{"id":"https://openalex.org/W2044746812","doi":"https://doi.org/10.1109/nems.2013.6559937","title":"Carbon Nanotube based heat-sink for solid state lighting","display_name":"Carbon Nanotube based heat-sink for solid state lighting","publication_year":2013,"publication_date":"2013-04-01","ids":{"openalex":"https://openalex.org/W2044746812","doi":"https://doi.org/10.1109/nems.2013.6559937","mag":"2044746812"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2013.6559937","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559937","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5038925015","display_name":"F. Santagata","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"F. Santagata","raw_affiliation_strings":["Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039949058","display_name":"G. Almanno","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"G. Almanno","raw_affiliation_strings":["Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5070563872","display_name":"Sten Vollebregt","orcid":"https://orcid.org/0000-0001-6012-6180"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"S. Vollebregt","raw_affiliation_strings":["Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089539373","display_name":"Cinzia Silvestri","orcid":"https://orcid.org/0000-0003-2759-6935"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"C. Silvestri","raw_affiliation_strings":["Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073898752","display_name":"G. Q. Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"G.Q. Zhang","raw_affiliation_strings":["Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064630364","display_name":"P.M. Sarro","orcid":"https://orcid.org/0000-0002-2766-0880"},"institutions":[{"id":"https://openalex.org/I98358874","display_name":"Delft University of Technology","ror":"https://ror.org/02e2c7k09","country_code":"NL","type":"education","lineage":["https://openalex.org/I98358874"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"P.M. Sarro","raw_affiliation_strings":["Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Laboratory of Electronic Components, Technology & Materials (ECTM), DIMES, Delft University of Technology, Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]},{"raw_affiliation_string":"Lab. of Electron. Components, Technol. & Mater. (ECTM), Delft Univ. of Technol., Delft, Netherlands","institution_ids":["https://openalex.org/I98358874"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.4604,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.61908336,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1214","last_page":"1217"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10074","display_name":"Carbon Nanotubes in Composites","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10074","display_name":"Carbon Nanotubes in Composites","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/heat-sink","display_name":"Heat sink","score":0.916254997253418},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8131839036941528},{"id":"https://openalex.org/keywords/carbon-nanotube","display_name":"Carbon nanotube","score":0.7598035335540771},{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.6594550609588623},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.6329003572463989},{"id":"https://openalex.org/keywords/resistor","display_name":"Resistor","score":0.4642793536186218},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4632139801979065},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.4425590932369232},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.42659616470336914},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.39292019605636597},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.1960638463497162},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1089295744895935}],"concepts":[{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.916254997253418},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8131839036941528},{"id":"https://openalex.org/C513720949","wikidata":"https://www.wikidata.org/wiki/Q1778729","display_name":"Carbon nanotube","level":2,"score":0.7598035335540771},{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.6594550609588623},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6329003572463989},{"id":"https://openalex.org/C137488568","wikidata":"https://www.wikidata.org/wiki/Q5321","display_name":"Resistor","level":3,"score":0.4642793536186218},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4632139801979065},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.4425590932369232},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.42659616470336914},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.39292019605636597},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.1960638463497162},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1089295744895935},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2013.6559937","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559937","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.7599999904632568,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1497292730","https://openalex.org/W2000482538","https://openalex.org/W2034885124","https://openalex.org/W2045617351","https://openalex.org/W2135946075","https://openalex.org/W2156259175","https://openalex.org/W6629759377"],"related_works":["https://openalex.org/W2367275322","https://openalex.org/W2094693852","https://openalex.org/W4255119783","https://openalex.org/W2726952278","https://openalex.org/W2327591730","https://openalex.org/W2115443918","https://openalex.org/W2159337632","https://openalex.org/W1977927964","https://openalex.org/W2353179748","https://openalex.org/W2012956325"],"abstract_inverted_index":{"A":[0,85],"new":[1],"carbon-nanotube-based":[2],"(CNTs)":[3],"heat":[4,25,47,93],"sink":[5],"is":[6,51,58,65,88],"developed.":[7],"Due":[8],"to":[9,90,103],"their":[10],"high":[11,29],"thermal":[12,43,86],"conductivity":[13],"and":[14,56],"aspect":[15,35],"ratio,":[16],"CNT":[17],"boundles":[18],"are":[19,39],"used":[20,60],"as":[21,28,30,61,74],"fins":[22],"of":[23,37,45,82,105],"the":[24,42,46,54,69,92,96,112],"sink.":[26],"Fins":[27],"300":[31],"\u03bcm":[32],"with":[33,53,111],"an":[34],"ratio":[36],"30":[38],"fabricated.":[40],"For":[41],"characterization":[44,87],"sink,":[48],"a":[49,80],"microheater":[50],"integrated":[52],"heat-sink":[55,115],"it":[57],"also":[59],"temperature":[62],"sensor.":[63],"It":[64],"realized":[66],"by":[67,95],"using":[68],"low":[70],"doped":[71],"silicon":[72],"bulk":[73],"electrical":[75],"resistor.":[76],"The":[77],"sensor":[78],"shows":[79],"sensitivity":[81],"0.6":[83],"\u03a9/K.":[84],"performed":[89],"evaluate":[91],"dissipated":[94],"CNT-based":[97],"heat-sink.":[98],"Results":[99],"show":[100],"that":[101],"up":[102],"18%":[104],"power":[106],"reduction":[107],"can":[108],"be":[109],"achieved":[110],"proposed":[113],"CNTs-based":[114],"configuration.":[116]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":2}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}