{"id":"https://openalex.org/W1972767198","doi":"https://doi.org/10.1109/nems.2013.6559868","title":"Silicon carbide capacitive pressure sensors with arrayed sensing membranes","display_name":"Silicon carbide capacitive pressure sensors with arrayed sensing membranes","publication_year":2013,"publication_date":"2013-04-01","ids":{"openalex":"https://openalex.org/W1972767198","doi":"https://doi.org/10.1109/nems.2013.6559868","mag":"1972767198"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2013.6559868","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559868","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5002810369","display_name":"Bo Meng","orcid":"https://orcid.org/0000-0003-0457-7942"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Meng","raw_affiliation_strings":["Institute of Microelectronics, Peking University, China","Inst. of Microelectron. Peking Univ., Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Peking University, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Inst. of Microelectron. Peking Univ., Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071087797","display_name":"Wei Tang","orcid":"https://orcid.org/0000-0002-9901-4933"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Tang","raw_affiliation_strings":["Institute of Microelectronics, Peking University, China","Inst. of Microelectron. Peking Univ., Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Peking University, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Inst. of Microelectron. Peking Univ., Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013768611","display_name":"Xuhua Peng","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuhua Peng","raw_affiliation_strings":["Institute of Microelectronics, Peking University, China","Inst. of Microelectron. Peking Univ., Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Peking University, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Inst. of Microelectron. Peking Univ., Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100375644","display_name":"Haixia Zhang","orcid":"https://orcid.org/0000-0003-4565-4123"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haixia Zhang","raw_affiliation_strings":["Institute of Microelectronics, Peking University, China","Inst. of Microelectron. Peking Univ., Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Peking University, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"Inst. of Microelectron. Peking Univ., Beijing, China","institution_ids":["https://openalex.org/I20231570"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.05236827,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"899","last_page":"902"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10361","display_name":"Silicon Carbide Semiconductor Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12495","display_name":"Electrostatic Discharge in Electronics","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10623","display_name":"Thin-Film Transistor Technologies","score":0.9915000200271606,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.8477989435195923},{"id":"https://openalex.org/keywords/silicon-carbide","display_name":"Silicon carbide","score":0.7560839653015137},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6809718608856201},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.5984646081924438},{"id":"https://openalex.org/keywords/membrane","display_name":"Membrane","score":0.5952871441841125},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4751948118209839},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.32504960894584656},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.23532935976982117},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1882358193397522},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12693065404891968},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.11275827884674072},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.10945796966552734}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.8477989435195923},{"id":"https://openalex.org/C2780722187","wikidata":"https://www.wikidata.org/wiki/Q412356","display_name":"Silicon carbide","level":2,"score":0.7560839653015137},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6809718608856201},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.5984646081924438},{"id":"https://openalex.org/C41625074","wikidata":"https://www.wikidata.org/wiki/Q176088","display_name":"Membrane","level":2,"score":0.5952871441841125},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4751948118209839},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.32504960894584656},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.23532935976982117},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1882358193397522},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12693065404891968},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.11275827884674072},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.10945796966552734},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2013.6559868","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559868","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.4099999964237213}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320324787","display_name":"Peking University","ror":"https://ror.org/02v51f717"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1970311093","https://openalex.org/W2002048780","https://openalex.org/W2018019678","https://openalex.org/W2040661646","https://openalex.org/W2060331409","https://openalex.org/W2084064945","https://openalex.org/W2172277242"],"related_works":["https://openalex.org/W3015749751","https://openalex.org/W4387713458","https://openalex.org/W2372430764","https://openalex.org/W4311325650","https://openalex.org/W1979670679","https://openalex.org/W4318066946","https://openalex.org/W2980663142","https://openalex.org/W4226072595","https://openalex.org/W769946470","https://openalex.org/W2169474132"],"abstract_inverted_index":{"Silicon":[0],"carbide":[1],"absolute":[2],"capacitive":[3],"pressure":[4,120],"sensors":[5],"with":[6,43,99],"arrayed":[7],"sensing":[8,20,110],"membranes":[9,21,111],"was":[10,41],"designed":[11],"and":[12,62,128],"fabricated":[13,39],"based":[14],"on":[15],"silicon-glass":[16],"anodic":[17],"bonding.":[18],"The":[19,38,76],"consist":[22],"of":[23,26,51,73,103,115],"multiple":[24],"layers":[25],"SiC/Au/SiC,":[27],"making":[28],"the":[29,70,74,81,91,97],"device":[30],"promising":[31],"to":[32,125,131],"be":[33],"applied":[34],"in":[35,48],"corrosive":[36],"environment.":[37],"sensor":[40,78,98],"integrated":[42],"a":[44,49,100,113,119],"capacitor":[45],"read-out":[46],"circuit":[47],"size":[50],"22":[52],"\u00d7":[53,55],"23":[54],"9":[56],"mm":[57],"<sup":[58,106],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[59,107],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">3</sup>":[60],",":[61],"then":[63,129],"packaged":[64,77],"by":[65],"PDMS,":[66],"which":[67],"serves":[68],"as":[69,90],"coating":[71],"layer":[72],"electrodes.":[75],"remained":[79],"nearly":[80],"same":[82],"linear":[83],"response":[84],"after":[85,133],"60-minutes":[86],"30%":[87],"KOH":[88,134],"etching":[89],"one":[92],"before":[93],"PDMS":[94],"packaging,":[95],"i.e.":[96],"5\u00d75":[101],"array":[102],"100\u00d7100":[104],"\u03bcm":[105],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[108],"square":[109],"demonstrates":[112],"sensitivity":[114],"0.021":[116],"pF/bar":[117],"over":[118],"range":[121],"from":[122],"0.5":[123],"bar":[124],"5":[126],"bar,":[127],"modified":[130],"0.023pF/bar":[132],"etching.":[135]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}