{"id":"https://openalex.org/W2015636516","doi":"https://doi.org/10.1109/nems.2013.6559725","title":"A micromachined monolithic 3 axis accelerometer based on convection heat transfer","display_name":"A micromachined monolithic 3 axis accelerometer based on convection heat transfer","publication_year":2013,"publication_date":"2013-04-01","ids":{"openalex":"https://openalex.org/W2015636516","doi":"https://doi.org/10.1109/nems.2013.6559725","mag":"2015636516"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2013.6559725","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559725","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100826832","display_name":"Leyue Jiang","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Leyue Jiang","raw_affiliation_strings":["MEMSIC, Inc., Andover, MA, USA","MEMSIC Inc., Andover, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MEMSIC, Inc., Andover, MA, USA","institution_ids":[]},{"raw_affiliation_string":"MEMSIC Inc., Andover, MA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111659345","display_name":"Yongyao Cai","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yongyao Cai","raw_affiliation_strings":["MEMSIC, Inc., Andover, MA, USA","MEMSIC Inc., Andover, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MEMSIC, Inc., Andover, MA, USA","institution_ids":[]},{"raw_affiliation_string":"MEMSIC Inc., Andover, MA, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100648187","display_name":"Haidong Liu","orcid":"https://orcid.org/0000-0001-8519-3240"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Haidong Liu","raw_affiliation_strings":["MEMSIC, Inc., Andover, MA, USA","MEMSIC Inc., Andover, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MEMSIC, Inc., Andover, MA, USA","institution_ids":[]},{"raw_affiliation_string":"MEMSIC Inc., Andover, MA, USA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101568177","display_name":"Zhao Yang","orcid":"https://orcid.org/0000-0001-5690-7224"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Yang Zhao","raw_affiliation_strings":["MEMSIC, Inc., Andover, MA, USA","MEMSIC Inc., Andover, MA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"MEMSIC, Inc., Andover, MA, USA","institution_ids":[]},{"raw_affiliation_string":"MEMSIC Inc., Andover, MA, USA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":0,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.2159,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.75256397,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"248","last_page":"251"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11583","display_name":"Advanced Measurement and Metrology Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10205","display_name":"Advanced Fiber Optic Sensors","score":0.9972000122070312,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/accelerometer","display_name":"Accelerometer","score":0.9468218684196472},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.702862560749054},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.607555627822876},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5533157587051392},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.501305103302002},{"id":"https://openalex.org/keywords/heat-transfer","display_name":"Heat transfer","score":0.4366675615310669},{"id":"https://openalex.org/keywords/convection","display_name":"Convection","score":0.43052026629447937},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.41244927048683167},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3515458106994629},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3415600061416626},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.33213186264038086},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.32841920852661133},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2643292546272278},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.16306358575820923},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.15805819630622864},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.1351141333580017},{"id":"https://openalex.org/keywords/meteorology","display_name":"Meteorology","score":0.07206165790557861}],"concepts":[{"id":"https://openalex.org/C89805583","wikidata":"https://www.wikidata.org/wiki/Q192940","display_name":"Accelerometer","level":2,"score":0.9468218684196472},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.702862560749054},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.607555627822876},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5533157587051392},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.501305103302002},{"id":"https://openalex.org/C50517652","wikidata":"https://www.wikidata.org/wiki/Q179635","display_name":"Heat transfer","level":2,"score":0.4366675615310669},{"id":"https://openalex.org/C10899652","wikidata":"https://www.wikidata.org/wiki/Q160329","display_name":"Convection","level":2,"score":0.43052026629447937},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.41244927048683167},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3515458106994629},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3415600061416626},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.33213186264038086},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.32841920852661133},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2643292546272278},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.16306358575820923},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.15805819630622864},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.1351141333580017},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.07206165790557861},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2013.6559725","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2013.6559725","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6899999976158142,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W2156668337","https://openalex.org/W3184518629","https://openalex.org/W6798187452"],"related_works":["https://openalex.org/W2765080098","https://openalex.org/W2385749422","https://openalex.org/W2355290145","https://openalex.org/W2353465659","https://openalex.org/W2009888974","https://openalex.org/W2355539379","https://openalex.org/W2056341223","https://openalex.org/W3023105672","https://openalex.org/W4231410700","https://openalex.org/W4237770763"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"a":[3],"monolithic":[4],"3":[5,18],"axis":[6,19,33],"thermal":[7,20,34],"accelerometer":[8,21,35],"has":[9,47],"been":[10],"developed":[11],"based":[12],"on":[13],"standard":[14],"CMOS":[15],"process.":[16],"This":[17],"use":[22],"exactly":[23],"the":[24,38],"same":[25],"sensor":[26],"area":[27],"and":[28,46],"manufacturing":[29],"process":[30],"as":[31],"2":[32],"reported":[36],"in":[37],"past.":[39],"It":[40],"is":[41],"easy":[42],"to":[43],"mass":[44],"produce":[45],"low":[48],"cost,":[49],"small":[50],"size.":[51]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":2},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":4},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":2}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}