{"id":"https://openalex.org/W1985548659","doi":"https://doi.org/10.1109/nems.2013.6559864","title":"Micro process engineering of freestanding silicon fluidic channels with integrated platinum thermistors for obtaining heat transfer correlations","display_name":"Micro process engineering of freestanding silicon fluidic channels with integrated platinum thermistors for obtaining heat transfer correlations","publication_year":2013,"publication_date":"2013-04-01","ids":{"openalex":"https://openalex.org/W1985548659","doi":"https://doi.org/10.1109/nems.2013.6559864","mag":"1985548659"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2013.6559864","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559864","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5058273537","display_name":"Reinhard Roth","orcid":null},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"R. Roth","raw_affiliation_strings":["Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany"],"affiliations":[{"raw_affiliation_string":"Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049738479","display_name":"Keith Cobry","orcid":null},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"K. Cobry","raw_affiliation_strings":["Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany"],"affiliations":[{"raw_affiliation_string":"Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5040337999","display_name":"Gabriel Lenk","orcid":"https://orcid.org/0000-0002-1404-3058"},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"G. Lenk","raw_affiliation_strings":["Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany"],"affiliations":[{"raw_affiliation_string":"Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5005853373","display_name":"Peter Woias","orcid":"https://orcid.org/0000-0002-4715-6032"},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"P. Woias","raw_affiliation_strings":["Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany"],"affiliations":[{"raw_affiliation_string":"Laboratory for the Design of Microsystems, IMTEK, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Lab. for the Design of Microsyst., Univ. of Freiburg, Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5058273537"],"corresponding_institution_ids":["https://openalex.org/I161046081"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.10312713,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"162","issue":null,"first_page":"879","last_page":"882"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10998","display_name":"Heat Transfer and Optimization","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10850","display_name":"Heat Transfer and Boiling Studies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/deep-reactive-ion-etching","display_name":"Deep reactive-ion etching","score":0.8464757204055786},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7769827842712402},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.7352660894393921},{"id":"https://openalex.org/keywords/wafer-dicing","display_name":"Wafer dicing","score":0.6641058325767517},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.6486046314239502},{"id":"https://openalex.org/keywords/laminar-flow","display_name":"Laminar flow","score":0.6139171719551086},{"id":"https://openalex.org/keywords/thermistor","display_name":"Thermistor","score":0.592078447341919},{"id":"https://openalex.org/keywords/fluid-dynamics","display_name":"Fluid dynamics","score":0.4383552372455597},{"id":"https://openalex.org/keywords/heat-transfer-coefficient","display_name":"Heat transfer coefficient","score":0.4257320761680603},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.31404563784599304},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.31364762783050537},{"id":"https://openalex.org/keywords/reactive-ion-etching","display_name":"Reactive-ion etching","score":0.31005018949508667},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.30968838930130005},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.21685189008712769},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1300758421421051},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.08155810832977295}],"concepts":[{"id":"https://openalex.org/C124634506","wikidata":"https://www.wikidata.org/wiki/Q486936","display_name":"Deep reactive-ion etching","level":5,"score":0.8464757204055786},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7769827842712402},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.7352660894393921},{"id":"https://openalex.org/C165013422","wikidata":"https://www.wikidata.org/wiki/Q4388382","display_name":"Wafer dicing","level":3,"score":0.6641058325767517},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.6486046314239502},{"id":"https://openalex.org/C76563973","wikidata":"https://www.wikidata.org/wiki/Q189452","display_name":"Laminar flow","level":2,"score":0.6139171719551086},{"id":"https://openalex.org/C66726788","wikidata":"https://www.wikidata.org/wiki/Q175973","display_name":"Thermistor","level":2,"score":0.592078447341919},{"id":"https://openalex.org/C90278072","wikidata":"https://www.wikidata.org/wiki/Q216320","display_name":"Fluid dynamics","level":2,"score":0.4383552372455597},{"id":"https://openalex.org/C29700514","wikidata":"https://www.wikidata.org/wiki/Q634340","display_name":"Heat transfer coefficient","level":3,"score":0.4257320761680603},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.31404563784599304},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.31364762783050537},{"id":"https://openalex.org/C130472188","wikidata":"https://www.wikidata.org/wiki/Q1640159","display_name":"Reactive-ion etching","level":4,"score":0.31005018949508667},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.30968838930130005},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.21685189008712769},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1300758421421051},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.08155810832977295},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2013.6559864","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559864","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.4399999976158142,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1991433776","https://openalex.org/W2001189095","https://openalex.org/W2018018298","https://openalex.org/W2039235747","https://openalex.org/W2071313391","https://openalex.org/W2088113853","https://openalex.org/W2099807199"],"related_works":["https://openalex.org/W2102326768","https://openalex.org/W1993178593","https://openalex.org/W2507729704","https://openalex.org/W3163667899","https://openalex.org/W2516869960","https://openalex.org/W2360464821","https://openalex.org/W1504164758","https://openalex.org/W2014359839","https://openalex.org/W2026923884","https://openalex.org/W2027983671"],"abstract_inverted_index":{"The":[0,26,96],"heat":[1,45,63,137],"transfer":[2,117],"in":[3,21,111],"silicon":[4,82],"microchannels":[5],"with":[6,121],"integrated":[7,71],"inline":[8],"and":[9,44,60,84,93],"staggered":[10],"pin":[11,109],"fin":[12],"arrays":[13],"is":[14,49],"evaluated":[15],"at":[16],"clearance-to-diameter":[17,133],"ratios":[18],"of":[19,37,103,131],"0.5-0.77":[20],"the":[22,38,53,57,61,74,81,104,108,112,128,132],"laminar":[23],"flow":[24,43],"regime.":[25],"channels":[27],"have":[28],"a":[29,34,100,122],"small":[30],"width,":[31],"leading":[32],"to":[33],"significant":[35,101],"influence":[36,48,130],"channel":[39,58,75],"walls":[40],"on":[41,135],"fluid":[42,105],"transfer.":[46,64,138],"Their":[47],"considered":[50],"when":[51],"measuring":[52],"temperature":[54],"distribution":[55],"along":[56],"length":[59],"average":[62],"For":[65],"this":[66],"purpose":[67],"platinum":[68],"thermistors":[69],"are":[70,78,119],"directly":[72],"into":[73],"structures,":[76],"which":[77],"released":[79],"from":[80],"substrate":[83],"made":[85],"freestanding":[86],"via":[87],"deep":[88],"reactive":[89],"ion":[90],"etching":[91],"(DRIE)":[92],"selective":[94],"dicing.":[95],"measurements":[97],"show":[98],"that":[99,126],"portion":[102],"flows":[106],"below":[107],"fins":[110],"clearance":[113],"bypass":[114],"region.":[115],"Heat":[116],"correlations":[118],"developed":[120],"new":[123],"functional":[124],"form":[125],"considers":[127],"strong":[129],"ratio":[134],"overall":[136]},"counts_by_year":[{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}