{"id":"https://openalex.org/W2034787964","doi":"https://doi.org/10.1109/nems.2012.6196704","title":"Recent advances on nano-materials for advanced packaging applications","display_name":"Recent advances on nano-materials for advanced packaging applications","publication_year":2012,"publication_date":"2012-03-01","ids":{"openalex":"https://openalex.org/W2034787964","doi":"https://doi.org/10.1109/nems.2012.6196704","mag":"2034787964"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2012.6196704","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196704","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042734294","display_name":"C.P. Wong","orcid":"https://orcid.org/0000-0003-3556-8053"},"institutions":[{"id":"https://openalex.org/I177725633","display_name":"Chinese University of Hong Kong","ror":"https://ror.org/00t33hh48","country_code":"CN","type":"education","lineage":["https://openalex.org/I177725633"]},{"id":"https://openalex.org/I130701444","display_name":"Georgia Institute of Technology","ror":"https://ror.org/01zkghx44","country_code":"US","type":"education","lineage":["https://openalex.org/I130701444"]}],"countries":["CN","US"],"is_corresponding":true,"raw_author_name":"C.P. Wong","raw_affiliation_strings":["Dean of the Faculty of Engineering, Chinese University of Hong Kong, Sha Tin, New Territories, Hong Kong, China","School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA"],"affiliations":[{"raw_affiliation_string":"Dean of the Faculty of Engineering, Chinese University of Hong Kong, Sha Tin, New Territories, Hong Kong, China","institution_ids":["https://openalex.org/I177725633"]},{"raw_affiliation_string":"School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA","institution_ids":["https://openalex.org/I130701444"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":1,"corresponding_author_ids":["https://openalex.org/A5042734294"],"corresponding_institution_ids":["https://openalex.org/I177725633","https://openalex.org/I130701444"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.08713174,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"1"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10313","display_name":"Surface Modification and Superhydrophobicity","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10313","display_name":"Surface Modification and Superhydrophobicity","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2508","display_name":"Surfaces, Coatings and Films"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.996999979019165,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10083","display_name":"Graphene research and applications","score":0.996399998664856,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8497013449668884},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.5253150463104248},{"id":"https://openalex.org/keywords/carbon-nanotube","display_name":"Carbon nanotube","score":0.5219206809997559},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.5083760619163513},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.49118825793266296},{"id":"https://openalex.org/keywords/electrical-conductor","display_name":"Electrical conductor","score":0.4514427185058594},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4137602746486664},{"id":"https://openalex.org/keywords/nano","display_name":"Nano-","score":0.41220754384994507},{"id":"https://openalex.org/keywords/polymer","display_name":"Polymer","score":0.4114159047603607},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.35391414165496826},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.308793842792511},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.15090298652648926}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8497013449668884},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.5253150463104248},{"id":"https://openalex.org/C513720949","wikidata":"https://www.wikidata.org/wiki/Q1778729","display_name":"Carbon nanotube","level":2,"score":0.5219206809997559},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.5083760619163513},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.49118825793266296},{"id":"https://openalex.org/C202374169","wikidata":"https://www.wikidata.org/wiki/Q124291","display_name":"Electrical conductor","level":2,"score":0.4514427185058594},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4137602746486664},{"id":"https://openalex.org/C2780357685","wikidata":"https://www.wikidata.org/wiki/Q154357","display_name":"Nano-","level":2,"score":0.41220754384994507},{"id":"https://openalex.org/C521977710","wikidata":"https://www.wikidata.org/wiki/Q81163","display_name":"Polymer","level":2,"score":0.4114159047603607},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.35391414165496826},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.308793842792511},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.15090298652648926}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2012.6196704","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2012.6196704","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 7th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4699999988079071,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W186122867","https://openalex.org/W1107124562","https://openalex.org/W1483801120","https://openalex.org/W2493976267"],"related_works":["https://openalex.org/W2371309082","https://openalex.org/W2384401620","https://openalex.org/W2043947924","https://openalex.org/W2389568614","https://openalex.org/W2383439850","https://openalex.org/W4205876811","https://openalex.org/W4361799126","https://openalex.org/W2628640760","https://openalex.org/W2509006425","https://openalex.org/W2468321730"],"abstract_inverted_index":{"The":[0],"advance":[1],"of":[2,11,20,90,108],"semiconductor":[3],"technology":[4],"is":[5],"mainly":[6],"due":[7],"to":[8],"the":[9,18,91],"advances":[10,93],"materials,":[12],"especially":[13],"polymeric":[14,95],"materials.":[15],"These":[16],"include":[17],"use":[19],"polymers":[21],"as:":[22,111],"resists":[23],"(for":[24],"deep":[25],"submicron":[26],"lithography),":[27],"adhesives":[28,115],"(both":[29],"conductive":[30,33,114],"and":[31,37,50,57,97,126,133,155,160,166],"non":[32],"for":[34,47,61,72,105,123,140,147,157,172],"die":[35],"attach":[36],"assembly":[38,119],"interconnects),":[39],"interlayer":[40],"dielectrics":[41,46],"(low":[42],"k,":[43],"low":[44,51,141],"loss":[45,52],"high":[48,69,73,127,148,158,161,173],"speed":[49],"signal":[53],"transmission),":[54],"encapsulants":[55],"(discrete":[56],"wafer":[58,134],"level":[59,135],"packages":[60],"device":[62],"protection),":[63],"embedded":[64,150],"passives":[65],"(high":[66],"K":[67],"capacitors,":[68],"Q":[70],"inductors":[71],"density":[74,129],"PWB":[75],"substrates),":[76],"superhydrophobic":[77,167],"self-cleaning":[78],"lotus":[79,169],"effect":[80],"surfaces,":[81],"etc.":[82],"In":[83],"this":[84],"presentation,":[85],"I":[86],"will":[87],"review":[88],"some":[89],"recent":[92],"on":[94],"materials":[96,164],"polymer":[98],"nanocomposites":[99],"that":[100],"are":[101],"currently":[102],"being":[103],"investigated":[104],"these":[106],"types":[107],"applications,":[109],"such":[110],"lead-free":[112,138],"electrically":[113],"(ECAs)":[116],"with":[117],"self":[118],"monolayer":[120],"molecular":[121],"wires":[122],"fine":[124],"pitch":[125],"current":[128,159],"interconnects,":[130,143],"flip":[131],"chip":[132],"underfills,":[136],"nano":[137],"alloys":[139],"temperature":[142],"nanometal":[144],"particle":[145],"composites":[146],"k":[149],"passives,":[151],"well-aligned":[152],"carbon":[153],"nanotubes":[154],"graphenes":[156],"thermal":[162],"interface":[163],"(TIMs),":[165],"self-clean":[168],"surface":[170],"coatings":[171],"efficiency":[174],"solar":[175],"cell":[176],"applications.":[177]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}