{"id":"https://openalex.org/W2105985502","doi":"https://doi.org/10.1109/nems.2011.6017332","title":"A novel thermal switch design by using CMOS MEMS fabrication process","display_name":"A novel thermal switch design by using CMOS MEMS fabrication process","publication_year":2011,"publication_date":"2011-02-01","ids":{"openalex":"https://openalex.org/W2105985502","doi":"https://doi.org/10.1109/nems.2011.6017332","mag":"2105985502"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2011.6017332","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2011.6017332","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5010745122","display_name":"Lei-Chun Chou","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Lei-Chun Chou","raw_affiliation_strings":["Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021788876","display_name":"You-Liang Lai","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"You-Liang Lai","raw_affiliation_strings":["National Chip Implementation Center, Hsinchu, Taiwan","National Chip Implementation Center (CIC), Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"National Chip Implementation Center, Hsinchu, Taiwan","institution_ids":[]},{"raw_affiliation_string":"National Chip Implementation Center (CIC), Hsinchu, Taiwan 300, R.O.C","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110220041","display_name":"Ying\u2010Zong Juang","orcid":null},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ying-Zong Juang","raw_affiliation_strings":["National Chip Implementation Center, Hsinchu, Taiwan","National Chip Implementation Center (CIC), Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"National Chip Implementation Center, Hsinchu, Taiwan","institution_ids":[]},{"raw_affiliation_string":"National Chip Implementation Center (CIC), Hsinchu, Taiwan 300, R.O.C","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027704442","display_name":"Chun-Yin Tsai","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Yin Tsai","raw_affiliation_strings":["Department of Mechanical Engineering, National Chiao Tung University, Hsinchu, Taiwan","Department of Mechanical Engineering , National Chiao Tung University , Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Department of Mechanical Engineering , National Chiao Tung University , Hsinchu, Taiwan 300, R.O.C","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5014937095","display_name":"Chun-Ying Lin","orcid":null},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Ying Lin","raw_affiliation_strings":["Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049143543","display_name":"Sheng\u2010Chieh Huang","orcid":"https://orcid.org/0000-0003-2116-0989"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Sheng-Chieh Huang","raw_affiliation_strings":["Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C","institution_ids":["https://openalex.org/I148366613"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5028646086","display_name":"Jin\u2010Chern Chiou","orcid":"https://orcid.org/0000-0003-1451-3977"},"institutions":[{"id":"https://openalex.org/I148366613","display_name":"National Yang Ming Chiao Tung University","ror":"https://ror.org/00se2k293","country_code":"TW","type":"education","lineage":["https://openalex.org/I148366613"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Jin-Chern Chiou","raw_affiliation_strings":["Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I148366613"]},{"raw_affiliation_string":"Dept. of Electrical Control Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, R.O.C","institution_ids":["https://openalex.org/I148366613"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5010745122"],"corresponding_institution_ids":["https://openalex.org/I148366613"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14019737,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"213","last_page":"216"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.7921720743179321},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7198187112808228},{"id":"https://openalex.org/keywords/actuator","display_name":"Actuator","score":0.7001875638961792},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6813883781433105},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.6555005311965942},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.5164366364479065},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5030304789543152},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4891834557056427},{"id":"https://openalex.org/keywords/thermal-oxidation","display_name":"Thermal oxidation","score":0.41924571990966797},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3802695572376251},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.31412842869758606},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19089454412460327},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1825544536113739},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.17382699251174927}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.7921720743179321},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7198187112808228},{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.7001875638961792},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6813883781433105},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.6555005311965942},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.5164366364479065},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5030304789543152},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4891834557056427},{"id":"https://openalex.org/C2779281663","wikidata":"https://www.wikidata.org/wiki/Q1549368","display_name":"Thermal oxidation","level":3,"score":0.41924571990966797},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3802695572376251},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.31412842869758606},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19089454412460327},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1825544536113739},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.17382699251174927},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2011.6017332","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2011.6017332","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 6th IEEE International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W323832480","https://openalex.org/W2137073747","https://openalex.org/W2612686989"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2120483398","https://openalex.org/W1530711136","https://openalex.org/W3014521742","https://openalex.org/W1763916368","https://openalex.org/W2319192085","https://openalex.org/W2391127530","https://openalex.org/W2045074154","https://openalex.org/W2346208161","https://openalex.org/W2089389693"],"abstract_inverted_index":{"The":[0],"present":[1],"study":[2],"focuses":[3],"on":[4,127,145,172,200],"implementing":[5],"a":[6,40,161],"novel":[7,26,162],"CMOS-MEMS":[8],"thermal":[9,44,156],"switch":[10,171,205],"by":[11],"using":[12],"commercially":[13],"available":[14],"TSMC":[15],"0.35":[16],"\u03bcm":[17,183,186,196],"two-poly":[18],"four-metal":[19],"(2P4M)":[20],"CMOS":[21],"process.":[22],"There":[23],"are":[24,219],"two":[25,191],"designs":[27],"in":[28,82,197],"this":[29],"paper:":[30],"first,":[31],"the":[32,48,65,67,71,79,85,89,94,101,112,118,128,147,154,165,170,176,178,188,201,204,213],"soft":[33,49],"contact":[34,50,103,114,129,192],"structure":[35,95],"and":[36,187,212,216],"post-processing":[37,119],"fabrication;":[38],"second,":[39],"new":[41,155],"design":[42,160],"of":[43,88,149],"actuator.":[45],"To":[46],"create":[47],"structure,":[51],"residual":[52,73,86],"stress":[53,74,87],"effect":[54,75],"has":[55,70,106,137,142],"been":[56,107],"utilized":[57],"to":[58,64,110,132,168],"make":[59],"different":[60],"bending":[61],"curvatures.":[62],"According":[63],"experiments,":[66],"layer":[68,90],"Metal1":[69],"largest":[72,80,102],"that":[76],"can":[77,206],"achieve":[78],"deflection":[81],"z-axis.":[83],"Because":[84],"metal-1":[91],"is":[92,181,194],"negative,":[93],"will":[96,124],"bend":[97],"down":[98],"after":[99],"release,":[100],"area":[104],"which":[105],"set":[108],"up":[109],"get":[111],"lowest":[113],"miss":[115],"ability.":[116],"In":[117,153,175],"fabrication,":[120],"0.3\u03bcm":[121],"thickness":[122],"gold":[123],"be":[125],"patterned":[126],"tips.":[130],"Due":[131],"gold,":[133],"rather":[134],"than":[135,151],"Aluminum,":[136],"no":[138],"oxidation":[139,150],"issue,":[140],"it":[141],"more":[143],"reliability":[144],"preventing":[146],"problem":[148],"Aluminum.":[152],"actuator":[157],"design,":[158],"we":[159],"folded-flexure":[163],"with":[164],"electrothermal":[166],"excitation":[167],"turn":[169],"or":[173],"off.":[174],"prototype,":[177],"device":[179],"size":[180],"500":[182],"*":[184],"400":[185],"gap":[189],"between":[190],"pads":[193],"9":[195],"off-state.":[198],"Depending":[199],"simulation":[202],"results,":[203],"work":[207],"stably":[208],"at":[209],"3":[210],"volts,":[211],"working":[214],"temperature":[215],"operating":[217],"bandwidth":[218],"individually":[220],"20-200":[221],"\u00b0C.":[222]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}