{"id":"https://openalex.org/W2081066326","doi":"https://doi.org/10.1109/nems.2014.6908865","title":"Size scaling of printed microstructures using a lift-off printing (LoP) process","display_name":"Size scaling of printed microstructures using a lift-off printing (LoP) process","publication_year":2014,"publication_date":"2014-04-01","ids":{"openalex":"https://openalex.org/W2081066326","doi":"https://doi.org/10.1109/nems.2014.6908865","mag":"2081066326"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2014.6908865","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2014.6908865","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100874338","display_name":"Yu-Min Fu","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Yu-Min Fu","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, TW","Dept. of Electronics Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, TW","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Dept. of Electronics Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5002139602","display_name":"Yen-Ju Liang","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yen-Ju Liang","raw_affiliation_strings":["Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, TW","Department of Materials Science and Engineering, National Chiao Tung University, HsinChu, 30010, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, TW","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Materials Science and Engineering, National Chiao Tung University, HsinChu, 30010, Taiwan","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101834213","display_name":"Yu\u2010Ting Cheng","orcid":"https://orcid.org/0000-0003-1191-8979"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Y.T. Cheng","raw_affiliation_strings":["Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","Institute of Electronics"],"affiliations":[{"raw_affiliation_string":"Department of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Institute of Electronics","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101796376","display_name":"Pu\u2010Wei Wu","orcid":"https://orcid.org/0000-0002-0861-9911"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Pu-Wei Wu","raw_affiliation_strings":["Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, TW","Department of Materials Science and Engineering"],"affiliations":[{"raw_affiliation_string":"Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, TW","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Materials Science and Engineering","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5100874338"],"corresponding_institution_ids":["https://openalex.org/I148366613"],"apc_list":null,"apc_paid":null,"fwci":0.2093,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.604789,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"530","last_page":"531"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microfabrication","display_name":"Microfabrication","score":0.7890243530273438},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7126494646072388},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.6017965078353882},{"id":"https://openalex.org/keywords/screen-printing","display_name":"Screen printing","score":0.5577118992805481},{"id":"https://openalex.org/keywords/lift","display_name":"Lift (data mining)","score":0.48676490783691406},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.4807300567626953},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.4712650775909424},{"id":"https://openalex.org/keywords/photomask","display_name":"Photomask","score":0.45976346731185913},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.4346321225166321},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.42587292194366455},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4231763482093811},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4170560836791992},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.4152982831001282},{"id":"https://openalex.org/keywords/line-width","display_name":"Line width","score":0.4140647351741791},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3295328915119171},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2635738253593445},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.2249281108379364},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.19254139065742493},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.09372976422309875},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.07765600085258484}],"concepts":[{"id":"https://openalex.org/C527607","wikidata":"https://www.wikidata.org/wiki/Q175538","display_name":"Microfabrication","level":4,"score":0.7890243530273438},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7126494646072388},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.6017965078353882},{"id":"https://openalex.org/C2776422346","wikidata":"https://www.wikidata.org/wiki/Q187791","display_name":"Screen printing","level":2,"score":0.5577118992805481},{"id":"https://openalex.org/C139002025","wikidata":"https://www.wikidata.org/wiki/Q3001212","display_name":"Lift (data mining)","level":2,"score":0.48676490783691406},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.4807300567626953},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4712650775909424},{"id":"https://openalex.org/C14737013","wikidata":"https://www.wikidata.org/wiki/Q1319657","display_name":"Photomask","level":4,"score":0.45976346731185913},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.4346321225166321},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.42587292194366455},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4231763482093811},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4170560836791992},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.4152982831001282},{"id":"https://openalex.org/C3017524520","wikidata":"https://www.wikidata.org/wiki/Q212111","display_name":"Line width","level":2,"score":0.4140647351741791},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3295328915119171},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2635738253593445},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.2249281108379364},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.19254139065742493},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.09372976422309875},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.07765600085258484},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C53524968","wikidata":"https://www.wikidata.org/wiki/Q7315582","display_name":"Resist","level":3,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C124101348","wikidata":"https://www.wikidata.org/wiki/Q172491","display_name":"Data mining","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2014.6908865","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2014.6908865","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321040","display_name":"National Science Council","ror":"https://ror.org/02kv4zf79"},{"id":"https://openalex.org/F4320323443","display_name":"National Chiao Tung University","ror":"https://ror.org/00se2k293"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1964074439","https://openalex.org/W1980015073","https://openalex.org/W1990251283","https://openalex.org/W2007238197","https://openalex.org/W2035533155","https://openalex.org/W2127209661","https://openalex.org/W2129732265","https://openalex.org/W2158757477","https://openalex.org/W6659272935"],"related_works":["https://openalex.org/W4390482314","https://openalex.org/W2885344930","https://openalex.org/W1761205390","https://openalex.org/W2968163056","https://openalex.org/W1988683331","https://openalex.org/W1982955487","https://openalex.org/W2467622408","https://openalex.org/W2092116273","https://openalex.org/W4303470678","https://openalex.org/W4297921203"],"abstract_inverted_index":{"Inkjet":[0],"printing":[1,39],"has":[2,85],"been":[3,86],"one":[4],"of":[5,14,53,62,83,92],"fascinating":[6],"techniques":[7],"for":[8],"microfabrication":[9],"owing":[10],"to":[11,43,56],"the":[12,50,60,78],"characteristics":[13],"low":[15,18,21],"manufacturing":[16],"cost,":[17],"processing":[19],"temperature,":[20],"material":[22],"usage,...etc.":[23],"[1,":[24],"2].":[25],"In":[26,71],"this":[27],"work,":[28],"a":[29,68,90],"Lift-off":[30],"Printing":[31],"(LoP)":[32],"process":[33],"combining":[34],"conventional":[35],"photolithography":[36],"and":[37,59,81],"inkjet":[38],"processes":[40],"is":[41],"introduced":[42],"realize":[44],"printed":[45],"size-scalable":[46],"silver":[47],"microstructures":[48],"with":[49,77,89],"line":[51],"width":[52],"5":[54],"up":[55],"70":[57],"\u03bcm":[58],"resistivity":[61],"~5.7":[63],"\u03bc\u03a9":[64],"\u00b7":[65],"cm":[66],"on":[67],"silicon":[69],"substrate.":[70],"addition,":[72],"an":[73],"as-printed":[74],"interdigitated":[75],"capacitor":[76],"electrode":[79],"size":[80],"spacing":[82],"10\u03bcm":[84],"successfully":[87],"demonstrated":[88],"capacitance":[91],"2.3":[93],"pF/mm":[94],"<sup":[95],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[96],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[97],"@10kHz.":[98]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
