{"id":"https://openalex.org/W2025731104","doi":"https://doi.org/10.1109/nems.2010.5592454","title":"Design and simulation of electrostatic inkjet head","display_name":"Design and simulation of electrostatic inkjet head","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2025731104","doi":"https://doi.org/10.1109/nems.2010.5592454","mag":"2025731104"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2010.5592454","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592454","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112892769","display_name":"Wenlong Lv","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Wenlong Lv","raw_affiliation_strings":["Xiamen University, Xiamen, Fujian, CN"],"affiliations":[{"raw_affiliation_string":"Xiamen University, Xiamen, Fujian, CN","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5000931110","display_name":"Yang Liu","orcid":"https://orcid.org/0000-0001-9296-5296"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yang Liu","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073401463","display_name":"Donghang Chen","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Donghang Chen","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100608322","display_name":"Lingyun Wang","orcid":"https://orcid.org/0000-0002-3786-3905"},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Lingyun Wang","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, China","institution_ids":["https://openalex.org/I191208505"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5113664117","display_name":"Daoheng Sun","orcid":null},"institutions":[{"id":"https://openalex.org/I191208505","display_name":"Xiamen University","ror":"https://ror.org/00mcjh785","country_code":"CN","type":"education","lineage":["https://openalex.org/I191208505"]},{"id":"https://openalex.org/I102398690","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94","country_code":"CN","type":"funder","lineage":["https://openalex.org/I102398690"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Daoheng Sun","raw_affiliation_strings":["Department of Mechanical and Electrical Engineering, Xiamen University, China","National Natural Science Foundation, China"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical and Electrical Engineering, Xiamen University, China","institution_ids":["https://openalex.org/I191208505"]},{"raw_affiliation_string":"National Natural Science Foundation, China","institution_ids":["https://openalex.org/I102398690"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5112892769"],"corresponding_institution_ids":["https://openalex.org/I191208505"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.09698808,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"84","issue":null,"first_page":"532","last_page":"536"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11523","display_name":"Nanomaterials and Printing Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9993000030517578,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12776","display_name":"Electrohydrodynamics and Fluid Dynamics","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/head","display_name":"Head (geology)","score":0.6147685050964355},{"id":"https://openalex.org/keywords/inkjet-printing","display_name":"Inkjet printing","score":0.5890985131263733},{"id":"https://openalex.org/keywords/electrostatic-discharge","display_name":"Electrostatic discharge","score":0.5477874875068665},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.49088793992996216},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3218730688095093},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23755419254302979},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.19310429692268372},{"id":"https://openalex.org/keywords/inkwell","display_name":"Inkwell","score":0.13827702403068542},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.08832594752311707},{"id":"https://openalex.org/keywords/geology","display_name":"Geology","score":0.054512351751327515}],"concepts":[{"id":"https://openalex.org/C2780312720","wikidata":"https://www.wikidata.org/wiki/Q5689100","display_name":"Head (geology)","level":2,"score":0.6147685050964355},{"id":"https://openalex.org/C2987330114","wikidata":"https://www.wikidata.org/wiki/Q95474715","display_name":"Inkjet printing","level":3,"score":0.5890985131263733},{"id":"https://openalex.org/C205483674","wikidata":"https://www.wikidata.org/wiki/Q3574961","display_name":"Electrostatic discharge","level":3,"score":0.5477874875068665},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.49088793992996216},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3218730688095093},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23755419254302979},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.19310429692268372},{"id":"https://openalex.org/C109693293","wikidata":"https://www.wikidata.org/wiki/Q1496072","display_name":"Inkwell","level":2,"score":0.13827702403068542},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.08832594752311707},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.054512351751327515},{"id":"https://openalex.org/C114793014","wikidata":"https://www.wikidata.org/wiki/Q52109","display_name":"Geomorphology","level":1,"score":0.0},{"id":"https://openalex.org/C28490314","wikidata":"https://www.wikidata.org/wiki/Q189436","display_name":"Speech recognition","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2010.5592454","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592454","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W1489231517","https://openalex.org/W1496510773","https://openalex.org/W1507519169","https://openalex.org/W1530914963","https://openalex.org/W1732840744","https://openalex.org/W2001794600","https://openalex.org/W2010401257","https://openalex.org/W2058660795","https://openalex.org/W2084444771","https://openalex.org/W2108380844","https://openalex.org/W2145378298","https://openalex.org/W2148444081"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W2544244340","https://openalex.org/W2124694210","https://openalex.org/W2153609444","https://openalex.org/W3160715487","https://openalex.org/W1482270496","https://openalex.org/W2092583844","https://openalex.org/W1967807891","https://openalex.org/W2157426934"],"abstract_inverted_index":{"A":[0,125],"laminated,":[1],"multi-substrate":[2],"inkjet":[3,8,234,259],"head":[4,235,260],"that":[5,149,208],"called":[6],"\u201celectrostatic":[7],"head\u201d":[9],"has":[10,87],"been":[11,88],"designed,":[12],"which":[13,162,216,243],"consists":[14],"of":[15,39,52,94,127,159,169,184,226,233,247],"three":[16],"parts:":[17],"upper":[18,153],"layer":[19,22,25,28,70,154],"(Si),":[20,23],"middle":[21],"bottom":[24,51,69],"(glass).":[26],"Middle":[27],"includes":[29],"nozzles,":[30],"ink":[31,41,53,61,64,96,223],"cavity":[32,42],"and":[33,46,85,105,113,119,200,214,240,250],"diaphragms.":[34],"Ink":[35],"is":[36,57,108,123,174,190,198,203,211],"jetted":[37],"out":[38,176,225],"the":[40,44,50,63,68,73,78,92,95,114,117,120,138,146,152,157,163,181,187,193,196,227,230,245,252],"through":[43],"nozzle,":[45],"diaphragm":[47,118],"defined":[48],"as":[49,75,145],"cavity.":[54,65],"Charging":[55],"channels":[56,148],"used":[58],"for":[59],"supplying":[60],"to":[62,72,76,90,137,155,179,221,255],"Electrodes":[66],"on":[67],"face":[71],"diaphragm,":[74],"drive":[77],"diaphragms":[79],"by":[80,161],"electrostatic":[81],"force.":[82],"Theoretical":[83],"analysis":[84],"simulation":[86],"done":[89],"optimize":[91],"design":[93,232],"jet":[97],"head.":[98],"Diaphragm":[99],"with":[100],"380\u03bcm":[101],"width,":[102],"6000\u03bcm":[103],"length":[104],"5\u03bcm":[106],"thickness":[107],"designed":[109],"in":[110,151,177,195],"this":[111,258],"work,":[112],"gap":[115],"between":[116,212],"ground":[121],"electrode":[122],"1\u03bcm.":[124],"displacement":[126],"0.26\u03bcm":[128],"can":[129,165,217],"be":[130,166],"achieved":[131],"under":[132],"36V":[133,191],"DC":[134],"voltage":[135,164,189,239],"according":[136],"simulation.":[139],"Flat-walled":[140],"diffuser":[141],"elements":[142],"were":[143],"applied":[144,188],"charging":[147],"positioned":[150],"eliminate":[156],"reflux":[158],"ink,":[160],"reduced.":[167],"Simulation":[168,205],"Fluid":[170],"Structure":[171],"Interface":[172],"(FSI)":[173],"carried":[175],"ANSYS":[178],"analyze":[180],"whole":[182],"process":[183],"printing.":[185],"When":[186],"DC,":[192],"velocity":[194],"nozzle":[197],"2.82m/s":[199],"Weber":[201,209],"Number":[202,210],"8.5.":[204],"results":[206],"show":[207],"1":[213],"12,":[215],"provide":[218],"sufficient":[219],"power":[220],"eject":[222],"drop":[224],"nozzle.":[228],"Furthermore,":[229],"new":[231],"needs":[236],"lower":[237],"driving":[238],"easier":[241],"process,":[242],"increases":[244],"rate":[246],"finished":[248],"products":[249],"reduces":[251],"cost.":[253],"Due":[254],"these":[256],"advantages,":[257],"would":[261],"have":[262],"widespread":[263],"application":[264],"prospect.":[265]},"counts_by_year":[{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}