{"id":"https://openalex.org/W2293230057","doi":"https://doi.org/10.1109/nems.2015.7147422","title":"Fabrication of microfluidic chip using foil-assisted CO&lt;inf&gt;2&lt;/inf&gt; laser ablation for suspended particles separation","display_name":"Fabrication of microfluidic chip using foil-assisted CO&lt;inf&gt;2&lt;/inf&gt; laser ablation for suspended particles separation","publication_year":2015,"publication_date":"2015-04-01","ids":{"openalex":"https://openalex.org/W2293230057","doi":"https://doi.org/10.1109/nems.2015.7147422","mag":"2293230057"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2015.7147422","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2015.7147422","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103059384","display_name":"Hui Long","orcid":"https://orcid.org/0000-0001-7360-839X"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"H.P. Long","raw_affiliation_strings":["Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060843930","display_name":"Chien\u2010Chih Lai","orcid":"https://orcid.org/0000-0002-8572-116X"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C. C. Lai","raw_affiliation_strings":["Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Dep't of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5032336401","display_name":"C.K. Chung","orcid":"https://orcid.org/0000-0003-4068-5713"},"institutions":[{"id":"https://openalex.org/I91807558","display_name":"National Cheng Kung University","ror":"https://ror.org/01b8kcc49","country_code":"TW","type":"education","lineage":["https://openalex.org/I91807558"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C.K. Chung","raw_affiliation_strings":["Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan"],"affiliations":[{"raw_affiliation_string":"Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan","institution_ids":["https://openalex.org/I91807558"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5103059384"],"corresponding_institution_ids":["https://openalex.org/I91807558"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13712119,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"259","last_page":"262"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12776","display_name":"Electrohydrodynamics and Fluid Dynamics","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9944999814033508,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.6939653158187866},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.687025785446167},{"id":"https://openalex.org/keywords/laser-ablation","display_name":"Laser ablation","score":0.6837899684906006},{"id":"https://openalex.org/keywords/foil-method","display_name":"FOIL method","score":0.6085549592971802},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5799692273139954},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5255060195922852},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.48900043964385986},{"id":"https://openalex.org/keywords/lab-on-a-chip","display_name":"Lab-on-a-chip","score":0.4696468710899353},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.4379427433013916},{"id":"https://openalex.org/keywords/laser-power-scaling","display_name":"Laser power scaling","score":0.42316609621047974},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3838025629520416},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.35592901706695557},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.19019511342048645},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.15607059001922607},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.08438074588775635},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07922062277793884},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.07542195916175842}],"concepts":[{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.6939653158187866},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.687025785446167},{"id":"https://openalex.org/C2779188808","wikidata":"https://www.wikidata.org/wiki/Q1806547","display_name":"Laser ablation","level":3,"score":0.6837899684906006},{"id":"https://openalex.org/C7363328","wikidata":"https://www.wikidata.org/wiki/Q5426847","display_name":"FOIL method","level":2,"score":0.6085549592971802},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5799692273139954},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5255060195922852},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.48900043964385986},{"id":"https://openalex.org/C138942068","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Lab-on-a-chip","level":3,"score":0.4696468710899353},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.4379427433013916},{"id":"https://openalex.org/C200649887","wikidata":"https://www.wikidata.org/wiki/Q17154544","display_name":"Laser power scaling","level":3,"score":0.42316609621047974},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3838025629520416},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.35592901706695557},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.19019511342048645},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.15607059001922607},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.08438074588775635},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07922062277793884},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.07542195916175842},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2015.7147422","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2015.7147422","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1995139987","https://openalex.org/W2006197460","https://openalex.org/W2064198640","https://openalex.org/W2064956185","https://openalex.org/W2092624440","https://openalex.org/W2162444401"],"related_works":["https://openalex.org/W2000498910","https://openalex.org/W2367499065","https://openalex.org/W2102015927","https://openalex.org/W2204555772","https://openalex.org/W2074558432","https://openalex.org/W2061864336","https://openalex.org/W2044909375","https://openalex.org/W1982436220","https://openalex.org/W2900086570","https://openalex.org/W2012930172"],"abstract_inverted_index":{"Lab":[0],"on":[1,122],"a":[2,29,67,142],"chip":[3,70,120],"was":[4,16,63],"mainly":[5],"used":[6,64],"in":[7,117],"the":[8,19,23,43,75,123],"simplification":[9],"of":[10,18,32,77,127],"biomedical":[11],"detection":[12,24],"step":[13,37],"and":[14,34,90,102,108,131],"separation":[15,44,119,139],"one":[17],"indispensable":[20],"pretreatment":[21],"during":[22],"process.":[25],"In":[26],"this":[27],"study,":[28],"combination":[30],"channel":[31],"spiral":[33,68,128],"backward":[35,132],"facing":[36,133],"patterns":[38],"were":[39],"designed":[40],"to":[41,65,114],"optimize":[42],"function":[45],"without":[46],"any":[47],"extra":[48],"power":[49],"like":[50],"electric":[51],"or":[52],"magnetic":[53],"field.":[54],"The":[55,81,100],"foil-assisted":[56,96],"CO":[57],"<sub":[58],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[59],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sub>":[60],"laser":[61,82,97],"method":[62],"fabricate":[66],"microfluidic":[69,118],"with":[71,88],"polymethylmethacrylate":[72],"polymer":[73],"for":[74],"master":[76],"suspended":[78],"particles":[79],"separation.":[80],"ablation":[83],"generated":[84],"poor":[85],"surfaces":[86],"quality":[87],"bulge":[89],"scorches":[91],"can":[92,136],"be":[93],"diminished":[94],"using":[95],"micromachining":[98],"technique.":[99],"low-cost":[101],"time-saving":[103],"procedure,":[104],"including":[105],"microchip":[106],"fabrication":[107],"surface":[109],"modification,":[110],"has":[111],"been":[112],"developed":[113],"apply":[115],"positively":[116],"based":[121],"flow":[124,144],"distribution":[125],"design":[126],"dean":[129],"vortices":[130],"step,":[134],"which":[135],"provide":[137],"99%":[138],"efficiency":[140],"within":[141],"certain":[143],"range.":[145]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}