{"id":"https://openalex.org/W2148910569","doi":"https://doi.org/10.1109/nems.2013.6559795","title":"Micro-Raman spectroscopy analysis of residual stress in polysilicon MEMS resonators","display_name":"Micro-Raman spectroscopy analysis of residual stress in polysilicon MEMS resonators","publication_year":2013,"publication_date":"2013-04-01","ids":{"openalex":"https://openalex.org/W2148910569","doi":"https://doi.org/10.1109/nems.2013.6559795","mag":"2148910569"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2013.6559795","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559795","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5070615518","display_name":"Chenxu Zhao","orcid":"https://orcid.org/0000-0002-3960-6523"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chenxu Zhao","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108483583","display_name":"Mengwei Li","orcid":"https://orcid.org/0009-0006-9913-8123"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Mengwei Li","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101561263","display_name":"Ming Yin","orcid":"https://orcid.org/0000-0002-4186-4011"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ming Yin","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101809661","display_name":"Zewen Liu","orcid":"https://orcid.org/0000-0003-2582-8042"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zewen Liu","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.2559308,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"570","last_page":"573"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.8047579526901245},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.775047779083252},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7627450823783875},{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.7153517603874207},{"id":"https://openalex.org/keywords/raman-spectroscopy","display_name":"Raman spectroscopy","score":0.6943344473838806},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.5822704434394836},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5274572372436523},{"id":"https://openalex.org/keywords/spectroscopy","display_name":"Spectroscopy","score":0.4543359875679016},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.261212021112442},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.18323850631713867},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.05899369716644287}],"concepts":[{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.8047579526901245},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.775047779083252},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7627450823783875},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.7153517603874207},{"id":"https://openalex.org/C40003534","wikidata":"https://www.wikidata.org/wiki/Q862228","display_name":"Raman spectroscopy","level":2,"score":0.6943344473838806},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.5822704434394836},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5274572372436523},{"id":"https://openalex.org/C32891209","wikidata":"https://www.wikidata.org/wiki/Q483666","display_name":"Spectroscopy","level":2,"score":0.4543359875679016},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.261212021112442},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.18323850631713867},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.05899369716644287},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2013.6559795","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559795","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1969006490","https://openalex.org/W1988941080","https://openalex.org/W2006972467","https://openalex.org/W2032905364","https://openalex.org/W2048467427","https://openalex.org/W2054375689","https://openalex.org/W2078040887","https://openalex.org/W2103184464","https://openalex.org/W2105093937","https://openalex.org/W2148193536","https://openalex.org/W2151739243","https://openalex.org/W2154261856"],"related_works":["https://openalex.org/W2587892165","https://openalex.org/W2139228874","https://openalex.org/W2148910569","https://openalex.org/W2068544226","https://openalex.org/W1997027926","https://openalex.org/W2335910515","https://openalex.org/W2245758338","https://openalex.org/W1984045274","https://openalex.org/W2953044288","https://openalex.org/W2076352848"],"abstract_inverted_index":{"This":[0],"paper":[1],"presents":[2],"the":[3,31,40,45,52,63,70,84,98],"recent":[4],"results":[5,95],"of":[6,8,30,33,39,48,73,87],"utilization":[7],"micro-Raman":[9],"spectroscopy":[10,79],"to":[11,27,69,82,92],"measure":[12,83],"and":[13,106,110],"characterize":[14],"residual":[15,35,41,85,114],"stress":[16,42,57,86],"in":[17],"polysilicon":[18],"doubly-clamped":[19],"MEMS":[20,49],"resonators":[21,88],"with":[22,89,101],"small":[23],"lateral":[24],"size.":[25],"Due":[26],"imprecise":[28],"prediction":[29],"magnitude":[32],"intrinsic":[34],"stress,":[36],"detrimental":[37],"effect":[38],"severely":[43],"shifts":[44],"resonant":[46],"frequency":[47],"resonator":[50,100],"from":[51],"analytical":[53],"pre-designed":[54],"value.":[55],"The":[56,94],"is":[58],"not":[59],"only":[60],"determined":[61],"by":[62],"fabrication":[64],"process":[65],"but":[66],"also":[67],"related":[68],"structural":[71],"dimensions":[72],"resonators.":[74],"In":[75],"this":[76],"work,":[77],"microRaman":[78],"was":[80],"used":[81],"widths":[90],"down":[91],"2\u03bcm.":[93],"show":[96],"that":[97],"optimized":[99],"length":[102],"shorter":[103],"than":[104],"50\u03bcm":[105],"width":[107],"between":[108],"3.2\u03bcm":[109],"4.1\u03bcm":[111],"exhibits":[112],"minimum":[113],"stress.":[115]},"counts_by_year":[{"year":2022,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}