{"id":"https://openalex.org/W2088655439","doi":"https://doi.org/10.1109/nems.2010.5592255","title":"The packaging effect on high g accelerometer test","display_name":"The packaging effect on high g accelerometer test","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2088655439","doi":"https://doi.org/10.1109/nems.2010.5592255","mag":"2088655439"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2010.5592255","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592255","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5057421947","display_name":"Yunbo Shi","orcid":"https://orcid.org/0000-0002-4394-6555"},"institutions":[],"countries":[],"is_corresponding":true,"raw_author_name":"Yunbo Shi","raw_affiliation_strings":["National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","institution_ids":[]},{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060173424","display_name":"Zhengqiang Zhu","orcid":"https://orcid.org/0000-0002-6736-8876"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Zhengqiang Zhu","raw_affiliation_strings":["National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","institution_ids":[]},{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100741313","display_name":"Ping Li","orcid":"https://orcid.org/0000-0002-3216-6246"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ping Li","raw_affiliation_strings":["National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","institution_ids":[]},{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5112857188","display_name":"Jun Liu","orcid":"https://orcid.org/0000-0002-1128-8201"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jun Liu","raw_affiliation_strings":["National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan, China","institution_ids":[]},{"raw_affiliation_string":"National Key Laboratory for Electronic Measurement Technology, Taiyuan 030051, China","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":0,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5057421947"],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.14503088,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"10","issue":null,"first_page":"720","last_page":"722"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9958000183105469,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13885","display_name":"Geophysics and Sensor Technology","score":0.987500011920929,"subfield":{"id":"https://openalex.org/subfields/2212","display_name":"Ocean Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7319808602333069},{"id":"https://openalex.org/keywords/sensitivity","display_name":"Sensitivity (control systems)","score":0.7250288724899292},{"id":"https://openalex.org/keywords/ceramic","display_name":"Ceramic","score":0.7024176120758057},{"id":"https://openalex.org/keywords/accelerometer","display_name":"Accelerometer","score":0.594011127948761},{"id":"https://openalex.org/keywords/acceleration","display_name":"Acceleration","score":0.5933533906936646},{"id":"https://openalex.org/keywords/split-hopkinson-pressure-bar","display_name":"Split-Hopkinson pressure bar","score":0.5045040845870972},{"id":"https://openalex.org/keywords/modal","display_name":"Modal","score":0.465833842754364},{"id":"https://openalex.org/keywords/modal-analysis","display_name":"Modal analysis","score":0.432047963142395},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3547977805137634},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.3406139314174652},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3020152449607849},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.23655396699905396},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.22039750218391418},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.1771785318851471}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7319808602333069},{"id":"https://openalex.org/C21200559","wikidata":"https://www.wikidata.org/wiki/Q7451068","display_name":"Sensitivity (control systems)","level":2,"score":0.7250288724899292},{"id":"https://openalex.org/C134132462","wikidata":"https://www.wikidata.org/wiki/Q45621","display_name":"Ceramic","level":2,"score":0.7024176120758057},{"id":"https://openalex.org/C89805583","wikidata":"https://www.wikidata.org/wiki/Q192940","display_name":"Accelerometer","level":2,"score":0.594011127948761},{"id":"https://openalex.org/C117896860","wikidata":"https://www.wikidata.org/wiki/Q11376","display_name":"Acceleration","level":2,"score":0.5933533906936646},{"id":"https://openalex.org/C77301326","wikidata":"https://www.wikidata.org/wiki/Q137178","display_name":"Split-Hopkinson pressure bar","level":3,"score":0.5045040845870972},{"id":"https://openalex.org/C71139939","wikidata":"https://www.wikidata.org/wiki/Q910194","display_name":"Modal","level":2,"score":0.465833842754364},{"id":"https://openalex.org/C104286136","wikidata":"https://www.wikidata.org/wiki/Q1416137","display_name":"Modal analysis","level":3,"score":0.432047963142395},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3547977805137634},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.3406139314174652},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3020152449607849},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.23655396699905396},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.22039750218391418},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.1771785318851471},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C74650414","wikidata":"https://www.wikidata.org/wiki/Q11397","display_name":"Classical mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C149342994","wikidata":"https://www.wikidata.org/wiki/Q3181055","display_name":"Strain rate","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2010.5592255","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592255","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":3,"referenced_works":["https://openalex.org/W1898904473","https://openalex.org/W1989359899","https://openalex.org/W2042553348"],"related_works":["https://openalex.org/W4384517610","https://openalex.org/W4288389100","https://openalex.org/W1902800522","https://openalex.org/W2339469482","https://openalex.org/W2630216268","https://openalex.org/W2157888865","https://openalex.org/W2159163347","https://openalex.org/W2361310367","https://openalex.org/W2080072286","https://openalex.org/W2015680840"],"abstract_inverted_index":{"To":[0],"address":[1],"the":[2,12,23,38,53,57,74,88,113],"high-g":[3],"acceleration":[4],"sensor":[5,63,75],"packaging":[6,17],"material":[7],"and":[8,27,56,79,102],"structure":[9,89,101],"selection":[10],"issue;":[11],"modal":[13],"frequency":[14],"of":[15,37,41,98],"different":[16],"materials":[18],"was":[19,43,60,96,110],"analyzed.":[20],"According":[21],"to":[22,104],"natural":[24],"frequencies,":[25],"ceramic":[26,99],"stainless":[28,66,114],"steel":[29,115],"selected":[30],"as":[31],"two":[32,39],"package":[33,42,100],"forms.":[34],"Then,":[35],"test":[36],"types":[40],"processed":[44],"by":[45,65,91],"Hopkinson":[46],"bar.":[47],"The":[48,68,82,93],"experimental":[49,69],"results":[50,70],"show":[51,72],"that,":[52],"sensitivity":[54,78,109],"decreased":[55],"structural":[58],"stability":[59],"good":[61,77],"while":[62],"packaged":[64,116],"steel.":[67],"also":[71],"that":[73],"has":[76],"anti-overload":[80,94],"ability.":[81],"output":[83],"single":[84],"is":[85],"right":[86],"when":[87],"impacted":[90],"150000g.":[92],"ability":[95],"bad":[97],"easy":[103],"produce":[105],"resonant":[106],"phenomenon,":[107],"but":[108],"higher":[111],"than":[112],"sensor.":[117]},"counts_by_year":[],"updated_date":"2026-04-29T09:16:38.111599","created_date":"2025-10-10T00:00:00"}