{"id":"https://openalex.org/W1969103737","doi":"https://doi.org/10.1109/nems.2012.6196838","title":"Comparison of glass etching properties between HCl and HNO&lt;inf&gt;3&lt;/inf&gt; solution","display_name":"Comparison of glass etching properties between HCl and HNO&lt;inf&gt;3&lt;/inf&gt; solution","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W1969103737","doi":"https://doi.org/10.1109/nems.2012.6196838","mag":"1969103737"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2012.6196838","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196838","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101527521","display_name":"Tao Wei","orcid":"https://orcid.org/0000-0002-8341-4799"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Wei Tao","raw_affiliation_strings":["Department of Mechanical & Electrical Engineering Xiamen University, CHINA","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical & Electrical Engineering Xiamen University, CHINA","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112892769","display_name":"Wenlong Lv","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenlong lv","raw_affiliation_strings":["Xiamen University, Xiamen, Fujian, CN","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Xiamen University, Xiamen, Fujian, CN","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5028241570","display_name":"Zhan Zhan","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhan Zhan","raw_affiliation_strings":["Department of Mechanical & Electrical Engineering Xiamen University, CHINA","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical & Electrical Engineering Xiamen University, CHINA","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024320648","display_name":"Wenjia Zuo","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wenjia Zuo","raw_affiliation_strings":["Department of Mechanical & Electrical Engineering Xiamen University, CHINA","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical & Electrical Engineering Xiamen University, CHINA","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032323917","display_name":"Xiaochun Qiu","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaochun Qiu","raw_affiliation_strings":["Xiamen University, Xiamen, Fujian, CN","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Xiamen University, Xiamen, Fujian, CN","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5088256820","display_name":"Linyun Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Linyun Wang","raw_affiliation_strings":["Department of Mechanical & Electrical Engineering Xiamen University, CHINA","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical & Electrical Engineering Xiamen University, CHINA","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113664117","display_name":"Daoheng Sun","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Daoheng Sun","raw_affiliation_strings":["Xiamen University, Xiamen, Fujian, CN","Department of Mechanical and Electrical Engineering, Xiamen Univ., China"],"affiliations":[{"raw_affiliation_string":"Xiamen University, Xiamen, Fujian, CN","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen Univ., China","institution_ids":["https://openalex.org/I191208505"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5101527521"],"corresponding_institution_ids":["https://openalex.org/I191208505"],"apc_list":null,"apc_paid":null,"fwci":0.2017,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.53344353,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"60","issue":null,"first_page":"562","last_page":"566"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9980999827384949,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11451","display_name":"Advanced Machining and Optimization Techniques","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.817132830619812},{"id":"https://openalex.org/keywords/sputtering","display_name":"Sputtering","score":0.5192661285400391},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4894239008426666},{"id":"https://openalex.org/keywords/analytical-chemistry","display_name":"Analytical Chemistry (journal)","score":0.41233766078948975},{"id":"https://openalex.org/keywords/nuclear-chemistry","display_name":"Nuclear chemistry","score":0.3827309012413025},{"id":"https://openalex.org/keywords/chemical-engineering","display_name":"Chemical engineering","score":0.3621435761451721},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3489915132522583},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.316045343875885},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.18323567509651184},{"id":"https://openalex.org/keywords/organic-chemistry","display_name":"Organic chemistry","score":0.1665804386138916},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.10648941993713379}],"concepts":[{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.817132830619812},{"id":"https://openalex.org/C22423302","wikidata":"https://www.wikidata.org/wiki/Q898444","display_name":"Sputtering","level":3,"score":0.5192661285400391},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4894239008426666},{"id":"https://openalex.org/C113196181","wikidata":"https://www.wikidata.org/wiki/Q485223","display_name":"Analytical Chemistry (journal)","level":2,"score":0.41233766078948975},{"id":"https://openalex.org/C13965031","wikidata":"https://www.wikidata.org/wiki/Q243545","display_name":"Nuclear chemistry","level":1,"score":0.3827309012413025},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.3621435761451721},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3489915132522583},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.316045343875885},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.18323567509651184},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.1665804386138916},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10648941993713379},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2012.6196838","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196838","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1965806310","https://openalex.org/W1968581245","https://openalex.org/W2041032277","https://openalex.org/W2044619291","https://openalex.org/W2060975702","https://openalex.org/W2061094181","https://openalex.org/W2061273695","https://openalex.org/W2066460110","https://openalex.org/W2088885597","https://openalex.org/W2093168656","https://openalex.org/W2150143516"],"related_works":["https://openalex.org/W2035249489","https://openalex.org/W1967383351","https://openalex.org/W850150341","https://openalex.org/W2295922851","https://openalex.org/W142388841","https://openalex.org/W2066362799","https://openalex.org/W1969082957","https://openalex.org/W1992258975","https://openalex.org/W2331021532","https://openalex.org/W2034041074"],"abstract_inverted_index":{"A":[0],"comparison":[1],"of":[2,31,53,69,128],"glass":[3,135],"etching":[4,32,55,85],"properties":[5],"between":[6],"HCl":[7,105],"and":[8,36,63],"HNO":[9,112],"<inf":[10,74,113],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[11,75,114],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">3</inf>":[12,115],"solution":[13,56],"is":[14,72,131],"presented":[15],"in":[16],"this":[17],"paper,":[18],"which":[19,130],"allows":[20],"us":[21],"to":[22,57,119,133],"predict":[23],"the":[24,46,49,54,59,80,83,89,95,100,122,134],"etched":[25],"product's":[26],"shape":[27],"under":[28],"a":[29,65,107],"variety":[30],"conditions,":[33],"mask":[34,60,123],"compensation":[35],"multiple":[37],"processing":[38],"steps.":[39],"Four":[40],"conclusions":[41],"could":[42],"be":[43],"draw":[44],"from":[45,61],"experiments.":[47],"First,":[48],"best":[50],"concentration":[51],"ratio":[52,98],"protect":[58],"damage":[62],"get":[64],"channel":[66],"with":[67],"depth":[68],"40":[70],"\u00b5m":[71],"HF:HCl:NH":[73],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">4</inf>":[76],"F=5.5mol/L:4mol/L:2.5mol/L.":[77],"Second,":[78],"as":[79,116],"temperature":[81,90,101],"increases,":[82],"longitudinal":[84],"rate":[86],"increases.":[87],"However,":[88],"has":[91,106],"little":[92],"influence":[93],"on":[94],"lateral":[96],"erosion":[97],"when":[99],"gets":[102],"high.":[103],"Third,":[104],"better":[108],"surface":[109],"morphology":[110],"against":[111],"an":[117],"addition":[118],"solution.":[120],"Last,":[121],"will":[124],"introduce":[125],"strain":[126],"because":[127],"sputtering,":[129],"harmful":[132],"etching\u2025":[136]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}