{"id":"https://openalex.org/W2015070150","doi":"https://doi.org/10.1109/nems.2010.5592479","title":"A surface micromachining process utilizing dual metal sacrificial layer for fabrication of RF MEMS switch","display_name":"A surface micromachining process utilizing dual metal sacrificial layer for fabrication of RF MEMS switch","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2015070150","doi":"https://doi.org/10.1109/nems.2010.5592479","mag":"2015070150"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2010.5592479","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592479","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100760302","display_name":"Bo Liu","orcid":"https://orcid.org/0000-0001-5110-4887"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bo Liu","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110213600","display_name":"Zhiqiu Lv","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhiqiu Lv","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100389157","display_name":"Zhihong Li","orcid":"https://orcid.org/0000-0002-5978-7894"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhihong Li","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084704775","display_name":"Xunjun He","orcid":"https://orcid.org/0000-0001-9845-1050"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xunjun He","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100512905","display_name":"Yilong Hao","orcid":null},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yilong Hao","raw_affiliation_strings":["National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing, 100871, P. R. China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":8,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"620","last_page":"623"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9988999962806702,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.8308863639831543},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8165841102600098},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.7851897478103638},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.7128679752349854},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7085996866226196},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6223187446594238},{"id":"https://openalex.org/keywords/residual-stress","display_name":"Residual stress","score":0.5551999807357788},{"id":"https://openalex.org/keywords/dual-layer","display_name":"Dual layer","score":0.5265158414840698},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4821300506591797},{"id":"https://openalex.org/keywords/metal","display_name":"Metal","score":0.46287208795547485},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.39684152603149414},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3464227318763733},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.3203248679637909}],"concepts":[{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.8308863639831543},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8165841102600098},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.7851897478103638},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.7128679752349854},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7085996866226196},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6223187446594238},{"id":"https://openalex.org/C37292000","wikidata":"https://www.wikidata.org/wiki/Q1257918","display_name":"Residual stress","level":2,"score":0.5551999807357788},{"id":"https://openalex.org/C2993148961","wikidata":"https://www.wikidata.org/wiki/Q5294","display_name":"Dual layer","level":3,"score":0.5265158414840698},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4821300506591797},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.46287208795547485},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.39684152603149414},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3464227318763733},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.3203248679637909},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2010.5592479","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592479","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320324787","display_name":"Peking University","ror":"https://ror.org/02v51f717"},{"id":"https://openalex.org/F4320327019","display_name":"National Key Laboratory of Science and Technology on Micro/Nano Fabrication","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1968442363","https://openalex.org/W1992805961","https://openalex.org/W1997716456","https://openalex.org/W2012843923","https://openalex.org/W2023706703","https://openalex.org/W2025736475","https://openalex.org/W2046861037","https://openalex.org/W2050180880","https://openalex.org/W2080538927","https://openalex.org/W2130300793","https://openalex.org/W2148935287","https://openalex.org/W6649830781"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W3197368573","https://openalex.org/W2392905164","https://openalex.org/W1975700181","https://openalex.org/W1974776238","https://openalex.org/W3214111312","https://openalex.org/W2127142440","https://openalex.org/W2883973521","https://openalex.org/W2114051864","https://openalex.org/W1563566515"],"abstract_inverted_index":{"We":[0],"have":[1],"developed":[2],"a":[3,55,65],"surface":[4,68,110],"micromachining":[5],"process":[6],"utilizing":[7],"the":[8,16,21,33,37,70,81,107],"Cu":[9,79,99],"-":[10,100],"Ni":[11,43,101],"dual":[12,102],"metal":[13,57],"layer":[14,18,28,72,83,104],"as":[15,42,80],"sacrificial":[17,39,58,82,103],"to":[19],"fabricate":[20],"metal-contact":[22],"RF":[23],"MEMS":[24],"switch.":[25],"No":[26],"seed":[27],"is":[29,46],"required":[30],"for":[31],"electroplating":[32],"structural":[34,71,109],"layer,":[35,40],"when":[36,53],"metallic":[38],"such":[41],"and":[44,85,111],"Cu,":[45],"employed.":[47],"Some":[48],"inherit":[49],"problems":[50],"were":[51],"found":[52],"using":[54],"single":[56],"layer.":[59],"Our":[60],"experimental":[61],"results":[62],"showed":[63],"that":[64],"rough":[66],"bottom":[67],"of":[69,78,94],"would":[73,89],"be":[74,90],"obtained":[75],"by":[76,92],"use":[77,93],"solely,":[84],"an":[86],"unacceptable":[87],"stress":[88],"induced":[91],"Ni.":[95],"In":[96],"contrast,":[97],"applying":[98],"led":[105],"in":[106],"smooth":[108],"insignificant":[112],"residual":[113],"stress.":[114],"A":[115],"fabricated":[116],"switch":[117],"was":[118],"demonstrated":[119],"here.":[120]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2013,"cited_by_count":3}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}