{"id":"https://openalex.org/W2170819155","doi":"https://doi.org/10.1109/nems.2012.6196765","title":"Design and fabrication of flexible parylene-based inductors with electroplated NiFe magnetic core for wireless power transmission system","display_name":"Design and fabrication of flexible parylene-based inductors with electroplated NiFe magnetic core for wireless power transmission system","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W2170819155","doi":"https://doi.org/10.1109/nems.2012.6196765","mag":"2170819155"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2012.6196765","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196765","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5086613360","display_name":"Xuming Sun","orcid":"https://orcid.org/0000-0002-6095-7889"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xuming Sun","raw_affiliation_strings":["National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":null,"display_name":"Yang Zheng","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Zheng","raw_affiliation_strings":["National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101526076","display_name":"Zhongliang Li","orcid":"https://orcid.org/0000-0001-7021-2103"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhongliang Li","raw_affiliation_strings":["National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5043847050","display_name":"Miao Yu","orcid":"https://orcid.org/0000-0002-2943-2179"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Miao Yu","raw_affiliation_strings":["National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5045418817","display_name":"Quan Yuan","orcid":"https://orcid.org/0000-0002-1083-6800"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Quan Yuan","raw_affiliation_strings":["National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5007289297","display_name":"Xiuhan Li","orcid":"https://orcid.org/0000-0002-5254-9877"},"institutions":[{"id":"https://openalex.org/I21193070","display_name":"Beijing Jiaotong University","ror":"https://ror.org/01yj56c84","country_code":"CN","type":"education","lineage":["https://openalex.org/I21193070"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiuhan Li","raw_affiliation_strings":["School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, China","institution_ids":["https://openalex.org/I21193070"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100375644","display_name":"Haixia Zhang","orcid":"https://orcid.org/0000-0003-4565-4123"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haixia Zhang","raw_affiliation_strings":["National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Teclmology on MicroiNano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5086613360"],"corresponding_institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"],"apc_list":null,"apc_paid":null,"fwci":0.4993,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.71420832,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"238","last_page":"242"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.9027912616729736},{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.7448039054870605},{"id":"https://openalex.org/keywords/parylene","display_name":"Parylene","score":0.6882875561714172},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6421018242835999},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6072906851768494},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.5013999938964844},{"id":"https://openalex.org/keywords/magnetic-core","display_name":"Magnetic core","score":0.48177120089530945},{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.4707121253013611},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.4348883032798767},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.413303017616272},{"id":"https://openalex.org/keywords/electromagnetic-coil","display_name":"Electromagnetic coil","score":0.24903610348701477},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.22748562693595886},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18641608953475952},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.09112533926963806},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08613845705986023}],"concepts":[{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.9027912616729736},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.7448039054870605},{"id":"https://openalex.org/C2777385008","wikidata":"https://www.wikidata.org/wiki/Q448540","display_name":"Parylene","level":3,"score":0.6882875561714172},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6421018242835999},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6072906851768494},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.5013999938964844},{"id":"https://openalex.org/C23832930","wikidata":"https://www.wikidata.org/wiki/Q1088161","display_name":"Magnetic core","level":3,"score":0.48177120089530945},{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.4707121253013611},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.4348883032798767},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.413303017616272},{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.24903610348701477},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.22748562693595886},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18641608953475952},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.09112533926963806},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08613845705986023},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2012.6196765","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196765","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.7599999904632568,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1965102195","https://openalex.org/W1982222258","https://openalex.org/W1982911639","https://openalex.org/W1999220391","https://openalex.org/W2133531054","https://openalex.org/W2143357140","https://openalex.org/W2146462938","https://openalex.org/W2151425151","https://openalex.org/W2171947300","https://openalex.org/W6645727562"],"related_works":["https://openalex.org/W2769490182","https://openalex.org/W2196183592","https://openalex.org/W2166381952","https://openalex.org/W3168403633","https://openalex.org/W2114486131","https://openalex.org/W2120661608","https://openalex.org/W1487788472","https://openalex.org/W2117520483","https://openalex.org/W4226174229","https://openalex.org/W2144738648"],"abstract_inverted_index":{"Integrated":[0],"flexible":[1,49],"parylene-based":[2],"MEMS":[3],"inductors":[4,46,73,110,130],"were":[5],"successfully":[6],"designed,":[7],"fabricated":[8],"and":[9,36,50],"analyzed.":[10],"By":[11],"elctrodeposition":[12],"technique,":[13],"Ni":[14],"<sub":[15,19],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[16,20],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">80</sub>":[17],"Fe":[18],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">20</sub>":[21],"Permalloy":[22],"with":[23,74,83],"high":[24],"permeability":[25],"was":[26,65,77,101,117],"acquired":[27],"as":[28,43],"the":[29,34,87,90,99,112,124],"magnetic":[30,75],"core":[31,76,91],"to":[32,96],"increase":[33],"inductance":[35,71,100],"quality":[37,61,115],"factor":[38,62,116],"of":[39,63,72,89],"inductors.":[40],"Using":[41],"parylene":[42],"substrates,":[44],"these":[45,129],"became":[47],"more":[48],"biocompatible.":[51],"For":[52,107],"small":[53],"scale":[54,109],"inductors,":[55],"by":[56,79,104],"HFSS":[57],"simulation,":[58],"a":[59],"maximum":[60,114],"51.52":[64],"achieved":[66],"at":[67,119],"3.10":[68],"GHz.":[69],"The":[70],"enhanced":[78],"3.3%":[80],"than":[81],"those":[82],"air":[84],"core.":[85],"As":[86],"width":[88],"increased":[92,103],"from":[93],"25":[94],"\u03bcm":[95],"100":[97],"\u03bcm,":[98],"also":[102],"11.3%":[105],"maximally.":[106],"large":[108],"fabricated,":[111],"tested":[113],"110":[118],"6":[120],"MHz.":[121],"Based":[122],"on":[123],"IC":[125],"compatible":[126],"fabrication":[127],"process,":[128],"could":[131],"be":[132],"used":[133],"in":[134],"wireless":[135],"power":[136],"transmission":[137],"system":[138],"for":[139],"implantable":[140],"medical":[141],"devices.":[142]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1}],"updated_date":"2026-04-16T08:26:57.006410","created_date":"2025-10-10T00:00:00"}
