2582960117","https://openalex.org/W2887301363","https://openalex.org/W1990895528","https://openalex.org/W3080102995","https://openalex.org/W1906666741","https://openalex.org/W651005398","https://openalex.org/W3008251946","https://openalex.org/W634104171","https://openalex.org/W1882643327"],"abstract_inverted_index":{"This":[0,34],"paper":[1],"reports":[2],"a":[3,84],"silicon-silicon":[4],"anodic":[5,31,73],"bonding":[6,32,41,48,63,74],"process":[7,35,79],"based":[8],"on":[9],"embedded":[10,14],"glass.":[11],"We":[12],"successfully":[13],"glass":[15],"into":[16],"patterned":[17],"silicon":[18,28,55],"groove":[19],"by":[20,30],"fusion":[21],"treatment":[22],"and":[23,43],"bonded":[24],"it":[25],"with":[26,71],"another":[27],"wafer":[29],"process.":[33],"realizes":[36],"the":[37,44,47,62,78],"precise":[38],"control":[39],"of":[40,46,87],"pattern":[42],"depth":[45],"gap":[49],"without":[50],"electrical":[51],"connection":[52],"between":[53],"two":[54],"wafers.":[56],"Tension":[57],"test":[58],"result":[59],"shows":[60],"that":[61,77],"strength":[64],"is":[65,68],"over":[66],"7MPa-which":[67],"in":[69,83],"accordance":[70],"normal":[72],"process,":[75],"so":[76],"can":[80],"be":[81],"used":[82],"wide":[85],"range":[86],"MEMS":[88],"devices":[89],"design.":[90]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}