{"id":"https://openalex.org/W2072666768","doi":"https://doi.org/10.1109/nems.2010.5592176","title":"Design optimization of polymeric Out-of-plane electro-thermal actuator","display_name":"Design optimization of polymeric Out-of-plane electro-thermal actuator","publication_year":2010,"publication_date":"2010-01-01","ids":{"openalex":"https://openalex.org/W2072666768","doi":"https://doi.org/10.1109/nems.2010.5592176","mag":"2072666768"},"language":"en","primary_location":{"id":"doi:10.1109/nems.2010.5592176","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592176","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100624594","display_name":"Juan Wang","orcid":"https://orcid.org/0000-0002-1494-7786"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Juan Wang","raw_affiliation_strings":["National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5089602304","display_name":"Yibo Wu","orcid":"https://orcid.org/0000-0002-2420-7511"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yibo Wu","raw_affiliation_strings":["National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038373479","display_name":"Shi Fu","orcid":"https://orcid.org/0000-0001-7476-6955"},"institutions":[{"id":"https://openalex.org/I4210156189","display_name":"Shanghai Dianji University","ror":"https://ror.org/055fene14","country_code":"CN","type":"education","lineage":["https://openalex.org/I4210156189"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shi Fu","raw_affiliation_strings":["School of Mechanical Engineering, Shanghai Dianji University, Shanghai, China","School of Mechanical Engineering, Shanghai Dianji University, Shanghai, 200245, China"],"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering, Shanghai Dianji University, Shanghai, China","institution_ids":["https://openalex.org/I4210156189"]},{"raw_affiliation_string":"School of Mechanical Engineering, Shanghai Dianji University, Shanghai, 200245, China","institution_ids":["https://openalex.org/I4210156189"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018546192","display_name":"Congchun Zhang","orcid":null},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Congchun Zhang","raw_affiliation_strings":["National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5010921118","display_name":"Guifu Ding","orcid":"https://orcid.org/0000-0002-7609-757X"},"institutions":[{"id":"https://openalex.org/I183067930","display_name":"Shanghai Jiao Tong University","ror":"https://ror.org/0220qvk04","country_code":"CN","type":"education","lineage":["https://openalex.org/I183067930"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Guifu Ding","raw_affiliation_strings":["National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","Shanghai Jiao Tong University, Shanghai, China"],"affiliations":[{"raw_affiliation_string":"National Key Lab of Nano/Micro Fabrication Technology, Key Lab for Thin Film and Micro fabrication of the Ministry of Education, General Process MEMS Laboratory, Institute of Micro and Nano Science and Technology, Shanghai Jiaotong University, Shanghai, China","institution_ids":[]},{"raw_affiliation_string":"Shanghai Jiao Tong University, Shanghai, China","institution_ids":["https://openalex.org/I183067930"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5100624594"],"corresponding_institution_ids":["https://openalex.org/I183067930"],"apc_list":null,"apc_paid":null,"fwci":0.51591888,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.71865832,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"2","issue":null,"first_page":"157","last_page":"160"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11608","display_name":"Dielectric materials and actuators","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9965000152587891,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/actuator","display_name":"Actuator","score":0.8862154483795166},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7814897894859314},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.7075304388999939},{"id":"https://openalex.org/keywords/curling","display_name":"Curling","score":0.7025170922279358},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6862990260124207},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.6326680779457092},{"id":"https://openalex.org/keywords/perpendicular","display_name":"Perpendicular","score":0.5908347368240356},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.48741987347602844},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.481008380651474},{"id":"https://openalex.org/keywords/plane","display_name":"Plane (geometry)","score":0.4155104160308838},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3948465585708618},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.3868778944015503},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.2126721441745758},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1819218397140503},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16249367594718933},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.06402111053466797}],"concepts":[{"id":"https://openalex.org/C172707124","wikidata":"https://www.wikidata.org/wiki/Q423488","display_name":"Actuator","level":2,"score":0.8862154483795166},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7814897894859314},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.7075304388999939},{"id":"https://openalex.org/C2777383481","wikidata":"https://www.wikidata.org/wiki/Q5194858","display_name":"Curling","level":2,"score":0.7025170922279358},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6862990260124207},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.6326680779457092},{"id":"https://openalex.org/C199631012","wikidata":"https://www.wikidata.org/wiki/Q205034","display_name":"Perpendicular","level":2,"score":0.5908347368240356},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.48741987347602844},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.481008380651474},{"id":"https://openalex.org/C17825722","wikidata":"https://www.wikidata.org/wiki/Q17285","display_name":"Plane (geometry)","level":2,"score":0.4155104160308838},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3948465585708618},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.3868778944015503},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.2126721441745758},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1819218397140503},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16249367594718933},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.06402111053466797},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/nems.2010.5592176","is_oa":false,"landing_page_url":"https://doi.org/10.1109/nems.2010.5592176","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.5699999928474426}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W2006661488","https://openalex.org/W2015883180","https://openalex.org/W2028771680","https://openalex.org/W2044834708","https://openalex.org/W2062312088","https://openalex.org/W2122965516","https://openalex.org/W2130271999","https://openalex.org/W2133906384","https://openalex.org/W2533816651","https://openalex.org/W6666254737","https://openalex.org/W6728021102"],"related_works":["https://openalex.org/W146737111","https://openalex.org/W2006227440","https://openalex.org/W124858120","https://openalex.org/W1971325567","https://openalex.org/W4380490098","https://openalex.org/W592517291","https://openalex.org/W2099751063","https://openalex.org/W2081786639","https://openalex.org/W2004405879","https://openalex.org/W2354115860"],"abstract_inverted_index":{"In":[0],"this":[1,60],"paper,":[2],"we":[3],"report":[4],"the":[5,23,53,74,80,89,93,97,105,108],"design,":[6],"simulation":[7,71,87],"and":[8,31,79,111],"optimization":[9],"of":[10,21,67,99,107],"a":[11,32,43,56],"novel":[12],"polymeric":[13],"out-of-plane":[14,49],"electro-thermal":[15,18,81],"micro-actuator.":[16],"The":[17,37,86],"micro-actuator":[19],"consists":[20],"tri-layers:":[22],"passive":[24,112],"Ni":[25,35,113],"layer,":[26],"an":[27,48],"expanding":[28],"SU-8":[29,101],"layer":[30,102,110,114],"curling":[33],"S-shaped":[34],"heater.":[36],"tri-layer":[38],"actuator":[39,90],"is":[40,63,77,103],"accompanied":[41],"with":[42,72],"suspended":[44],"structure":[45,76],"to":[46,52],"produce":[47],"movement":[50],"perpendicular":[51],"substrate,":[54],"under":[55],"pulse":[57],"current.":[58],"Firstly,":[59],"proposed":[61],"device":[62],"advanced.":[64],"By":[65],"means":[66],"FEA":[68],"(finite":[69],"element":[70],"ANSYS\u2122),":[73],"geometric":[75],"optimized":[78],"capabilities":[82],"are":[83,115],"determined":[84],"theoretically.":[85],"shows":[88],"can":[91],"obtain":[92],"best":[94],"capabilities,":[95],"when":[96],"thickness":[98],"actuating":[100],"12\u03bcm;":[104],"thicknesses":[106],"heating":[109],"all":[116],"4\u03bcm.":[117]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2014,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}