{"id":"https://openalex.org/W2160177455","doi":"https://doi.org/10.1109/nems.2011.6017482","title":"Towards high resolution pico-projector applications: Design improvements on MEMS scanning mirror","display_name":"Towards high resolution pico-projector applications: Design improvements on MEMS scanning mirror","publication_year":2011,"publication_date":"2011-02-01","ids":{"openalex":"https://openalex.org/W2160177455","doi":"https://doi.org/10.1109/nems.2011.6017482","mag":"2160177455"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2011.6017482","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2011.6017482","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5023355465","display_name":"Wei Ma","orcid":"https://orcid.org/0000-0003-1044-5612"},"institutions":[{"id":"https://openalex.org/I146617529","display_name":"Applied Science and Technology Research Institute","ror":"https://ror.org/03xmkea05","country_code":"CN","type":"facility","lineage":["https://openalex.org/I146617529"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Wei Ma","raw_affiliation_strings":["Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong","institution_ids":["https://openalex.org/I146617529"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008057285","display_name":"Ho\u2010Yin Chan","orcid":"https://orcid.org/0000-0002-5244-4143"},"institutions":[{"id":"https://openalex.org/I146617529","display_name":"Applied Science and Technology Research Institute","ror":"https://ror.org/03xmkea05","country_code":"CN","type":"facility","lineage":["https://openalex.org/I146617529"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Ho- Yin Chan","raw_affiliation_strings":["Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong","institution_ids":["https://openalex.org/I146617529"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5067836214","display_name":"Chun Cheong Wong","orcid":null},"institutions":[{"id":"https://openalex.org/I146617529","display_name":"Applied Science and Technology Research Institute","ror":"https://ror.org/03xmkea05","country_code":"CN","type":"facility","lineage":["https://openalex.org/I146617529"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chun Cheong Wong","raw_affiliation_strings":["Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong","institution_ids":["https://openalex.org/I146617529"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084027155","display_name":"Checky Yiu","orcid":null},"institutions":[{"id":"https://openalex.org/I146617529","display_name":"Applied Science and Technology Research Institute","ror":"https://ror.org/03xmkea05","country_code":"CN","type":"facility","lineage":["https://openalex.org/I146617529"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Checky Yiu","raw_affiliation_strings":["Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong","institution_ids":["https://openalex.org/I146617529"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5083292984","display_name":"Yick Chuen Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I146617529","display_name":"Applied Science and Technology Research Institute","ror":"https://ror.org/03xmkea05","country_code":"CN","type":"facility","lineage":["https://openalex.org/I146617529"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yick Chuen Chan","raw_affiliation_strings":["Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong","institution_ids":["https://openalex.org/I146617529"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5070294663","display_name":"Francis Chee Shuen Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I146617529","display_name":"Applied Science and Technology Research Institute","ror":"https://ror.org/03xmkea05","country_code":"CN","type":"facility","lineage":["https://openalex.org/I146617529"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Francis Chee Shuen Lee","raw_affiliation_strings":["Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Material and Packaging Technologies Group, Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong","institution_ids":["https://openalex.org/I146617529"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I146617529"],"apc_list":null,"apc_paid":null,"fwci":0.8109,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.77779457,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"831","last_page":"834"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9939000010490417,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/projector","display_name":"Projector","score":0.8405535221099854},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7273111343383789},{"id":"https://openalex.org/keywords/bar","display_name":"Bar (unit)","score":0.6578712463378906},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.506180465221405},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.4885135889053345},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.4828565716743469},{"id":"https://openalex.org/keywords/resolution","display_name":"Resolution (logic)","score":0.45514988899230957},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4446493089199066},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.3399369716644287},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33750009536743164},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.23106089234352112},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22510886192321777},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.19112840294837952},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.14979508519172668}],"concepts":[{"id":"https://openalex.org/C2776865275","wikidata":"https://www.wikidata.org/wiki/Q311666","display_name":"Projector","level":2,"score":0.8405535221099854},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7273111343383789},{"id":"https://openalex.org/C188721877","wikidata":"https://www.wikidata.org/wiki/Q103510","display_name":"Bar (unit)","level":2,"score":0.6578712463378906},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.506180465221405},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.4885135889053345},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.4828565716743469},{"id":"https://openalex.org/C138268822","wikidata":"https://www.wikidata.org/wiki/Q1051925","display_name":"Resolution (logic)","level":2,"score":0.45514988899230957},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4446493089199066},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.3399369716644287},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33750009536743164},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.23106089234352112},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22510886192321777},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.19112840294837952},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.14979508519172668},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2011.6017482","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2011.6017482","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321920","display_name":"Innovation and Technology Commission","ror":"https://ror.org/04vf9tr09"},{"id":"https://openalex.org/F4320329815","display_name":"Hong Kong Government","ror":"https://ror.org/034179816"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1657210515","https://openalex.org/W1975412582","https://openalex.org/W2020496477","https://openalex.org/W2091386960","https://openalex.org/W2127004018","https://openalex.org/W6673384509"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2366989203","https://openalex.org/W2013995543","https://openalex.org/W2800812882","https://openalex.org/W2547954852","https://openalex.org/W3198360760","https://openalex.org/W2388454722","https://openalex.org/W4388488814","https://openalex.org/W2373608992","https://openalex.org/W2918931022"],"abstract_inverted_index":{"Design":[0],"and":[1,29,58,66],"implementation":[2],"of":[3,11],"a":[4,31,75],"micro":[5,68],"scanning":[6,69,77],"mirror":[7,70],"for":[8,23,41],"the":[9,42,53,63],"application":[10],"WVGA":[12],"resolution":[13],"(848\u00d7480)":[14],"pico-projector":[15],"display":[16],"is":[17,27,45],"presently":[18],"reported.":[19],"A":[20],"FEM":[21],"model":[22],"damping":[24,56],"coefficient":[25,57],"analysis":[26],"built":[28],"shows":[30],"good":[32],"agreement":[33],"with":[34,49],"experiment":[35],"result.":[36],"In":[37],"addition,":[38],"stress":[39,59],"study":[40],"torsional":[43,61],"bar":[44],"performed":[46],"to":[47,73],"deal":[48],"fracture":[50],"issue.":[51],"With":[52],"consideration":[54],"on":[55],"in":[60],"bar,":[62],"new":[64],"designed":[65],"implemented":[67],"has":[71],"shown":[72],"have":[74],">;6\u00b0":[76],"angle":[78],"at":[79],"21kHz":[80],"resonant":[81],"frequency.":[82]},"counts_by_year":[{"year":2014,"cited_by_count":2},{"year":2012,"cited_by_count":1}],"updated_date":"2026-06-26T08:34:08.712188","created_date":"2025-10-10T00:00:00"}