{"id":"https://openalex.org/W2003417358","doi":"https://doi.org/10.1109/nems.2010.5592446","title":"High efficiency coupling with stacked MEMS coils","display_name":"High efficiency coupling with stacked MEMS coils","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2003417358","doi":"https://doi.org/10.1109/nems.2010.5592446","mag":"2003417358"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2010.5592446","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592446","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007289297","display_name":"Xiuhan Li","orcid":"https://orcid.org/0000-0002-5254-9877"},"institutions":[{"id":"https://openalex.org/I21193070","display_name":"Beijing Jiaotong University","ror":"https://ror.org/01yj56c84","country_code":"CN","type":"education","lineage":["https://openalex.org/I21193070"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Xiuhan Li","raw_affiliation_strings":["School of Electronics and Information Engineering, Beijing Jiaotong University, Beijing, China","School of Electronics and Information Engineering Beijing Jiaotong University Beijing, China"],"affiliations":[{"raw_affiliation_string":"School of Electronics and Information Engineering, Beijing Jiaotong University, Beijing, China","institution_ids":["https://openalex.org/I21193070"]},{"raw_affiliation_string":"School of Electronics and Information Engineering Beijing Jiaotong University Beijing, China","institution_ids":["https://openalex.org/I21193070"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100451116","display_name":"Yin Li","orcid":"https://orcid.org/0000-0002-2635-6633"},"institutions":[{"id":"https://openalex.org/I21193070","display_name":"Beijing Jiaotong University","ror":"https://ror.org/01yj56c84","country_code":"CN","type":"education","lineage":["https://openalex.org/I21193070"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Li Yin","raw_affiliation_strings":["School of Electronics and Information Engineering, Beijing Jiaotong University, Beijing, China","School of Electronics and Information Engineering Beijing Jiaotong University Beijing, China"],"affiliations":[{"raw_affiliation_string":"School of Electronics and Information Engineering, Beijing Jiaotong University, Beijing, China","institution_ids":["https://openalex.org/I21193070"]},{"raw_affiliation_string":"School of Electronics and Information Engineering Beijing Jiaotong University Beijing, China","institution_ids":["https://openalex.org/I21193070"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101837108","display_name":"Zilu Wang","orcid":"https://orcid.org/0000-0001-5638-4574"},"institutions":[{"id":"https://openalex.org/I21193070","display_name":"Beijing Jiaotong University","ror":"https://ror.org/01yj56c84","country_code":"CN","type":"education","lineage":["https://openalex.org/I21193070"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zilu Wang","raw_affiliation_strings":["School of Electronics and Information Engineering, Beijing Jiaotong University, Beijing, China","School of Electronics and Information Engineering Beijing Jiaotong University Beijing, China"],"affiliations":[{"raw_affiliation_string":"School of Electronics and Information Engineering, Beijing Jiaotong University, Beijing, China","institution_ids":["https://openalex.org/I21193070"]},{"raw_affiliation_string":"School of Electronics and Information Engineering Beijing Jiaotong University Beijing, China","institution_ids":["https://openalex.org/I21193070"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101708482","display_name":"Quan Yuan","orcid":"https://orcid.org/0000-0002-2387-0733"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Quan Yuan","raw_affiliation_strings":["National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China","National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, CHINA"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, CHINA","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036748512","display_name":"Dongming Fang","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongming Fang","raw_affiliation_strings":["National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China","National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, CHINA"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]},{"raw_affiliation_string":"National Key Laboratory of Nano/Micro Fabrication Technology Institute of Microelectronics, Peking University, Beijing, CHINA","institution_ids":["https://openalex.org/I20231570"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100375644","display_name":"Haixia Zhang","orcid":"https://orcid.org/0000-0003-4565-4123"},"institutions":[{"id":"https://openalex.org/I20231570","display_name":"Peking University","ror":"https://ror.org/02v51f717","country_code":"CN","type":"education","lineage":["https://openalex.org/I20231570"]},{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Haixia Zhang","raw_affiliation_strings":["National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China"],"affiliations":[{"raw_affiliation_string":"National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing, China","institution_ids":["https://openalex.org/I20231570","https://openalex.org/I4210119392"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":6,"corresponding_author_ids":["https://openalex.org/A5007289297"],"corresponding_institution_ids":["https://openalex.org/I21193070"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.08097036,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"509","last_page":"512"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11249","display_name":"Wireless Power Transfer Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T11392","display_name":"Energy Harvesting in Wireless Networks","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8734720349311829},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.7105482816696167},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6503939628601074},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.6371341943740845},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.5780495405197144},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5777219533920288},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.5501492619514465},{"id":"https://openalex.org/keywords/power-transmission","display_name":"Power transmission","score":0.4791088104248047},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.42937564849853516},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4096681475639343},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.39407411217689514},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3524947166442871},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.23675519227981567},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.22843220829963684},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.16556215286254883},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.0921497642993927},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07524707913398743},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.06773647665977478}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8734720349311829},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.7105482816696167},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6503939628601074},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.6371341943740845},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5780495405197144},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5777219533920288},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.5501492619514465},{"id":"https://openalex.org/C92018576","wikidata":"https://www.wikidata.org/wiki/Q3242194","display_name":"Power transmission","level":3,"score":0.4791088104248047},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.42937564849853516},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4096681475639343},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.39407411217689514},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3524947166442871},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.23675519227981567},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.22843220829963684},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.16556215286254883},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0921497642993927},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07524707913398743},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.06773647665977478},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2010.5592446","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592446","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8600000143051147,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1520870552","https://openalex.org/W1983225854","https://openalex.org/W2141227665","https://openalex.org/W2146724547","https://openalex.org/W2158977247","https://openalex.org/W2171947300","https://openalex.org/W2295442890","https://openalex.org/W6680533037","https://openalex.org/W6697158000"],"related_works":["https://openalex.org/W2391476397","https://openalex.org/W2068702844","https://openalex.org/W781402092","https://openalex.org/W2386705258","https://openalex.org/W2098391898","https://openalex.org/W1966756000","https://openalex.org/W2048131120","https://openalex.org/W2104299154","https://openalex.org/W1981606113","https://openalex.org/W2384484200"],"abstract_inverted_index":{"Wireless":[0],"power":[1],"delivery":[2],"to":[3,15,68],"implantable":[4],"biomedical":[5],"devices":[6],"by":[7,36],"means":[8],"of":[9,42],"inductive":[10],"coupling":[11,30,59],"has":[12],"been":[13],"proved":[14],"be":[16],"feasible.":[17],"MEMS":[18,32,51,89],"coils":[19,33,52,79,90],"which":[20,53],"are":[21,26,54],"fabricated":[22],"with":[23,39,81],"micro-fabrication":[24],"technology":[25],"used":[27],"as":[28],"the":[29,40,58],"coils.":[31],"were":[34],"formed":[35],"Cu":[37],"electroplating":[38],"thickness":[41],"15\u03bcm.":[43],"This":[44],"paper":[45],"present":[46],"a":[47],"new":[48],"stack":[49],"packaged":[50],"helpful":[55],"in":[56,66,72,92,95,102],"improving":[57],"efficiency.":[60],"An":[61],"experiment":[62],"setup":[63],"was":[64,100],"designed":[65],"order":[67],"measure":[69],"RF":[70],"transmission":[71],"bio":[73],"body.":[74],"Measurement":[75],"results":[76],"for":[77],"PCB":[78],"coupled":[80],"one,":[82],"two":[83],"and":[84,94],"three":[85],"stacked":[86],"parallel":[87],"connect":[88],"both":[91],"air":[93],"SBF(Simulated":[96],"Body":[97],"Fluid)":[98],"solution":[99],"presented":[101],"this":[103],"paper.":[104]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}
