{"id":"https://openalex.org/W2036610144","doi":"https://doi.org/10.1109/nems.2012.6196781","title":"Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination","display_name":"Processing of 3D multilevel SU-8 fluidic network assisted by PerMX dry-photoresist lamination","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W2036610144","doi":"https://doi.org/10.1109/nems.2012.6196781","mag":"2036610144"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2012.6196781","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196781","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033154420","display_name":"R. Meier","orcid":null},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":true,"raw_author_name":"R. Ch. Meier","raw_affiliation_strings":["Department of Microsystems Engineering, Laboratory for Simulation, University of Freiburg, Germany","Department of Microsystems Engineering, Laboratory for Simulation, University of Freiburg, GERMANY"],"affiliations":[{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Simulation, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Simulation, University of Freiburg, GERMANY","institution_ids":["https://openalex.org/I161046081"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5072076684","display_name":"Vlad Badilita","orcid":"https://orcid.org/0000-0002-7956-345X"},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"V. Badilita","raw_affiliation_strings":["Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, Germany","Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, GERMANY"],"affiliations":[{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, GERMANY","institution_ids":["https://openalex.org/I161046081"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042137175","display_name":"Ulrike Wallrabe","orcid":"https://orcid.org/0000-0003-0532-1519"},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"U. Wallrabe","raw_affiliation_strings":["Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, Germany","Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, GERMANY"],"affiliations":[{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, Germany","institution_ids":["https://openalex.org/I161046081"]},{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Microactuators, University of Freiburg, GERMANY","institution_ids":["https://openalex.org/I161046081"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5047998886","display_name":"Jan G. Korvink","orcid":"https://orcid.org/0000-0003-4354-7295"},"institutions":[{"id":"https://openalex.org/I161046081","display_name":"University of Freiburg","ror":"https://ror.org/0245cg223","country_code":"DE","type":"education","lineage":["https://openalex.org/I161046081"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"J. G. Korvink","raw_affiliation_strings":["Albert-Ludwigs-Universitat Freiburg, Freiburg im Breisgau, Baden-W\u00c3\u00bcrttemberg, DE","Department of Microsystems Engineering, Laboratory for Simulation, University of Freiburg, GERMANY"],"affiliations":[{"raw_affiliation_string":"Albert-Ludwigs-Universitat Freiburg, Freiburg im Breisgau, Baden-W\u00c3\u00bcrttemberg, DE","institution_ids":[]},{"raw_affiliation_string":"Department of Microsystems Engineering, Laboratory for Simulation, University of Freiburg, GERMANY","institution_ids":["https://openalex.org/I161046081"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5033154420"],"corresponding_institution_ids":["https://openalex.org/I161046081"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.10371344,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"288","issue":null,"first_page":"308","last_page":"311"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fluidics","display_name":"Fluidics","score":0.8493807315826416},{"id":"https://openalex.org/keywords/photoresist","display_name":"Photoresist","score":0.7236471176147461},{"id":"https://openalex.org/keywords/lamination","display_name":"Lamination","score":0.6742897033691406},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.6343895792961121},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6191767454147339},{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.608466625213623},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.5911065340042114},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.5898141860961914},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.5016560554504395},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.48284679651260376},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.42230966687202454},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4073905050754547},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2356148660182953},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20542040467262268},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.14237532019615173}],"concepts":[{"id":"https://openalex.org/C132651336","wikidata":"https://www.wikidata.org/wiki/Q185571","display_name":"Fluidics","level":2,"score":0.8493807315826416},{"id":"https://openalex.org/C134406635","wikidata":"https://www.wikidata.org/wiki/Q1439684","display_name":"Photoresist","level":3,"score":0.7236471176147461},{"id":"https://openalex.org/C2777557983","wikidata":"https://www.wikidata.org/wiki/Q384943","display_name":"Lamination","level":3,"score":0.6742897033691406},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.6343895792961121},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6191767454147339},{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.608466625213623},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.5911065340042114},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.5898141860961914},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.5016560554504395},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.48284679651260376},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.42230966687202454},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4073905050754547},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2356148660182953},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20542040467262268},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.14237532019615173},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2012.6196781","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196781","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W2009138214","https://openalex.org/W2022348257","https://openalex.org/W2023639503","https://openalex.org/W2024940523","https://openalex.org/W2034263032","https://openalex.org/W2035757080","https://openalex.org/W2071311642","https://openalex.org/W2080758618","https://openalex.org/W2108968242","https://openalex.org/W2116774595","https://openalex.org/W2118054369","https://openalex.org/W2131407182","https://openalex.org/W2149166254","https://openalex.org/W2150399671","https://openalex.org/W2150899284","https://openalex.org/W2156872789","https://openalex.org/W4231837332"],"related_works":["https://openalex.org/W2376266960","https://openalex.org/W4226294346","https://openalex.org/W2178933900","https://openalex.org/W2044269754","https://openalex.org/W2051685665","https://openalex.org/W2262246617","https://openalex.org/W2536782738","https://openalex.org/W2042235194","https://openalex.org/W2388542182","https://openalex.org/W2019991363"],"abstract_inverted_index":{"In":[0],"this":[1],"work":[2],"we":[3,56],"present":[4],"a":[5,31,58],"new":[6],"manufacturing":[7,82],"method":[8],"for":[9,78],"MEMS":[10],"based":[11],"multi-level":[12],"microfluidic":[13,34],"devices.":[14],"The":[15,69],"combination":[16],"of":[17,23,30,72,101,111],"spin-coating":[18],"SU-8":[19,102],"(MicroChem)":[20],"and":[21,75,103],"lamination":[22],"PerMX":[24,104],"dry-photoresist":[25],"(DuPont)":[26],"enables":[27],"the":[28,79,90,97,112],"fabrication":[29],"complex":[32,59],"3-level":[33],"channel":[35,38],"network":[36,62],"with":[37],"aspect":[39],"ratios":[40],"ranging":[41],"from":[42],"0.3":[43],"up":[44],"to":[45],"3.":[46],"On":[47],"13":[48],"mm":[49],"<sup":[50],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[51],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sup>":[52],"fluidic":[53,61,67,80,91,113],"chip":[54,81],"area":[55],"realized":[57],"3D":[60],"by":[63],"interconnecting":[64],"three":[65],"individual":[66],"levels.":[68,92],"unique":[70],"use":[71],"UV-photolithography":[73],"tools":[74],"high-precision":[76],"UV-lasering":[77],"results":[83,106],"in":[84,107],"25":[85],"\u03bcm":[86],"alignment":[87],"accuracy":[88],"between":[89],"We":[93],"further":[94],"report":[95],"on":[96],"high":[98,108],"material":[99],"compatibility":[100],"which":[105],"substrate":[109],"adhesion":[110],"devices":[114],"(26.5":[115],"MPa).":[116]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}