{"id":"https://openalex.org/W2086036765","doi":"https://doi.org/10.1109/nems.2014.6908861","title":"Study on compatible CMOS-MEMS process with surface micromachining for the application of monolithic integration","display_name":"Study on compatible CMOS-MEMS process with surface micromachining for the application of monolithic integration","publication_year":2014,"publication_date":"2014-04-01","ids":{"openalex":"https://openalex.org/W2086036765","doi":"https://doi.org/10.1109/nems.2014.6908861","mag":"2086036765"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2014.6908861","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2014.6908861","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100839683","display_name":"Danqi Zhao","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Danqi Zhao","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021712995","display_name":"Xian Huang","orcid":"https://orcid.org/0000-0002-8788-9185"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xian Huang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036788059","display_name":"Jun He","orcid":"https://orcid.org/0000-0002-4353-5123"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jun He","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100425562","display_name":"Li Zhang","orcid":"https://orcid.org/0000-0002-4015-7665"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Zhang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100346795","display_name":"Peng Liu","orcid":"https://orcid.org/0000-0002-1860-5126"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Peng Liu","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100729265","display_name":"Fang Yang","orcid":"https://orcid.org/0000-0003-4855-585X"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Fang Yang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064674645","display_name":"Dacheng Zhang","orcid":"https://orcid.org/0000-0002-3614-6605"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dacheng Zhang","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2129,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.61401476,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"20","issue":null,"first_page":"513","last_page":"516"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.8653966784477234},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.832757830619812},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8206892013549805},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6265765428543091},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6256406903266907},{"id":"https://openalex.org/keywords/cantilever","display_name":"Cantilever","score":0.5846686363220215},{"id":"https://openalex.org/keywords/bulk-micromachining","display_name":"Bulk micromachining","score":0.5828894376754761},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.43410399556159973},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41321516036987305},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.35879087448120117},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2643592953681946},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23347127437591553}],"concepts":[{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.8653966784477234},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.832757830619812},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8206892013549805},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6265765428543091},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6256406903266907},{"id":"https://openalex.org/C141354745","wikidata":"https://www.wikidata.org/wiki/Q17227","display_name":"Cantilever","level":2,"score":0.5846686363220215},{"id":"https://openalex.org/C41075158","wikidata":"https://www.wikidata.org/wiki/Q4996485","display_name":"Bulk micromachining","level":5,"score":0.5828894376754761},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.43410399556159973},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41321516036987305},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.35879087448120117},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2643592953681946},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23347127437591553},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2014.6908861","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2014.6908861","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2032085531","https://openalex.org/W2045207500","https://openalex.org/W2096296620","https://openalex.org/W2128867538","https://openalex.org/W2155130025"],"related_works":["https://openalex.org/W2048171849","https://openalex.org/W2296264082","https://openalex.org/W1501419981","https://openalex.org/W3215636742","https://openalex.org/W2096478611","https://openalex.org/W1991559067","https://openalex.org/W2022641457","https://openalex.org/W199926285","https://openalex.org/W2114051864","https://openalex.org/W1563566515"],"abstract_inverted_index":{"In":[0],"this":[1],"work,":[2],"compatible":[3],"CMOS-MEMS":[4],"process":[5,72],"with":[6,20],"surface":[7],"micromachining":[8,12],"is":[9,29],"investigated.":[10],"Surface":[11],"method":[13],"for":[14,51],"cantilever":[15],"fabrication":[16],"has":[17],"been":[18],"merged":[19],"conventional":[21],"CMOS":[22,32,42,78],"process,":[23],"and":[24,44,69,77],"release":[25],"of":[26,54,57,66],"MEMS":[27,37,76],"structure":[28],"conducted":[30],"after":[31],"process.":[33],"We":[34],"designed":[35],"polysilicon":[36],"structures":[38],"as":[39,41],"well":[40],"devices":[43],"circuits":[45],"on":[46,73],"a":[47],"monolithic":[48],"sensor":[49],"chip":[50],"the":[52,55,70,75],"investigation":[53],"influence":[56],"stress":[58],"induced":[59],"by":[60],"non-adequate":[61],"post-CMOS":[62],"annealing.":[63],"The":[64],"impact":[65],"step":[67],"coverage":[68],"releasing":[71],"both":[74],"components":[79],"are":[80],"also":[81],"discussed.":[82]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}