{"id":"https://openalex.org/W2095585016","doi":"https://doi.org/10.1109/nems.2010.5592433","title":"Effect of additives on mechanical properties of electroplating nickel","display_name":"Effect of additives on mechanical properties of electroplating nickel","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2095585016","doi":"https://doi.org/10.1109/nems.2010.5592433","mag":"2095585016"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2010.5592433","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592433","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5087718729","display_name":"Jun Tang","orcid":"https://orcid.org/0000-0002-8742-4222"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Jun Tang","raw_affiliation_strings":["Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5108614307","display_name":"Shengping Mao","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shengping Mao","raw_affiliation_strings":["Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051576642","display_name":"Hong Wang","orcid":"https://orcid.org/0000-0003-0165-3559"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hong Wang","raw_affiliation_strings":["Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100448676","display_name":"Rui Liu","orcid":"https://orcid.org/0009-0007-5725-0317"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Rui Liu","raw_affiliation_strings":["Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5010921118","display_name":"Guifu Ding","orcid":"https://orcid.org/0000-0002-7609-757X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guifu Ding","raw_affiliation_strings":["Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"Key Laboratory for Thin Film and Microfabrication Technology of Ministry of Education, National Key Laboratory of Micro/Nano Fabrication Technology, Research Institute of Micro/Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5087718729"],"corresponding_institution_ids":["https://openalex.org/I183067930"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.16009837,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"450","last_page":"453"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9977999925613403,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ultimate-tensile-strength","display_name":"Ultimate tensile strength","score":0.8442671298980713},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7945948839187622},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.7473506331443787},{"id":"https://openalex.org/keywords/nickel","display_name":"Nickel","score":0.7228536605834961},{"id":"https://openalex.org/keywords/electrolyte","display_name":"Electrolyte","score":0.6328121423721313},{"id":"https://openalex.org/keywords/grain-size","display_name":"Grain size","score":0.6191398501396179},{"id":"https://openalex.org/keywords/elongation","display_name":"Elongation","score":0.5295090675354004},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.518957793712616},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.5107364654541016},{"id":"https://openalex.org/keywords/tensile-testing","display_name":"Tensile testing","score":0.4418162405490875},{"id":"https://openalex.org/keywords/fractography","display_name":"Fractography","score":0.441619873046875},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4395516514778137},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.15769633650779724},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.1351826786994934},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.1066267192363739},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.10357785224914551}],"concepts":[{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.8442671298980713},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7945948839187622},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.7473506331443787},{"id":"https://openalex.org/C504270822","wikidata":"https://www.wikidata.org/wiki/Q744","display_name":"Nickel","level":2,"score":0.7228536605834961},{"id":"https://openalex.org/C68801617","wikidata":"https://www.wikidata.org/wiki/Q162908","display_name":"Electrolyte","level":3,"score":0.6328121423721313},{"id":"https://openalex.org/C192191005","wikidata":"https://www.wikidata.org/wiki/Q466491","display_name":"Grain size","level":2,"score":0.6191398501396179},{"id":"https://openalex.org/C33947775","wikidata":"https://www.wikidata.org/wiki/Q271439","display_name":"Elongation","level":3,"score":0.5295090675354004},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.518957793712616},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.5107364654541016},{"id":"https://openalex.org/C182508753","wikidata":"https://www.wikidata.org/wiki/Q115605","display_name":"Tensile testing","level":3,"score":0.4418162405490875},{"id":"https://openalex.org/C45780264","wikidata":"https://www.wikidata.org/wiki/Q866682","display_name":"Fractography","level":3,"score":0.441619873046875},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4395516514778137},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.15769633650779724},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.1351826786994934},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.1066267192363739},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.10357785224914551},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2010.5592433","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592433","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1966656739","https://openalex.org/W2002467641","https://openalex.org/W2013819618","https://openalex.org/W2030355874","https://openalex.org/W2040569498","https://openalex.org/W2073491897","https://openalex.org/W2087796222","https://openalex.org/W2101855917","https://openalex.org/W2115302362","https://openalex.org/W4249437249"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2104623381","https://openalex.org/W651503557","https://openalex.org/W2382032830","https://openalex.org/W3153237190","https://openalex.org/W2780959255","https://openalex.org/W4241028841","https://openalex.org/W2033331415","https://openalex.org/W2597281601","https://openalex.org/W4240218142"],"abstract_inverted_index":{"Since":[0],"the":[1,7,11,17,86,101,171,178,187,194],"additives":[2,20,175],"is":[3,104,151,184],"necessary":[4],"for":[5,186],"eliminating":[6],"residual":[8],"stress":[9],"of":[10,19,24,34,71,89,110,154,156,167],"nickel":[12,26,35,125],"structure":[13],"in":[14,29,39,60,128,165],"MEMS":[15,195],"devices,":[16],"effect":[18,192],"on":[21],"mechanical":[22,179],"properties":[23,180],"electroplating":[25],"was":[27,37],"studied":[28],"this":[30,191],"paper.":[31],"Two":[32],"types":[33],"specimens":[36,77,116],"electroplated":[38],"electrolytes":[40],"with":[41],"both":[42,133],"saccharine":[43,50,134],"and":[44,48,69,74,80,83,92,97,113,135,145,182],"butynediol":[45,136],"(type":[46,51],"A),":[47],"only":[49],"B),":[52],"respectively.":[53],"The":[54,64,106,121,159],"test":[55],"chips":[56],"were":[57],"then":[58],"tested":[59],"our":[61],"tensile":[62,67,148],"system.":[63],"average":[65,87],"ultimate":[66,147],"strength":[68],"hardness":[70],"type":[72,75,90,93,111,114],"A":[73,112],"B":[76,94,115],"are":[78,95,117],"1954MPa":[79],"4.47GPa,":[81],"923Mpa":[82],"2.87GPa,":[84],"respectively;":[85],"elongation":[88],"A,":[91],"7.94%":[96],"12.38%,":[98],"respectively,":[99],"when":[100],"gauge":[102],"length":[103],"100\u03bcm.":[105],"mean":[107],"grain":[108],"sizes":[109],"about":[118],"20nm,":[119],"160nm.":[120],"results":[122,172],"indicates":[123],"that":[124,155,174],"film":[126],"fabricated":[127],"an":[129],"electrolyte":[130],"added":[131],"by":[132],"leads":[137],"to":[138,189],"much":[139],"more":[140],"smooth":[141],"surface,":[142],"finer":[143],"nano-grain,":[144],"higher":[146],"strength-1954Mpa,":[149],"which":[150],"two":[152,168],"times":[153],"another":[157],"type-923Mpa.":[158],"SEM":[160],"images":[161],"also":[162],"show":[163],"differences":[164],"fractography":[166],"types.":[169],"All":[170],"indicate":[173],"could":[176],"affect":[177],"dramatically,":[181],"it":[183],"essential":[185],"designer":[188],"consider":[190],"during":[193],"devices":[196],"designing":[197],"process.":[198]},"counts_by_year":[{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}