{"id":"https://openalex.org/W2066791619","doi":"https://doi.org/10.1109/nems.2012.6196868","title":"Fabrication and Performance Optimization of the Microplasma Reactor with Composite Dielectrics","display_name":"Fabrication and Performance Optimization of the Microplasma Reactor with Composite Dielectrics","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W2066791619","doi":"https://doi.org/10.1109/nems.2012.6196868","mag":"2066791619"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2012.6196868","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196868","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101607959","display_name":"Zhen Yuan","orcid":"https://orcid.org/0000-0001-6698-7205"},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zhen Yuan","raw_affiliation_strings":["University of Science and Technology of China, Hefei, Anhui, CN","University of Science and Technology of China, China"],"affiliations":[{"raw_affiliation_string":"University of Science and Technology of China, Hefei, Anhui, CN","institution_ids":["https://openalex.org/I126520041"]},{"raw_affiliation_string":"University of Science and Technology of China, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112119944","display_name":"Li Wen","orcid":null},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Wen","raw_affiliation_strings":["Department of PreClsion Machinery and Precision Instrumentation, University of Science and Technology, Hefei, Anhui, China","Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, Anhui, China#TAB#"],"affiliations":[{"raw_affiliation_string":"Department of PreClsion Machinery and Precision Instrumentation, University of Science and Technology, Hefei, Anhui, China","institution_ids":["https://openalex.org/I126520041"]},{"raw_affiliation_string":"Department of Precision Machinery and Precision Instrumentation, University of Science and Technology of China, Hefei, Anhui, China#TAB#","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039589108","display_name":"Leili Cheng","orcid":null},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Leili Cheng","raw_affiliation_strings":["University of Science and Technology of China, Hefei, Anhui, CN","University of Science and Technology of China, China"],"affiliations":[{"raw_affiliation_string":"University of Science and Technology of China, Hefei, Anhui, CN","institution_ids":["https://openalex.org/I126520041"]},{"raw_affiliation_string":"University of Science and Technology of China, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101523857","display_name":"Jianqiang Ma","orcid":"https://orcid.org/0000-0003-0615-9445"},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianqiang Ma","raw_affiliation_strings":["University of Science and Technology of China, Hefei, Anhui, CN","University of Science and Technology of China, China"],"affiliations":[{"raw_affiliation_string":"University of Science and Technology of China, Hefei, Anhui, CN","institution_ids":["https://openalex.org/I126520041"]},{"raw_affiliation_string":"University of Science and Technology of China, China","institution_ids":["https://openalex.org/I126520041"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5050936283","display_name":"Jiaru Chu","orcid":"https://orcid.org/0000-0001-6472-8103"},"institutions":[{"id":"https://openalex.org/I126520041","display_name":"University of Science and Technology of China","ror":"https://ror.org/04c4dkn09","country_code":"CN","type":"education","lineage":["https://openalex.org/I126520041","https://openalex.org/I19820366"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jiaru Chu","raw_affiliation_strings":["University of Science and Technology of China, Hefei, Anhui, CN","University of Science and Technology of China, China"],"affiliations":[{"raw_affiliation_string":"University of Science and Technology of China, Hefei, Anhui, CN","institution_ids":["https://openalex.org/I126520041"]},{"raw_affiliation_string":"University of Science and Technology of China, China","institution_ids":["https://openalex.org/I126520041"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5101607959"],"corresponding_institution_ids":["https://openalex.org/I126520041"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.12392116,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"a 169","issue":null,"first_page":"685","last_page":"688"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10781","display_name":"Plasma Diagnostics and Applications","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10642","display_name":"Plasma Applications and Diagnostics","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2741","display_name":"Radiology, Nuclear Medicine and Imaging"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microplasma","display_name":"Microplasma","score":0.8859947919845581},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.7310469150543213},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6182829141616821},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.5502481460571289},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.4843057692050934},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.39321982860565186},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.36634373664855957},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.34190303087234497},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.25227034091949463},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.22671538591384888},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2099769115447998},{"id":"https://openalex.org/keywords/plasma","display_name":"Plasma","score":0.20326390862464905},{"id":"https://openalex.org/keywords/organic-chemistry","display_name":"Organic chemistry","score":0.1647915244102478},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.15705958008766174}],"concepts":[{"id":"https://openalex.org/C70420769","wikidata":"https://www.wikidata.org/wiki/Q6839915","display_name":"Microplasma","level":3,"score":0.8859947919845581},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.7310469150543213},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6182829141616821},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.5502481460571289},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.4843057692050934},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.39321982860565186},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.36634373664855957},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.34190303087234497},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.25227034091949463},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.22671538591384888},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2099769115447998},{"id":"https://openalex.org/C82706917","wikidata":"https://www.wikidata.org/wiki/Q10251","display_name":"Plasma","level":2,"score":0.20326390862464905},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.1647915244102478},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.15705958008766174},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2012.6196868","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196868","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7","score":0.699999988079071}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1980399125","https://openalex.org/W1991614017","https://openalex.org/W2026645716","https://openalex.org/W2054201749","https://openalex.org/W2068851426","https://openalex.org/W2073409183","https://openalex.org/W2100294942","https://openalex.org/W2101558714","https://openalex.org/W2139832656","https://openalex.org/W2142490452","https://openalex.org/W2143515206","https://openalex.org/W2390230696","https://openalex.org/W6663817344"],"related_works":["https://openalex.org/W2740814706","https://openalex.org/W2079261782","https://openalex.org/W3089985223","https://openalex.org/W2022167378","https://openalex.org/W3121400674","https://openalex.org/W2033964940","https://openalex.org/W2265355992","https://openalex.org/W2373253324","https://openalex.org/W4213170164","https://openalex.org/W2121214086"],"abstract_inverted_index":{"A":[0],"microplasma":[1,77,121],"reactor":[2,78],"with":[3,114],"composite":[4,15],"dielectric":[5,16,41,44,86,118],"layers":[6,17],"for":[7,49],"maskless":[8,130],"micro/nano":[9],"plasma":[10,132],"etching":[11],"is":[12,90],"presented.":[13],"The":[14,93],"include":[18],"the":[19,46,51,76,98,105,128],"Si":[20,52],"<sub":[21,25,30,53,57,62],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[22,26,31,54,58,63],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">3</sub>":[23,55],"N":[24,56],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">4</sub>":[27,59],",":[28],"SiO":[29,61],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sub>":[32,64],"and":[33,60,84,101],"polyimide":[34],"film.":[35],"In":[36],"order":[37],"to":[38,109,125],"obtain":[39],"optimum":[40],"properties":[42],"of":[43,72,104,111],"films,":[45],"process":[47],"parameters":[48],"depositing":[50],"film":[65],"were":[66],"obtained":[67],"through":[68],"a":[69,115],"large":[70],"number":[71],"experimental":[73],"data.":[74],"Then":[75],"having":[79],"inverted":[80],"pyramidal":[81],"hollow":[82],"cathode":[83],"metal-composite":[85],"layers-metal":[87],"sandwich":[88],"structure,":[89],"successfully":[91],"fabricated.":[92],"experiment":[94],"results":[95],"show":[96],"that":[97],"lifetimes,":[99],"stability":[100],"microdischarge":[102],"characteristics":[103],"devices":[106,122],"are":[107,123],"superior":[108],"those":[110],"earlier":[112],"fabricated":[113],"single":[116],"polymer":[117],"layer.":[119],"These":[120],"expected":[124],"operate":[126],"in":[127],"further":[129],"scanning":[131],"etching.":[133]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}